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    • 3. 发明专利
    • LITHOGRAPHY SYSTEM
    • JP2001135562A
    • 2001-05-18
    • JP31473999
    • 1999-11-05
    • HITACHI LTD
    • WATABE SHIGEOMIYAKE AKIRAKOIDE AKIRAKONO AKIOMI
    • H01L21/027G02B26/08G03F1/00G03F1/68G03F7/20
    • PROBLEM TO BE SOLVED: To solve a problem of a conventional lithography system that a plurality of masks or reticles are aligned while being replaced when a plurality of patterns are exposure recorded while being superposed on a wafer and thereby the yield decreases due to superposition accuracy of the patterns to cause lowering of throughput of exposure recording. SOLUTION: In place of a reticle or a mask written over a plurality of sheets, one or a plurality of reflection spatial optical modulation elements indicating a brightness pattern equivalent to the pattern written on each reticle or mask is arranged. Selective reflection surface of the spatial optical modulation element is irradiated with light from the light source of a lithography system and the numerical aperture of irradiating light is matched with that of a projection lens for the reflection spatial optical modulation element. Furthermore, variation with time of the brightness pattern indicated by the reflection spatial optical modulation element is synchronized with the movement of a silicon wafer with regard to the conjugate ratio of the pattern on the silicon wafer and the projection lens.
    • 4. 发明专利
    • MICROPUMP AND MANUFACTURE THEREOF
    • JP2000154783A
    • 2000-06-06
    • JP32475998
    • 1998-11-16
    • HITACHI LTD
    • SASAKI YASUHIKOYOSHIMURA YASUHIROKOIDE AKIRAMIYAKE AKIRAWATABE SHIGEOTERAYAMA TAKAOMIMAKI HIROSHIISHIDA YASUHIKOMORIOKA TOMONARI
    • B81C3/00F04B43/04
    • PROBLEM TO BE SOLVED: To miniaturize a micropump and to prevent a chemical reaction of each member and a working fluid by opposing and overlapping surfaces to be jointed in vacuum or inactive atmosphere and pressurizing and joining the surfaces to be joined after a member forming the micropump is made as a silicon substrate, metallic films are formed on the whole of surfaces to be joined sides and the silicon substrate and the metallic films are cleaned. SOLUTION: In each substrate forming a micropump, monocrystal silicon is made as a base material. After etching working is performed for a chamber and valve substrates 20, 30 at first and thermal oxidation films are formed on the whole surface of each substrate, metallic films are formed on the whole of surfaces to be joined of both substrates and surfaces to be joined are formed. Subsequently, after Ar plasma is irradiated in vacuum, continuously opposed surfaces are opposed in vacuum and joining and positioning are performed, the surfaces are overlapped and the surfaces are joined by heating and pressurizing. Next, metallic films are formed on the whole of each surface to be joined of this joining body and a nozzle substrate 40, surfaces to be joined are formed, surfaces to be joined are joined in the same procedure, metallic films are formed on the whole of each surface to be joined side of this joining body and a diaphragm substrate 10 and surfaces to be joined are joined in the same procedure.
    • 6. 发明专利
    • ELECTROSTATIC CAPACITY TYPE ACCELERATION SENSOR
    • JPH09318656A
    • 1997-12-12
    • JP13796996
    • 1996-05-31
    • HITACHI LTD
    • KOIDE AKIRAKANAMARU MASATOSHISUZUKI KIYOMITSUHORIE JUNICHI
    • G01P15/125
    • PROBLEM TO BE SOLVED: To provide a small-sized acceleration sensor having a large absolute value of electrostatic capacity and a small detection error by providing a hole section on a moving electrode in the direction perpendicular to the displacing direction, and arranging fixed electrodes in it in the direction perpendicular to the displacing direction of the moving electrode. SOLUTION: A first fixed electrode 3, a second fixed electrode 4, and a moving electrode 5 are stored in the sealed space formed with an upper base plate 1A, a frame body 2, and a lower base plate 1B, and these electrodes are made of an SOI wafer to widen their electrode areas. Acceleration is obtained from the difference between the electrostatic capacity C1 of a first capacitor formed with the electrodes 5, 3 and the electrostatic capacity C2 of a second capacitor formed with the electrodes 5, 4, and the change of the electrostatic capacity caused by the twist or the like of the moving electrode 5 is offset. A conductive thin film is formed on the upper base plate 1A, many electrodes are electrically integrated, and a stopper regulating the moving range of the moving electrode 5 is provided in a sealed container or thin insulating films are provided on the surfaces of the electrodes as short circuit preventing measures.