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    • 2. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JP2001332967A
    • 2001-11-30
    • JP2000149174
    • 2000-05-22
    • HITACHI LTD
    • MITSUMOTO KINYAKATO MASATAKA
    • G11C11/413G11C11/417H03K5/08H03K19/0175
    • PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device, equipped with an input circuit by which the amplitude of an output signal, is stabilized even at a low voltage. SOLUTION: This device is provided with a resistance means for forming an operating current in the differential form of a first transistor, through which an input signal is supplied to a control input terminal, and a second transistor through which a reference voltage is supplied to a control input terminal, and a variable resistance means through which the voltage of the output node of the first or second transistor is supplied to a control terminal and which is connected serially to the resistance means. Then, the resistance of the variable resistance means at the time of turning on the first transistor is set relatively large, in comparison with the resistance of the variable resistor means at the time of turning on the second transistor, and change of the current to flow to the resistance means is reduced in comparison to change of the input signal. Thus, an output signal amplitude and a DC level are made almost equal to the change of the input signal.
    • 4. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JP2000124315A
    • 2000-04-28
    • JP29069198
    • 1998-10-13
    • HITACHI LTD
    • KATO MASATAKA
    • H01L21/82
    • PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit device that can save a nonconforming product and changed into a conforming one. SOLUTION: A semiconductor integrated circuit device is a logic rewritable programmable LSI consisting of an FPGA(field programmable gate array) and is constituted of a plurality of control logic blocks CLB, a plurality of I/O blocks I/O, and a wiring region LA for connecting the control logic and the I/O blocks. In the wiring region LA, a MOS transistor is provided for the MOS transistor logically to connect the control logic block CLB and to logically disconnect the control logic block CLB of a nonconforming part based on the classification of a nonconforming pattern estimated in advance. When the nonconforming part exists at a part as in the case where the nonconforming part exists in a those odd rows, the MOS transistor is turned off, and the odd column, odd row, even column, even row, or the surface of the control logic block CLB arranged in a lattice shape in addition to the control logic block CLB of the nonconforming part is disconnected, so as to the control logic block CLB of the nonconforming part from being seen from the outside.
    • 5. 发明专利
    • NONVOLATILE SEMICONDUCTOR MEMORY
    • JPH10241381A
    • 1998-09-11
    • JP4673098
    • 1998-02-27
    • HITACHI LTD
    • TANAKA TOSHIHIROKATO MASATAKAADACHI TETSUO
    • G11C16/02
    • PROBLEM TO BE SOLVED: To suppress distribution of threshold voltages of memory cells and to diminish a difference between writing and erasing threshold voltages so as to enhance the number of rewriting times by rewriting a rewritten data posterior to its rewriting operation and after its verification and performing rewriting operation with this data. SOLUTION: Plural nonvolatile semiconductor memory cells are connected with their control gates in common to word lines W1-Wm, and are connected with their drains in common to bit lines B1 and B2 and also with sources in common to a source line respectively. When writing operation is performed on these memory cells, only insufficient written memory cells are controlled to be continued to be written. Then, when erasing operation is performed on these memory cells, only insufficient erased memory cells are controlled to be continued to be erased. Consequently, distribution of the threshold voltages of the memory cells corresponding to two bits of stored information is suppressed to enhance their rewriting bearability.
    • 7. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
    • JPH10107164A
    • 1998-04-24
    • JP25818896
    • 1996-09-30
    • HITACHI LTD
    • OKAZAKI TSUTOMUKATO MASATAKAIKEDA YOSHIHIROADACHI TETSUOTSUCHIYA OSAMU
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • PROBLEM TO BE SOLVED: To microminiaturize a nonvolatile memory element and to enhance the integration degree of a flash memory by a method wherein, when a thermal-oxidation insulating film is formed, the rolling-up, of a sidewall insulating film, which is generated owing to the growth of the thermal-oxidation insulating film, is eliminated. SOLUTION: A field insulating film 2 which prescribes the length in the gate length direction of an active region on the main face of a p-type semiconductor substrate 1 is formed in a nonactive region on the main face of the p-type semiconductor substrate, and a gate insulating film 3 is formed in the active region on the main face of the p-type semiconductor substrate 1. A gate material 4 which is formed of a polycrystal silicon film, whose surface at the upper part is covered with an oxidation preventive film and whose length in the gate length direction of the gate insulating film 3 is regulated is formed on the surface in the center in the gate length direction. Sidewall insulating films 5B which are formed along the thickness direction of the gate material 4 and which are formed of a silicon nitride film are formed on surfaces of two sidewall faces which are faced with each other in the gate length direction of the gate material 4. One pair of thermally oxidized insulating films 10 are formed between the field insulating film 2 and sidewall spacers 8.
    • 9. 发明专利
    • MANUFACTURE OF NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    • JPH07273231A
    • 1995-10-20
    • JP6238694
    • 1994-03-31
    • HITACHI LTD
    • KATO MASATAKAADACHI TETSUOKUME HITOSHIYADORI SHOJI
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • PURPOSE:To prevent a non-volatile semiconductor memory device from deteriorating in electron injection and discharge characteristic between a floating gate and a channel by a method wherein the upside and side face of a polysilicon layer over a gate insulating film are covered with an insulating film such as a nitride film or an oxide film while an element isolating insulating film is formed. CONSTITUTION:A gate oxide film 12 and a first polysilicon layer 13 are formed on the surface of a P-type semiconductor substrate 1, and a first insulating film composed of a deposit oxide film 14 and a nitride film 15 is formed. These layers are patterned into stripe-like lines in row, and second insulating films 16 and 17 are formed on the side walls of the lines in row. An element isolating insulating film 18 is formed on a surface of the P-type semiconductor substrate 1 which is not covered with the first insulating films 14 and 15 and the second insulating films 16 and 17. A second polysilicon layer 22 is deposited, and the second polysilicon layer 22 and the first polysilicon layer 13 are patterned into lines in column vertical to the lines in row. By this setup, a gate oxide film is kept uniform in thickness, and a non-volatile semiconductor memory device of this constitution can be prevented from varying in electron injection characteristics.