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    • 1. 发明专利
    • MANUFACTURING METHOD AND APPARATUS OF SEMICONDUCTOR
    • JP2002280362A
    • 2002-09-27
    • JP2001077522
    • 2001-03-19
    • HITACHI LTDHITACHI TOKYO ELECTRONICS
    • KAWADA HIROKIKANZAKI NAOTOKITSUNAI HIROYUKI
    • H01L21/28H01L21/302H01L21/3065H01L21/3213
    • PROBLEM TO BE SOLVED: To provide the manufacturing device of a semiconductor, capable of accurately calibrating the sensitivity fluctuations of manometer by pressure fluctuation, measuring accurate pressure in various pressure ranges and performing a manufacturing processing. SOLUTION: At periodical inspections, the inside of the manometer 106 and a processing chamber 102 is evacuated and turned to a high vacuum state which is equal to or below the measurement sensitivity of the manometer 106. The zero point of the manometer 106 is corrected, a valve 101 is opened and an inactive gas is introduced to the processing chamber 100. The pressure is measured by the monometer 106, and introduction of 12 Pa is performed. The valve 101 or the like is closed, the processing chamber 102 is evacuated to the high-vacuum state and the valve 105 is closed completely. Then, the valve 107 is opened and the gas sealed inside the manometer is discharged into the processing chamber 102. The pressure at the time is measured by the manometer 106, and a sensitivity degradation coefficient k in a prescribed calibration formula is calculated from the volume or the like of the processing chamber 102 and a measured value. The measured value to be sent from the manometer 106 to a system controller 110 is calibrated by using the prescribed calibration formula, the value is defined as a true value and the pressure inside the processing chamber 102 is controlled.
    • 2. 发明专利
    • METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • JP2000269182A
    • 2000-09-29
    • JP7050699
    • 1999-03-16
    • HITACHI LTD
    • KAWADA HIROKIKITSUNAI HIROYUKIYAMANE MIYUKISUZUKI SHINICHIKATSUYAMA MASANORI
    • H01L21/302H01L21/3065
    • PROBLEM TO BE SOLVED: To realize a manufacturing apparatus of semiconductor devices which enables analysis of state of gas adsorbed on the surfaces inside a dry etching device, without having to open to the air, and removal of adsorbed substances before release into the air. SOLUTION: An impinging gas analysis device 102 is fitted to the lateral side of a treatment chamber 101, and gas or the like is sampled. A sample 103 for inspecting the state of adsorption of the gas being provided in the treating chamber 101, infrared light from an infrared light introducing window 104 is irradiated on the sample 103 to measure a reflection-absorption spectrum, and thereby the state of an adsorbed residual gas in the treating chamber 101 is monitored. Microwave from a microwave introducing tube 107 generates a plasma, and thereby the surface of a wafer 105 is etched. The infrared light reflected on the sample 103 is detected by a detector or the like, and the analyzing device 102 executes mass analysis or the like of gas molecules or the like. Detailed information is obtained in a process, without having to open the treating chamber to the air, and a method for preventing generation of poisonous gas after the opening to the air can be found out easily without superfluous trial and errors.
    • 7. 发明专利
    • Pattern inspection method
    • 模式检验方法
    • JP2008116472A
    • 2008-05-22
    • JP2008000391
    • 2008-01-07
    • Hitachi High-Technologies CorpHitachi Ltd株式会社日立ハイテクノロジーズ株式会社日立製作所
    • YAMAGUCHI ATSUKOFUKUDA HIROSHITSUCHIYA RYUTAKAWADA HIROKIYONEDA SHOZO
    • G01B15/00H01L21/66
    • PROBLEM TO BE SOLVED: To provide a pattern inspection method for inspecting a pattern by extracting an edge shape of the pattern from an image acquired by a scanning microscope, and by predicting an electric performance of a device from the extracted information. SOLUTION: The intensity distribution of reflected electrons or secondary electrons 1609 is processed in a control part 1611 of the scanning electron microscope and an inspection computer 1612, and the distribution of the gate length in a single gate is determined from the data of the edge position. A transistor performance is predicted by regarding a transistor produced finally as parallel connection of a plurality of transistors having various gate lengths, and the quality or the grade of the pattern is determined based on the prediction results. Hereby, the effect on a device performance of edge roughness can be predicted quickly and highly accurately, and the pattern inspection can be performed efficiently and highly accurately corresponding to a device specification. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种用于通过从由扫描显微镜获取的图像中提取图案的边缘形状并通过从提取的信息预测装置的电性能来检查图案的图案检查方法。 解决方案:反射电子或二次电子1609的强度分布在扫描电子显微镜的控制部分1611和检查计算机1612中进行处理,并且从单个栅极中的栅极长度的分布由 边缘位置。 通过将最终产生的晶体管作为具有各种栅极长度的多个晶体管的并联产生来预测晶体管性能,并且基于预测结果确定图案的质量或等级。 因此,可以快速,高精度地预测对边缘粗糙度的器件性能的影响,并且可以根据器件规格高效且高精度地执行图案检查。 版权所有(C)2008,JPO&INPIT