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    • 6. 发明专利
    • OPERATION CONTROLLER FOR MACHINE TOOL
    • JPS63256330A
    • 1988-10-24
    • JP8685687
    • 1987-04-10
    • HITACHI LTD
    • HANADA SHOJIASABUKI HIROSHIFUJI KUNIHIKOEDA MINORUSAITO YOSHIO
    • B23Q5/10B23Q5/04B23Q15/00
    • PURPOSE:To provided high accuracy working without any effects of electromagnetic vibration from an AC motor by providing a power supply for dropping voltage supplying power to the AC motor as the degree of working is heightened. CONSTITUTION:A machine tool controller 103 is constituted to store or output information about the tool selection, tool transfer position, running speed of motor and the degree of working. And a V/F change-over circuit 253 receiving the output degree of working, i.e. signal D of degree of working changes over selectively a straight line L representing the relationship between the normally selected output voltage V and the output frequency F to a straight line M. Thus, when the output frequencies F are same, the output result is reduced and the output signal is given to a voltage controlling circuit 255 such that in the normal working such as rough and medium cut working the lower output voltage is provided. Thus, in the precision working of higher degree the output voltage can be reduced to prevent the accuracy of worked surface from the degradation caused by electromagnetic vibration force and improve the quality of working.
    • 8. 发明专利
    • ETCHING DEVICE
    • JPS6381932A
    • 1988-04-12
    • JP22605886
    • 1986-09-26
    • HITACHI LTD
    • YAMAGUCHI TATSUYASAITO YOSHIO
    • C23F1/00H01L21/306
    • PURPOSE:To improve the operating efficienty of an etching device by installing an etchant mixing tank having a temperature control means at the pre-stage of a treating tank conducting etching treatment and supplying the treating tank with a temperature-controlled etchant by the mixing tank. CONSTITUTION:Water and hydrogen fluoride each weighed by a weighting tank 2 and a weighting tank 1 are introduced into a mixing tank 3. An elevating liquid temperatuer is cooled by a coil 4 for cooling by the exothermic reaction of hydrogen fluoride and water at that time, and hydrogen fluoride and water are kept at a proper temperature (23 deg.C). An etchant is exchanged as follows. The etchant in a treating tank 9 and an external vessel 10 is discharged by a discharge system, and the etchant kept at the proper temperature (23 deg.C) is induced into the treating tank 9. The etchant in the external vessel 10 is transferred to a temperature controller 12, and the etchant is brought to the proper temperature again and returned to the treating tank 9 when the etchant is not held at the proper temperature. A material to be etched is brought into contact with the etchant in the treating tank 9 for a fixed time under the state, and etched and treated.