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1. 发明专利

JP2008112754A Workpiece cutting method 有权
标题翻译：工作切割方法
公开(公告)号：JP2008112754A
公开(公告)日：2008-05-15
申请号：JP2006293082
申请日：2006-10-27
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： MURAMATSU KENICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a workpiece cutting method by which a plate-like workpiece can be surely cut along a cutting schedule line. SOLUTION: The method expands an expanding tape 23 stuck on a rear surface 21 of a workpiece 1 having a melting processing region 13 formed in its inside along the cutting schedule line, thereby cutting the workpiece 1 along the cutting schedule line using the melting processing region 13 as a start point of cutting. In this case, even if an uncut region 1a which has not been cut along the cut schedule line remains on the workpiece 1, the uncut region 1a can be cut using the melting processing region 13 as a cutting start point by placing the workpiece 1 on a placing base 201 with the interposition of an expanding tape 23 in a state where the expanding tape 23 is expanded, pressing a squeegee 26 on the workipiece 1 and relatively moving the squeegee 26. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够沿着切割进度线可靠地切割板状工件的工件切割方法。解决方案：该方法将沿着切割进度线在其内部形成有熔化处理区域13的工件1的后表面21上扩张，从而沿着切割计划行切割工件1，使用熔融处理区域13作为切割的起点。在这种情况下，即使沿着切割进度线未被切割的未切割区域1a保留在工件1上，也可以通过将工件1放置在切割开始点13上，使用熔融处理区域13切断未切割区域1a 在扩张带23膨胀的状态下插入扩张带23的放置基座201，在工件1上挤压刮板26并相对移动刮板26.版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007050410A Laser beam machining method 有权
标题翻译：激光束加工方法
公开(公告)号：JP2007050410A
公开(公告)日：2007-03-01
申请号：JP2005235037
申请日：2005-08-12
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： SAKAMOTO TSUYOSHI , MURAMATSU KENICHI
IPC分类号： B23K26/40 , B23K26/04 , B23K26/06 , B23K101/40 , H01L21/301
CPC分类号： B28D5/0011 , B23K26/0057 , B23K26/40 , B23K2201/40 , B23K2203/50 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method for preventing particles from being generated from the cut surfaces of chips obtained by cutting a silicon wafer. SOLUTION: In this laser beam machining method, an irradiation condition of a laser light L when forming reformed regions 7 7 to 7 12 is made variable for an irradiation condition of the laser light L when forming reformed regions 7 13 to 7 19 so that the spherical aberration of the laser light L in the region where the depth from the surface 3 of the silicon wafer is 335-525 μm is corrected. Therefor, even when the silicon wafer 11 and a function element layer 16 are cut into semiconductor chips by taking the reformed regions 7 1 to 7 19 as a starting point for cutting, a twist hackle is not remarkably appeared in the region of 335-525 μm in the depth and the particles are hardly generated. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于防止从通过切割硅晶片获得的切屑的切割面产生颗粒的激光束加工方法。解决方案：在该激光束加工方法中，对于照射条件，使形成重整区域7 7 至7 12 时的激光L的照射条件变化在形成重整区域7 <13> 至7 19 时激光L的球面像差，使得激光L的距离来自表面3的深度的球面像差硅晶片为335-525μm。因此，即使通过将重整区域7 1 至7 19 切割成半导体芯片作为切割起点，即使将硅晶片11和功能元件层16切割成半导体芯片，在深度为335-525μm的区域中不显着地出现扭曲，并且几乎不产生颗粒。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005001172A Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：JP2005001172A
公开(公告)日：2005-01-06
申请号：JP2003165209
申请日：2003-06-10
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： SUGIURA RYUJI , FUKUYO FUMITSUGU , MURAMATSU KENICHI , WAKUTA TOSHIMITSU
IPC分类号： B29C65/16 , H01S3/00
CPC分类号： B29C65/1635 , B29C65/1616 , B29C65/1638 , B29C65/1654 , B29C65/1664 , B29C65/1674 , B29C65/168 , B29C65/1687 , B29C66/1122 , B29C66/21 , B29C66/43 , B29C66/71 , B29C66/712 , B29C66/73366 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/8242 , B29C66/8322 , B29C66/929 , B29K2995/0026 , B29K2069/00 , B29K2067/003 , B29K2033/08 , B29K2027/06 , B29K2869/00
摘要： PROBLEM TO BE SOLVED: To provide a laser processing method capable of efficiently joining members having light transmissivity to each other. SOLUTION: A condensing point P1 is matched with the inside part 26 of first and second members 2 and 3 brought to a mutual contact state to irradiate the inside part 26 with a pulse laser beam L1. When the energy density at the condensing point P1 of the pulse laser beam L1 exceeds a predetermined threshold value, multiphoton absorption or light absorption equal thereto is caused in the inside part 26. The modifying region 27 ranging from the first member 2 to the second member 3 is formed in the inside part 26 by utilizing this light absorption to join the first member 2 and the second member 3. Since it is unnecessary to interpose a light absorbing member between two members to be joined in this laser processing method, the members 2 and 3 having light transmissivity can be efficiently joined to each other. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够高效地连接具有透光性的构件的激光加工方法。解决方案：聚光点P1与形成相互接触状态的第一和第二构件2和3的内部部分26匹配，以用脉冲激光束L1照射内部部分26。当脉冲激光束L1的聚光点P1处的能量密度超过预定阈值时，在内部26中产生与其相同的多光子吸收或光吸收。从第一部件2到第二部件 3通过利用该光吸收而形成在内部26中，从而将第一构件2和第二构件3接合。由于不需要在该激光加工方法中将吸光构件夹在两个待接合构件之间，所以构件2 和3具有透光性可以有效地接合。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2002134927A VIA HOLE FORMING EQUIPMENT OF MULTILAYER PRINTED BOARD 失效
公开(公告)号：JP2002134927A
公开(公告)日：2002-05-10
申请号：JP2000322840
申请日：2000-10-23
申请人： HAMAMATSU PHOTONICS KK
发明人： MURAMATSU KENICHI , TAKAOKA HIDEJI , KANBE KAZUYUKI , OYA TOMONORI
IPC分类号： B23K26/382 , B23K101/42 , H05K3/00 , H05K3/42 , H05K3/46 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide via hole forming equipment of a multilayer printed board which can perform forming a hole for a via hole and surface treatment of a board quickly and effectively. SOLUTION: In this via hole forming equipment 1, the board 100 is carried in a laser hole boring chamber 20, and the hole 104 for the via hole is formed by laser beam from a laser oscillation part 22. The board is carried in a corona discharge treatment chamber 30 by a conveying means 70, and a hole forming surface is irradiated with corona discharge in the chamber 30. Consequently, forming the hole of the via hole and the surface treatment of the board can be performed quickly. In the chamber 30, smear in the hole 30 can be eliminated without deteriorating the hole forming surface or the like, since each electrode member 32 constituting a first electrode 34 is covered with dielectrics 33.

5. 发明专利

JP2007167918A Laser beam machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2007167918A
公开(公告)日：2007-07-05
申请号：JP2005370608
申请日：2005-12-22
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： KUNO KOJI , MURAMATSU KENICHI , ATSUMI KAZUHIRO , OSAJIMA TETSUYA
IPC分类号： B23K26/04 , B23K26/00 , B23K26/38 , B23K26/40 , B23K101/40
CPC分类号： B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/0617 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of accurately forming a reformed region as a starting point for cutting, at a desired position inside a workpiece. SOLUTION: The laser beam machining apparatus comprises: a condensing lens 31 for condensing a machining laser beam and a distance measuring laser beam L2 toward a wafer 1; an actuator for operating the lens 31; a shaping optical system 49 for adding an astigmatism to the reflected light L3 of the distance measuring laser beam; a quadripartite photodiode 42 for receiving the reflected light L3 and outputting a voltage value corresponding to the light quantity; and a controller for controlling the actuator. The condensing point P2 of the distance measuring laser beam L2 is made to be situated between the lens focal point P0 and the lens 31, thereby making the formation of the reformed region possible in a deeper position from the surface 3, and suppressing an adverse effect by the reflected light L3. In addition, controlling on the basis of the calculation reflecting division by the sum total of the voltage values prevents the calculation value from varying through the reflected light quantity. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种激光束加工装置，其能够在工件内的期望位置精确地形成作为切割起点的重整区域。解决方案：激光束加工装置包括：聚光透镜31，用于将加工激光束和距离测量激光束L2聚焦到晶片1; 用于操作透镜31的致动器; 用于将距离测量激光束的反射光L3加上像散的成形光学系统49; 用于接收反射光L3并输出对应于光量的电压值的四分光电二极管42; 以及用于控制致动器的控制器。距离测量激光束L2的聚光点P2位于透镜焦点P0和透镜31之间，从而可以在表面3的较深位置形成重整区域，并且抑制不利影响通过反射光L3。此外，基于反映除以电压值的总和的计算的控制来防止计算值通过反射光量而变化。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007149856A Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：JP2007149856A
公开(公告)日：2007-06-14
申请号：JP2005340635
申请日：2005-11-25
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： MURAMATSU KENICHI , SAKAMOTO TSUYOSHI
IPC分类号： H01L21/301 , B23K26/38 , B23K26/42 , B23K101/40
CPC分类号： B23K26/0057 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , B28D5/0094 , H01L21/6838 , H01L21/78
摘要： PROBLEM TO BE SOLVED: To provide a laser processing method which can prevent a workpiece from being cut along a cut preparation line from a reforming area as a cutting start point when a suction table is separated from a holding member. SOLUTION: An expand tape 23 is stretched on a frame 51, holds the workpiece 1, and is sucked and fixed onto the vacuum chuck suction table 52 via a porous sheet 53. At this point, cutting in of the tape 23 to pores of the sheet 53 is inhibited because Young's modulus of the sheet 53 is lower than Young's modulus of the table 52. As a result, when the suction and fixation of the expand tape 23 is released after the formation of the reforming area 7 to separate the table 52 from the tape 23, no large stress acts on the workpiece 1. This prevents the workpiece 1 from being cut along the cut preparation line from the reforming area 7 as the cutting start point when the table 52 is separated from the tape 23. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种激光加工方法，当吸盘与保持构件分离时，可以防止工件沿着切割制备线从重整区域切割为切割起点。解决方案：展开胶带23在框架51上拉伸，保持工件1，并通过多孔片53被吸引并固定在真空吸盘52上。此时，将带23切割成由于片材53的杨氏模量低于工作台52的杨氏模量，所以片材53的细孔被抑制。结果，当形成改质区域7之后释放膨胀带23的抽吸和固定以分离来自带23的工作台52没有大的应力作用在工件1上。这样就防止了当工作台52与带23分离时，工件1沿着切割准备线从重整区域7切割为切割开始点。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007175961A Laser processing method and semiconductor chip 有权
标题翻译：激光加工方法和半导体芯片
公开(公告)号：JP2007175961A
公开(公告)日：2007-07-12
申请号：JP2005375695
申请日：2005-12-27
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： SAKAMOTO TSUYOSHI , MURAMATSU KENICHI
IPC分类号： B28D5/00 , B23K26/38 , B23K26/40 , B23K101/40
CPC分类号： H01L23/544 , B23K26/0057 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a laser processing method which makes it possible to cut an object to be processed having a substrate and a plurality of functional elements formed on the surface of the substrate, even when the substrate is thick, accurately in a short time along a cutting schedule line. SOLUTION: By irradiating the object 1 to be processed having the substrate 4 and a plurality of the functional elements 15 formed on the surface 3 of the substrate 4 with laser beams L while the focus P is put on the inside of the substrate 4, in relation to one cutting schedule line 5, at least one row of parting reforming domains 72, at least one row of quality reforming domains 71 positioned between the parting reforming domains 72 and the surface 3 of the substrate 4, and at least one row of HC reforming domains 73 positioned between the parting reforming domains 72 and the back 21 of the substrate 4 are formed. In the cutting schedule line direction, the formation density of the parting reforming domains 72 is made lower than those of the quality reforming domains 71 and the HC reforming domains 73. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够切割具有基板的被处理物和形成在基板的表面上的多个功能元件的激光加工方法，即使基板厚，准确地在短短的时间内沿着切割计划线。解决方案：通过用激光束L照射具有基板4的待处理物体1和形成在基板4的表面3上的多个功能元件15，同时将焦点P放置在基板的内部如图4所示，关于一个切割进度线5，至少一排分离重整区域72，位于分离重整域72和基底4的表面3之间的至少一排质量重整区域71和至少一排形成位于分离改性区域72和基板4的背面21之间的HC重整区域73。在切割进度线方向上，使分离重整域72的形成密度低于质量重整域71和HC重整域73的形成密度。版权所有：（C）2007，JPO＆INPIT

8. 发明专利

JP2004268104A Laser beam machining method 有权
公开(公告)号：JP2004268104A
公开(公告)日：2004-09-30
申请号：JP2003063838
申请日：2003-03-10
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： FUKUMITSU KENJI , FUKUYO FUMITSUGU , UCHIYAMA NAOKI , WAKUTA TOSHIMITSU , ATSUMI KAZUHIRO , MURAMATSU KENICHI
IPC分类号： B28D5/00 , B23K26/00 , B23K26/40 , B23K101/40 , C03B33/09 , H01L21/301
CPC分类号： B23K26/0057 , B23K26/032 , B23K26/0853 , B23K26/40 , B23K2203/50 , C03B33/091
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method by which an objective material to be machined can surely be cut off along a cut-off schedule line with high accuracy. SOLUTION: This laser beam machining method is formed as a cut-off starting point zone 8 in the inner part of the objective material 1 to be machined along the cut-off scheduled line 5 with a reformed zone 7 formed with a multiple photon absorption. Thereafter, the crack 24 on the objective material 1 as the starting point in the cut-off starting point zone 8 by irradiating the objective material 1 with a laser beam having the transparency to a non-reformed zone on the objective material 1 along the cut-off scheduled line 5 and thus, the objective material 1 can be cut off along the cut-off scheduled line 5 at good accuracy. Further, since each chip 25 is separated by extending an extending film 19 fixing the objective material 1, the reliability of cut-off to the objective material 1 along the cut-off scheduled line 5 can further be improved. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2004268103A Laser beam machining method 审中-公开
公开(公告)号：JP2004268103A
公开(公告)日：2004-09-30
申请号：JP2003063777
申请日：2003-03-10
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： FUKUMITSU KENJI , FUKUYO FUMITSUGU , UCHIYAMA NAOKI , WAKUTA TOSHIMITSU , ATSUMI KAZUHIRO , MURAMATSU KENICHI
IPC分类号： B28D5/00 , B23K26/00 , B23K26/40 , B23K101/40 , H01L21/301
CPC分类号： C03B33/0222
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining method by which an objective material to be machined can surely be cut off along a cut-off scheduled line with high accuracy. SOLUTION: In this laser beam machining method, a cut-off starting point zone 8 is formed in the inner part of the objective material 1 to be machined along the cut-off scheduled line 5 with a reformed zone 7 formed with a multiple photon absorption. Thereafter, the objective material 1 to be machined is irradiated along the cut-off scheduled line 5 with the laser beam L2 having the absorbency to the objective material 1 to be machined and crack 24 is developed on the objective material 1 to be machined by forming the cut-off starting point zone 8 as the starting point and the objective material 1 can be cut off along the cut-off scheduled line 5 at good accuracy. Further, since each chip 25 is separated by extending an extending film 19 fixing the objective material 1, the reliability of cut-off to the objective material 1 along the cut-off scheduled line 5 can further be improved. COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2007013056A Method for cutting work to be machined 有权
标题翻译：切割要加工的工作方法
公开(公告)号：JP2007013056A
公开(公告)日：2007-01-18
申请号：JP2005195238
申请日：2005-07-04
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： SAKAMOTO TSUYOSHI , MURAMATSU KENICHI
IPC分类号： H01L21/301 , B23K26/38 , B23K26/40 , B23K101/40
CPC分类号： B23K26/0057 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , H01L21/78
摘要： PROBLEM TO BE SOLVED: To provide a method for cutting a work to be machined by which a work to be machined comprising a substrate and a laminate including a plurality of functional elements and provided on the front surface of the substrate, can be accurately cut in a short time for each functional element along a planned cutting line even if the substrate is thick. SOLUTION: A focal point P is placed inside a substrate 4, and laser light L is radiated from the side of a laminate 16 to form, inside the substrate 4 along a planned cutting line, a first property modification zone 71 eccentric from the central position CL of the substrate 4 in the thickness direction to the side of the rear surface 21 of the substrate 4, and a second property modification zone 72 eccentric from the central position CL of the substrate 4 in the direction of the thickness to the side of the front surface 3 of the substrate 4. A cut 24 is formed from the second property modification zone 72 to the front surface 3 of the substrate 4. In a state of expanding an expand tape 23 stuck on the rear surface 21 of the substrate 4, stress is generated thereafter on a work 1 to be machined so as to open the cut 24. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于切割待加工的工件的方法，其中包括基板的工件和包括多个功能元件并且设置在基板的前表面上的层叠体可以是即使基板较厚，也可以沿着规划的切割线在每个功能元件的短时间内精确地切割。解决方案：焦点P放置在基板4的内部，激光L从层压板16的侧面辐射，沿着预定的切割线在基板4的内侧形成偏心的第一特性改质区域71 基板4的厚度方向的中心位置CL到基板4的后表面21侧，第二特性修改区72从基板4的中心位置CL向厚度方向偏心从第二特性改质区域72到基板4的前表面3形成切口24.在将扩展带23伸长的状态下，粘贴在基板4的后表面21上基板4之后，在要加工的工件1上产生应力以打开切口24.版权所有（C）2007，JPO＆INPIT

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