专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010211179A Photoelectric composite wiring module and method for manufacturing the same 审中-公开
标题翻译：光电复合接线模块及其制造方法
公开(公告)号：JP2010211179A
公开(公告)日：2010-09-24
申请号：JP2009233978
申请日：2009-10-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUSHIMA NAOKI , NAKAJO TOKUO , MATSUOKA YASUNOBU , SUGAWARA TOSHIKI , MINAGAWA MADOKA , HAMAMURA SAORI , KANEKO SATOSHI , KONO TSUTOMU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13 , H01S5/022
CPC分类号： G02B6/4214 , H05K1/0274 , H05K1/185 , H05K3/4602 , H05K3/4644
摘要： PROBLEM TO BE SOLVED: To provide an photoelectric composite wiring module excellent in both performance and mass productivity, wherein the module is enhanced in transfer rate per channel while preventing increase in power consumption by connecting a drive circuit or amplifier circuit LSI of optical elements to electric wiring of the optical elements by a thin film wiring layer in a short distance, and is easy to assemble with high reliability since it adopts an easy connecting system to a transfer device such as a connector and conventional mounting of LSI; and to provide a transfer device using the same. SOLUTION: The photoelectric composite wiring module includes: optical elements 2a and 2b disposed on a first circuit board 1 so as to be optically coupled with an optical waveguide 11 formed on the first circuit board 1; an electric wiring layer 3 laminated on the upper layer of the optical elements, so that the electrodes of the optical elements are electrically connected to wires of the electric wiring layer 3; and an LSI mounted on and electrically connected to the electric wiring layer 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供性能和质量生产率优异的光电复合布线模块，其中模块通过连接驱动电路或光放大器电路LSI来防止电力消耗的增加，每个通道的传输速率提高元件通过薄膜布线层在短距离内的电气布线，并且由于采用容易的连接系统到诸如连接器的传输装置和LSI的常规安装，因此易于组装具有高可靠性; 并提供使用其的传送装置。光电复合布线模块包括：设置在第一电路板1上以与形成在第一电路板1上的光波导11光学耦合的光学元件2a和2b; 层叠在光学元件的上层的电布线层3，使得光学元件的电极电连接到电布线层3的导线; 和安装在电连接层3上并与其电连接的LSI。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2001007574A ELECTRONIC APPARATUS 失效
公开(公告)号：JP2001007574A
公开(公告)日：2001-01-12
申请号：JP17293799
申请日：1999-06-18
申请人： HITACHI LTD
发明人： KONO TSUTOMU , IIDA MAKOTO , NAKAMURA SHOZO , KURAMOTO HIROKI , NAKAGAWA TAKESHI
IPC分类号： H05K7/14 , B29C45/14
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus in which deformation such as warpage is difficult to form and which has structure proper to recycling treatment. SOLUTION: A plurality of lower holes 1a, 1b are bored to a metal plate 1 as the framework of the box body of the electronic apparatus, and hooks 2a, 2b integrally molded on the backside of a molding part 2 as the external facing of the box body are installed to each of the lower holes one by one. The lower hole 1b at a center constrains the movement of the hook 2b in an xy plane. Sliding regions for moving the hooks 2a in the direction (the direct towards the fixed hook 2b) towards the center of the mold shrinkage of the molding part 2 are ensured in other lower holes 1a. A boss hole 2c for a mounting screw is formed to the head section of at least one sliding hook 2a. A screw for fixing a part housed in the box body is fitted into the boss hole 2c.

3. 发明专利

JP2000246419A FORMING DIE AND FORMING METHOD 失效
公开(公告)号：JP2000246419A
公开(公告)日：2000-09-12
申请号：JP4758599
申请日：1999-02-25
申请人： HITACHI LTD
发明人： KURAMOTO HIROKI , IIDA MAKOTO , TAKASU KEIJI , KONO TSUTOMU , OGAWA MASAKAZU , NAKAMURA SHOZO , EBINUMA NAOTAKE , YAMADA MASAYUKI
IPC分类号： B22D17/22
摘要： PROBLEM TO BE SOLVED: To prevent the development of unfilled part and casting flash, to uniformize cooling speed at a thin part and a thick part and to prevent the warping deformation and the lowering of strength by securing the fluidity of the molten metal or alloy in the zone at far distance from the thin part or a gate when the molten metal or alloy is injection-filled or cast into the cavity in a die. SOLUTION: On the cavity surface in the thin part, a heat insulating part or a heat insulating layer 8, 8' is arranged or in the cavity surface in the die for uniformizing the cooling speed, the heat insulating part or the heat insulating layer is arranged, and the thickness of the heat insulating part or the heat insulating layer at the thin part 6 in the cavity is thickened and the thickness thereof at the thick part 7 in the cavity is thinned. Further, the heat insulating part or the heat insulating layer is arranged on the cavity surface in the die and the farther distance from the gate is, the thicker the thickness of the heat insulating part or the heat insulating layer is.

4. 发明专利

JPH10221575A MANUFACTURE OF OPTICAL MODULE 失效
公开(公告)号：JPH10221575A
公开(公告)日：1998-08-21
申请号：JP2780997
申请日：1997-02-12
申请人： HITACHI LTD
发明人： KONO TSUTOMU , KATO TAKESHI , ISHII TOSHIAKI , FUKUDA KAZUYUKI , ISHIKAWA TADAAKI
IPC分类号： G02B6/42 , H01L21/56 , H01S5/00 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To manufacture an optical module without damage and at low cost, by molding a pig-tail-type optical module. SOLUTION: This manufacturing method consists of two processes: one process is to fix an optical element, a lead frame, and an optical fiber on a board 12 and to cover an optical connection part of the optical element and the optical fiber with resin to produce a component, and another process is to sandwich the lead frame of the component and a part of a fiber jacket 5 covering the optical fiber between an upper die and a lower die 10 for molding such that there are cavity 21 covering the board 12, and to inject thermosetting resin into the cavity to form a package. Heat insulators 17, 23 which cover the fiber jacket are arranged between the fiber jacket 5 and the dies 10 so that the dies 10 do not contact with the fiber jacket 5.

5. 发明专利

JPH10200155A OPTICAL MODULE 失效
公开(公告)号：JPH10200155A
公开(公告)日：1998-07-31
申请号：JP360197
申请日：1997-01-13
申请人： HITACHI LTD
发明人： ISHII TOSHIAKI , EGUCHI KUNIYUKI , KATO TAKESHI , KONO TSUTOMU , FUKUDA KAZUYUKI , ISHIKAWA TADAAKI , MIURA TOSHIMASA
IPC分类号： H01L23/28 , G02B6/42 , H01L21/56 , H01L21/60 , H01L23/50 , H01L31/02 , H01L31/12 , H01S5/00 , H01S3/18
摘要： PROBLEM TO BE SOLVED: To obtain an optical module excellent in the optical coupling properties and package moldability by bonding a lead frame and a substrate electrically through a gold wire and setting the overall loop height of the gold wire within a specific range. SOLUTION: When the optical fiber part is clamped by dies, a positional shift takes place between the die clamp part and the fiber part due to dimensional accuracy of the die, mounting positional shift on a board 1, mounting shift of a fiber component, and the like, and the board 1 coupled with the fiber is displaced slightly. If L=h1 /h2 is 0.03 or less, the length of a gold wire becomes shorter than the displacement of board determined by the dimensional accuracy of the member and the gold wire 2 is broken. When the L is too long, the wire is waved by the fluid pressure of a thermosetting resin composition at the time of low pressure transfer molding to cause short circuit or breakage of wire, so that L must be 0.5 or less. Consequently, the L must be set in the range of 0.03 and 0.5.

6. 发明专利

JPH07113927A OPTICAL PARALLEL MODULE 失效
公开(公告)号：JPH07113927A
公开(公告)日：1995-05-02
申请号：JP25799893
申请日：1993-10-15
申请人： HITACHI LTD
发明人： TAKAYAMA KAZUTOSHI , MOGI SACHIHIRO , KANEKO SATOSHI , KONO TSUTOMU , KITO SHIGEFUMI
IPC分类号： G02B6/42
摘要： PURPOSE:To uniformly obtain the light outputs of the optical parallel module over a wide temp. range. CONSTITUTION:Constituting members including plural pieces of optical elements formed to an array form having an optical transmission relation, an optical lens array 2 and a ferrule 3 for protecting an optical fiber array 4 are so selected that the coeffts. of thermal expansion increase in order of arrangement. Then, the coeffts. of thermal expansion of materials increase in order of the arrangement, i.e. the optical element array 1, the optical lens array 2 and the ferrule 3 protecting the optical fiber array 4 and, therefore, a laser beam successively spreading in an outer channel direction by thermal expansion as temp. rises is easily taken into the optical lenses and fibers and alignment is executed with high accuracy if a semiconductor laser array (LD array) is used for, for example, the optical element array 1 and, therefore, the sufficient light outputs of the optical parallel module are uniformly obtd. over the wide temp. range.

7. 发明专利

JPH06331858A MODULE 失效
公开(公告)号：JPH06331858A
公开(公告)日：1994-12-02
申请号：JP12111193
申请日：1993-05-24
申请人： HITACHI LTD
发明人： KITO SHIGEFUMI , MOGI SACHIHIRO , KANEKO SATOSHI , KONO TSUTOMU , TAKAYAMA KAZUTOSHI
IPC分类号： G02B6/42
摘要： PURPOSE:To reduce the occupancy area of radiation fins on a substrate and to provide a compact optical module equipped with radiation fins by holing the substrate to be packaged with a module, inserting the module to this hole and attaching radiation fins on and under the module. CONSTITUTION:An optical module 1 having an IC and a light emitting or receiving element which generate heat is provided with tapped holes for attaching of radiation fins for the purpose of providing radiation fins 2, which sufficiently radiate the heat from the heating bodies, on and under the optical module. The optical module 1 is provided with an attaching part 4 to the substrate, and the attaching part 4 is provided with tapped holes. Radiation fins 2 are provided with tapped holes for attaching to the optical module 1, and radiation fins 2 having the optical module size are fixed to the optical module. Consequently, it is possible to have the radiation face on both faces of a module attaching substrate 3. Thus, the height of mounting is increased twice, and radiation fins can have sufficient height.

8. 发明专利

JP2013248770A Resin pressurization casting device and pressurization casting method 有权
标题翻译：树脂加压铸造装置和加压铸造方法
公开(公告)号：JP2013248770A
公开(公告)日：2013-12-12
申请号：JP2012123915
申请日：2012-05-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKATSUCHI HIROKI , KONO TSUTOMU , MINO MASAYUKI , TSUCHIYA KENJI
IPC分类号： B29C39/44 , B29C39/24
摘要： PROBLEM TO BE SOLVED: To provide a resin pressurization casting device capable of adjusting pressure in a resin tank to become a target casing speed database selected by CAE or the like by obtaining loss including pipe resistance and resin viscosity change by measuring a pressure difference and a flow rate while passing the pipe from the resin tank for storing resin and a mold.SOLUTION: A resin pressurization casting device includes: a resin tank 1; a pipe 4 connecting the resin tank 1 and a mold 8; a flow rate measuring sensor 5 for measuring a resin amount; a resin pressurization sensor 6 for measuring a resin pressure; a target casting speed database 9; and a casting speed control part 10 that stores a measurement value of the flow rate measuring sensor 5, a measurement value of the resin pressurization sensor 6, and pressurization force data of the resin tank 1, obtains a loss coefficient caused by pipe resistance of the pipe 4, controls the pressurization force of the next step to the resin tank 1 and controls the speed of casting of the resin into the mold 8 based on the loss coefficient and information stored in the target casting speed database 9.
摘要翻译：要解决的问题：提供一种树脂加压铸造装置，其能够通过获得由CAE等选择的目标套管速度数据库来调节树脂罐中的压力，通过测量压力差来获得包括管阻和树脂粘度变化的损失，并且流过树脂加压铸造装置的树脂储罐1的树脂加压铸造装置。连接树脂箱1和模具8的管道4; 用于测量树脂量的流量测量传感器5; 用于测量树脂压力的树脂加压传感器6; 目标投射速度数据库9; 以及存储流量测量传感器5的测量值，树脂加压传感器6的测量值和树脂箱1的加压力数据的铸造速度控制部10，获得由管道阻力引起的损失系数管4将下一个步骤的加压力控制到树脂罐1，并且基于存储在目标铸造速度数据库9中的损失系数和信息来控制树脂进入模具8的速度。

9. 发明专利

JP2012101448A Calculation method and analysis program of shrinkage strain 有权
标题翻译：收缩应变的计算方法和分析程序
公开(公告)号：JP2012101448A
公开(公告)日：2012-05-31
申请号：JP2010252020
申请日：2010-11-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO TSUTOMU , MORITA AYUMI , MINO MASAYUKI , NAKATSUCHI HIROKI , OKANO TAKUYA , KOBAYASHI MASAHITO
IPC分类号： B29C45/76 , B29K101/10
摘要： PROBLEM TO BE SOLVED: To provide a calculation method of shrinkage strain by which the shrinkage strain of a resin is predicted in consideration of temperature history and the resin pressure of a thermosetting resin filled in a mold.SOLUTION: In the calculation method of the shrinkage strain, the resin shrinkage strain of the thermosetting resin is previously stored in a recording device as a formula of the shrinkage strain which includes the change of the reaction rate of the resin material, the change of the resin temperature and the resin pressure. The equation of continuity, Navier-Stokes equations and energy conservation equation are arithmetically operated by analysis system based on a 3-dimensional solid element decomposition-processed based on the shape of a space where the resin is filled and the content including the shrinkage strain of the thermosetting resin based on the formula of the shrinkage strain which is stored in the recording device is output.
摘要翻译：要解决的问题：提供考虑到温度历史和填充在模具中的热固性树脂的树脂压力来预测树脂的收缩应变的收缩应变的计算方法。解决方案：在收缩应变的计算方法中，将热固性树脂的树脂收缩应变预先存储在记录装置中，作为收缩应变的公式，其包括树脂材料的反应速率的变化，树脂温度和树脂压力的变化。连续性方程，Navier-Stokes方程和能量守恒方程由基于分解系统的分析系统运算，该三维固体元素基于填充树脂的空间的形状和含有收缩应变的含量进行分解处理输出基于存储在记录装置中的收缩应变式的热固性树脂。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011103089A Estimation method of void volume change produced in resin filled in porous body, and flow analysis method of resin material in porous body 有权
标题翻译：多孔体内填充的树脂中产生的无效体积变化的估计方法以及多孔体内树脂材料的流动分析方法
公开(公告)号：JP2011103089A
公开(公告)日：2011-05-26
申请号：JP2009258364
申请日：2009-11-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO TSUTOMU , NAKATSUCHI HIROKI , SUZUKI KEIJI , ONODA MITSURU , GOTO KAZUO , KAGEYAMA YASUAKI , KOJIMA KEIMEI , IKEDA KENJI , MOROOKA HISASHI
IPC分类号： G06F17/50 , B29C45/73 , B29C45/78 , B29K105/04
CPC分类号： G06F17/5018 , G06F2217/16 , G06F2217/41
摘要： PROBLEM TO BE SOLVED: To prevent dielectric breakdown by the selection of a condition to prevent a void using analysis.
SOLUTION: In regard to a temporal change of a gas production amount or the number of mols when a solid member is heated, a database is experimentally structured in advance. By use of a gas production amount from the member and a ratio of specific heat of gas as inputs for analysis, the condition to prevent the void is selected by the analysis and the estimation of the void to be produced in a resin, when the solid member is heated.
COPYRIGHT: (C)2011,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式