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    • 1. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
    • JPH0982806A
    • 1997-03-28
    • JP23793995
    • 1995-09-18
    • HITACHI LTD
    • HONMA KENJIOMORI SOHEITANBA NOBUO
    • G01R31/302H01L21/3205H01L21/66H01L21/82H01L21/822H01L23/52H01L27/04
    • PROBLEM TO BE SOLVED: To give a decision whether a power source wiring system is defective or non-defective during a wiring formation process, and to correct the defective part of the power source wiring from the result of said decision by a method wherein the power source wiring is inspected by an electron beam tester during the wiring forming process of a semiconductor integrated circuit device. SOLUTION: A power source wiring block 7, consisting of a plurality of power source wirings 8a, 8a1 , 8a2 , 8b, 8b1 and 8b2 , is formed on a part of the prescribed wiring layer on a semiconductor substrate. Subsequently, power feeding blocks P1 and P2 are brought into contact with the power feeding pats 8P1 and 8P2 of the power source wiring block 7. An electron beam is swept over with a prescribed voltage applied to the power source wirings 8a and 8b from the power feeding probes P1 and P2 through the power feeding pats 8P1 and 8P2 , the secondary electron, radiated from the power source wiring block 7, is detected by a secondary electron detector, and the short circuit of the power source is checked. When a defect is discovered, the reclaimability of the short-circuited part is examined and when it is reclaimable, a reclamation treatment is conducted after the inspection on the power source wiring block 7 has been finished.
    • 2. 发明专利
    • PROGRAMMABLE TWO-WIRE TWO-PHASE SYSTEM LOGIC ARRAY
    • JPH0897710A
    • 1996-04-12
    • JP25880994
    • 1994-09-28
    • HITACHI LTD
    • MASAKI AKIRAKUWATA MAKOTOSATOMURA RYUICHITANBA NOBUO
    • G06F7/00H01L21/82H03K19/173H03K19/177
    • PURPOSE: To realize the logic array by which a 2-wire 2-phase system practical circuit configuration is promoted by providing a memory cell whose writing is made electrically or as a process and providing a function output corresponding to one or plural input signals to the array. CONSTITUTION: A contact (memory cell) is provided selectively to each cross point between each function row output and each of 2-wire 2-phase system input signal wire pairs I1+ , 11- -In+ , In- among input and output wires corresponding to an AND function. For example, a contact is provided to three input signal wires I1+ , I2+ and In- of a 1st function output row. In order that a function output from the three input signal wires 11+ , I2+ and In- is obtained, a contact is respectively provided to a cross point of a code word state detection row corresponding to the three input signal wires with respect to wires for state detection signals C1, C2 and Cn corresponding to the three input wires. According to the means, the 2-wire 2-phase system logic array is directly realized by the same method as a PLA (programmable logic array) without conversion into a 2-wire 2-phase system logic circuit after circuit design different from a conventional array.
    • 6. 发明专利
    • JPH05307897A
    • 1993-11-19
    • JP13982192
    • 1992-05-01
    • HITACHI LTD
    • TANBA NOBUOOBAYASHI MASAYUKIHIRAMOTO TOSHIRO
    • G11C29/00G11C29/04H01L27/10
    • PURPOSE:To maintain the high speed of operation regardless of the presence of defect saving by using a MOBFET and switching the transfer path of an address signal with a redundant signal and outputting a defect signal with an auxiliary circuit. CONSTITUTION:The redundant signal is supplied to the gate of a P channel type MOSFET QP through an N channel type MOSFET QN and an inverter circuit IV. Then, when the redundant signal is a high level, both transistors QN and QP are turned on and when a low level, turned off. In such a case, in the state of cutting a fuse, the redundant signal becomes the low level and the transistor QP1 is turned off and an inout signal ELC1 is not transferred to an output terminal OUT1. At this time, the transistor QP2 is turned on and the input signal ELC2 is outputted to the output terminal OUT2. Then the defect circuit having the redundant signal is switched to the corresponding auxiliary circuit and the high speed of operation is maintained since the number of logic stage is made equal regardless of the presence of the defect saving.
    • 9. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH03205869A
    • 1991-09-09
    • JP69090
    • 1990-01-08
    • HITACHI LTD
    • TANBA NOBUO
    • H01L27/11H01L21/8244
    • PURPOSE:To obtain a technology capable of reducing soft errors in a semiconductor integrated circuit device having SRAM by providing the top of a protruding island region spreading over the element-forming face of a semiconductor substrate with transfer MISFETs, and the side wall of the above-mentioned island region with drive MISFETs of a flip-flop circuit. CONSTITUTION:In a semiconductor integrated circuit device having SRAM constituting a memory cell by connecting transfer MISFETs QT1, QT2 to the input terminals of a flip-flop made up of drive MISFETs QD1 QD2, the top of a protruding island region 4 spreading over the element-forming face of a semiconductor substrate 11 is provided with transfer MISFETs QT1, QT2, and the side wall of the above-mentioned protruding island region 4 with drive MISFETs QD1, QD2 with source regions 2 arranged below a semiconductor region 11 that serves as the information storage node of the transfer MISFETs QT1, QT2. This design reduces the depth of a p-type well region 5 with the result that the region where electron-hole pairs occur upon passage of alpha rays decreases; therefore, soft errors caused by alpha rays can be reduced.
    • 10. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS6457650A
    • 1989-03-03
    • JP21457087
    • 1987-08-27
    • HITACHI LTD
    • UDA TAKAYUKIEMOTO YOSHIAKITANAKA TAMOTSUKURODA SHIGEOMIYAOKA SHUICHITANBA NOBUO
    • H01L23/29H01L23/31
    • PURPOSE:To prevent the soft error in a semiconductor device of salient electrode mounting system, and lengthen the connecting life of the salient electrode, by arranging a coating film for shielding alpha-ray on a semiconductor chip or a specified part of a mounting substrate surface excepting salient electrode parts. CONSTITUTION:A coating film 3 for shielding alpha-ray is arranged on a semiconductor chip 1 or a specified part of a mounting substrate surface excepting salient electrode parts 4 for face down bonding. For example, only the surface of a memory mat region 2, which is especially weak for soft error in the semiconductor chip 1 of a semiconductor device having an element in which both bipolar transistors and COMS's exist, is coated with a coating film 3 for shielding alpha-ray which is composed of polyimide resin. The part of the salient electrodes 4 composed of solder bump and the like are not coated. The semiconductor chip 1 is mounted on the mounting substrate 5 via the salient electrodes 4. As a result, difference of thermal expansion coefficient between the protruding electrodes and the resin does not exert influence upon the salient electrodes. Thereby lengthening connection of life of the salient electrode.