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1. 发明专利

JP2013058422A Manufacturing method of mems electric member 审中-公开
标题翻译： MEMS电气元件的制造方法
公开(公告)号：JP2013058422A
公开(公告)日：2013-03-28
申请号：JP2011196717
申请日：2011-09-09
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKUDA HISAO , NAKATANI TADASHI , KATSUKI TAKASHI , SHIMAUCHI TAKEAKI , TOYODA OSAMU
IPC分类号： H01H49/00 , H01H59/00
摘要： PROBLEM TO BE SOLVED: To reduce electrical non-conduction between counter electrodes, in a wafer level packaging of an MEMS wafer.SOLUTION: In the manufacturing method of an MEMS electric member, a plurality of chip regions are defined on an MEMS wafer, a movable part continuous to a fixed part is formed in each chip region, a plurality of connection electrodes having a spring electrode projecting from an anchor supported on the fixed part are formed, a cap wafer having a plurality of sets of a through conductor penetrating a wafer in the thickness direction and an extraction electrode connected with a through electrode is prepared, the extraction electrode of the cap wafer is made to abut against the spring electrode of the MEMS wafer, and then the cap wafer and the MEMS wafer are bonded.
摘要翻译：要解决的问题：在MEMS晶片的晶片级封装中减少对电极之间的电不导通。解决方案：在MEMS电气构件的制造方法中，在MEMS晶片上限定多个芯片区域，在每个芯片区域中形成有连接到固定部分的可移动部件，具有弹簧的多个连接电极形成从支撑在固定部分上的锚定器突出的电极，制备具有多个在厚度方向上穿透晶片的贯通导体和与通孔连接的引出电极的盖晶片，盖的引出电极使晶片与MEMS晶片的弹簧电极抵接，然后接合盖晶片和MEMS晶片。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2010089233A Micro movable element and optical switching device 有权
标题翻译：微动元件和光开关装置
公开(公告)号：JP2010089233A
公开(公告)日：2010-04-22
申请号：JP2008263658
申请日：2008-10-10
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SONETA HIROMITSU , MATSUMOTO TAKESHI , MIZUNO YOSHIHIRO , KOMA NORINAO , OKUDA HISAO , TSUBOI OSAMU
IPC分类号： B81B3/00 , G02B5/08 , G02B26/08 , G02B26/10
CPC分类号： G02B26/0841 , B81B2201/042 , B81B2203/0136 , B81B2203/058 , B81C3/001 , G01D5/285 , G02B6/3518 , G02B6/3556 , G02B6/356 , G02B6/357 , G02B6/3584 , H02N1/006
摘要： PROBLEM TO BE SOLVED: To provide a micro movable element suitable for suppressing the fluctuation of the spring constant of a connection part for connecting a frame to a movable part, and an optical switching device having the same. SOLUTION: The micro movable element X1 comprises a substrate S1 on which a frame 30, a movable part 20, and connection parts 42, 43 for regulating the axis A2 of the rotational displacement of the movable part 20 by connecting the frame and the movable part to each other, a base material S2, and at least one of firmly fixed parts 70C, 70D having a spacer interposed between the frame 30 of the substrate S1 and the base material S2 to join the substrate with the base material, and an adhesive which covers the spacer and adheres it to the frame and the supporting base material. The frame 30 has a first area 30A facing the movable part 20 in the extending direction of the axis A2 and a second area 30B outside the first area 30A. The firmly fixed parts 70C, 70D are joined with the second area 30B in the frame 30. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种适于抑制用于将框架连接到可动部件的连接部件的弹簧常数的波动的微型可动元件以及具有该微型可动元件的光学开关装置。解决方案：微型可动元件X1包括：基板S1，框架30，可动部件20以及连接部件42,43，用于通过连接框架和支撑件来调节可动部件20的旋转位移的轴线A2;以及可动部彼此，基材S2，以及至少一个固定部70C，70D中的至少一个，该固定部70C，70D具有插入在基板S1的框架30之间的间隔件和基材S2，以将基板与基材接合，以及覆盖间隔物并将其粘合到框架和支撑基材的粘合剂。框架30具有在轴线A2的延伸方向上面对可动部20的第一区域30A和位于第一区域30A外部的第二区域30B。固定部分70C，70D与框架30中的第二区域30B相连。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2008205513A Integrated-type electronic part 有权
标题翻译：集成式电子部件
公开(公告)号：JP2008205513A
公开(公告)日：2008-09-04
申请号：JP2008137019
申请日：2008-05-26
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： XIAOYU MI , MIZUNO YOSHIHIRO , MATSUMOTO TAKESHI , OKUDA HISAO , UEDA TOMOSHI , TAKAHASHI TAKAO
IPC分类号： H01F27/00 , H01F27/02 , H01F27/06 , H01F41/04 , H01G4/40
摘要： PROBLEM TO BE SOLVED: To provide an integrated-type electronic part suited to obtain a high Q value and a favorable high-frequency property.
SOLUTION: The integrated-type electronic part X has a substrate S, a plurality of passive components, a plurality of pads 40A and 40C for external connection, and three-dimensional wiring 30. The plurality of passive components include a multistage coil inductor 10A prepared on the substrate S, wherein the multistage coil inductor 10A has multiple coils 11 and 12 arranged in a multistage way, and adjacent coil conducting wires are separated with a gap. The three-dimensional wiring 30 includes a first wiring 31 extending in contact and along the substrate S, a second wiring 32 that is away from the substrate S extending along the substrate S, and a third wiring 33 connecting to these first and second wirings 31 and 32.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供适合于获得高Q值和有利的高频特性的集成型电子部件。解决方案：集成型电子部件X具有基板S，多个无源部件，用于外部连接的多个焊盘40A和40C以及三维布线30.多个无源部件包括多级线圈电感器10A，其中多级线圈电感器10A具有以多级布置的多个线圈11和12，并且相邻的线圈导线被间隔开。三维布线30包括沿基板S接触延伸的第一布线31，远离基板S延伸的基板S的第二布线32以及连接到第一布线31和第二布线31的第三布线33 （C）2008，JPO＆INPIT

4. 发明专利

JP2006300976A Micro movable element and optical switching device 有权
标题翻译：微动元件和光开关装置
公开(公告)号：JP2006300976A
公开(公告)日：2006-11-02
申请号：JP2005117841
申请日：2005-04-15
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SONETA HIROMITSU , MI XIAOYU , OKUDA HISAO , TSUBOI OSAMU , KOMA NORINAO , UEDA TOMOSHI
IPC分类号： G02B26/08 , B81B3/00 , B81B7/04
CPC分类号： G02B6/357 , G02B6/3518 , G02B6/3556 , G02B6/3584 , Y10S359/90
摘要： PROBLEM TO BE SOLVED: To provide a micro movable element suitable for efficient production, and to provide an optical switching device. SOLUTION: The micro movable element X comprises a plurality of micro movable substrates 10 integrally each forming a plurality of micro movable units each comprising e.g. a frame, a movable part capable of swing operation, a torsion connection connecting connecting the frame and the movable part, and an actuator for generating drive force for swing operation; a package base 20 having an inside wiring structure; and a plurality of conductive connections 30 electrically each connecting the actuator of the micro movable unit and the inside wiring structure by being interposed between the micro movable unit of the package base 20 in the micro movable substrate 10 and the package base 20. The optical switching device comprises e.g., a plurality of the micro movable elements X. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供适合于高效生产的微型可移动元件，并提供光学开关装置。解决方案：微型可移动元件X包括多个微型可移动基板10，每个微型可移动基板10形成多个微型可移动单元，每个微型可移动单元包括：框架，能够摆动的可移动部件，连接框架和可动部件的扭转连接，以及用于产生摆动操作的驱动力的致动器; 具有内部布线结构的封装基座20; 以及多个导电连接30，每个导电连接30通过插入在微型可移动基板10中的封装基座20的微型可移动单元和封装基座20之间而电连接微型可移动单元的致动器和内部布线结构。光学开关装置包括例如多个微动元件X.版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006276872A Method of manufacturing micromirror element and micromirror element 有权
标题翻译：制造微型元件和微型元件的方法
公开(公告)号：JP2006276872A
公开(公告)日：2006-10-12
申请号：JP2006123056
申请日：2006-04-27
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： MIZUNO YOSHIHIRO , UEDA TOMOSHI , TSUBOI OSAMU , SAWAKI IPPEI , OKUDA HISAO , YAMAGISHI FUMIO , KOMA GOGAKU
IPC分类号： G02B5/08 , B81B3/00 , B81C1/00 , G02B26/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a micromirror element having a thin torsion bar having a more accurate thickness while being accurately located at the middle in the thickness direction of a material substrate, and to provide a micromirror element of such kind. SOLUTION: In manufacturing a micromirror element which is provided with a mirror forming part, a frame part, and a torsion bar on the material substrate 8 having a layer structure including a plurality of silicon layers 20 and 21 and at least an intermediate layer 160, a process in which a pretorsion bar T' which is thinner than the mirror forming part and in contact with the intermediate layer, at least a part of the mirror forming part connected to the pretosion bar T', and at last a part of the frame part connected to the pretorsion bar T' are formed, and a process in which the torsion bar T is formed by removing the intermediate layer 160 connected to the pretorsion bar T', are performed on a silicone layer 20 by etching the silicon layer. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案：提供一种制造具有薄型扭杆的微镜元件的方法，该薄型扭杆具有更准确的厚度，同时精确地位于材料基板的厚度方向的中间，并且提供一种微镜元件这样的解决方案：在制造具有反射镜形成部分，框架部分和扭杆的微镜元件时，材料基板8具有包括多个硅层20和21以及至少中间层层160，其中比反射镜形成部分更薄并与中间层接触的预制棒T'，连接到预制棒T'的反射镜形成部分的至少一部分，以及最后部分形成连接到预制棒T'的框架部分，并且通过去除连接到预制棒T'的中间层160来形成扭杆T的过程在硅树脂层20上通过蚀刻硅层。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006251829A Micro mirror element 有权
标题翻译： MICRO MIRROR元素
公开(公告)号：JP2006251829A
公开(公告)日：2006-09-21
申请号：JP2006157299
申请日：2006-06-06
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： SONEDA HIROMITSU , UEDA TOMOSHI , OKUDA HISAO , SAWAKI IPPEI , TSUBOI OSAMU , MIZUNO YOSHIHIRO , KOMA GOGAKU , NAKAMURA YOSHITAKA , YAMAGISHI FUMIO
IPC分类号： G02B26/08 , B81B3/00
摘要： PROBLEM TO BE SOLVED: To provide a micro mirror element that can suppress expansion of its size incidental to increase in the number of mirror faces. SOLUTION: The micro mirror element is composed of: a micro mirror substrate 100 in which a frame 130, a movable part with mirrors 110, and a torsion bar 150 connecting the frame 130 with the movable part are formed; a wiring substrate 200 in which a wiring pattern 210 is formed; and electrically conductive spacers 300 which serve to electrically connect the frame 130 and the wiring pattern 210 while isolating the micro mirror substrate 100 and the wiring substrate 200. The electrically conductive spacers 300 are composed of a plurality of stacked bumps. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以抑制其尺寸的扩大以增加镜面数量的微镜元件。解决方案：微镜元件由以下部分组成：微镜基板100，其中形成有框架130，具有反射镜110的可移动部分和连接框架130与可移动部分的扭杆150; 其中形成有布线图案210的布线基板200; 以及导电间隔件300，其用于在隔离微反射镜基板100和布线基板200的同时电连接框架130和布线图案210.导电间隔件300由多个堆叠的凸块组成。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004145032A Method for manufacturing microstructure 有权
公开(公告)号：JP2004145032A
公开(公告)日：2004-05-20
申请号：JP2002310314
申请日：2002-10-24
申请人： Fujitsu Ltd , Fujitsu Media Device Kk , 富士通メディアデバイス株式会社 , 富士通株式会社
发明人： KOMA GOGAKU , MIZUNO YOSHIHIRO , TSUBOI OSAMU , OKUDA HISAO , SONEDA HIROMITSU , UEDA TOMOSHI , SAWAKI IPPEI , NAKAMURA YOSHITAKA
IPC分类号： B81C1/00 , G02B26/08 , H01L29/84
CPC分类号： B81C1/00182 , B81B2201/0235 , B81B2201/033 , B81B2201/042 , B81C2201/014 , B81C2201/0174 , G02B26/0841
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a microstructure having thin wall sections formed with high accuracy with respect to thickness dimensions. SOLUTION: The method includes a step (b) of forming the thin wall sections by subjecting a material substrate having a laminated structure including a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulation layer 104 which has pattern shapes including areas for masking the thin wall section points to be worked to the thin wall sections in the second conductor layer 102 and is interposed between the first conductor layer 101 and the second conductor layer 102 and a second insulation layer 105 which has the pattern shapes including the thin wall section points in the second conductor layer 102 in the mask region and is interposed between the second conductor layer 102 and the third conductor layer 103 to etching treatment from the first conductor layer 101 side down to the second insulation layer 105 through the mask patterns 58 including the points corresponding to the thin wall section points in the non-mask region. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2014221503A ＭＥＭＳデバイス及びＭＥＭＳデバイスの製造方法有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：JP2014221503A
公开(公告)日：2014-11-27
申请号：JP2013102019
申请日：2013-05-14
申请人：富士通株式会社 , Fujitsu Ltd
发明人： NAKATANI TADASHI , KATSUKI TAKASHI , OKUDA HISAO
IPC分类号： B81B3/00 , B81C3/00 , H01H49/00 , H01H57/00 , H01H59/00
摘要：【課題】密封空間の高さが均一となるMEMSデバイスを提供する。【解決手段】MEMSデバイス1は、第1電極15が配置される第1面10aを有し、ケイ酸ガラス又はセラミックスにより形成される第1基板10と、空洞31と、空洞31の上に配置され、第1基板10との間の距離を変化させるように運動可能な可動部32と、可動部32上に配置され、第1電極15と間隔をあけて対向する第2電極34と、を有し、シリコンにより形成される第2基板30と、第1基板10と第2基板30との間に配置されて、可動部32上に空間Rを形成するスペーサS1〜S4であって、可動部32上ではない位置に配置されるスペーサS1〜S4と、を備え、第1基板10と第2基板30とは、第1基板10が第1面10aを第2基板30側に向けて、第1基板10又は第2基板30の内の少なくとも一方の基板が撓んだ状態で空間Rの周囲で陽極接合される。【選択図】図1
摘要翻译：要解决的问题：提供具有均匀高度的密封空间的MEMS器件。解决方案：MEMS器件1包括：第一衬底10，其具有第一面10a，第一电极15布置在第一面10a上，并由硅酸盐玻璃或陶瓷; 一个洞31; 可移动部分32，其设置在洞穴31上方，并且能够移动以改变其与第一基板10之间的距离; 第二基板30，具有设置在可移动部分32上方的第二电极34，并且间隔着第一电极并由硅树脂形成; 以及间隔件S，其是设置在第一和第二基板10,30之间的间隔件S1-S4，并且在可移动部分32上形成空间R，并且设置在不是可移动部分32的位置。第一和第二基板10， 30在第一基板10的第一面10a面对第二基板30侧，第一基板10和第二基板30中的至少一个被弯曲的状态下，通过阳极接头围绕空间R接合。

9. 发明专利

JP2014075193A Method for manufacturing electronic device 审中-公开
标题翻译：制造电子器件的方法
公开(公告)号：JP2014075193A
公开(公告)日：2014-04-24
申请号：JP2012220669
申请日：2012-10-02
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKUDA HISAO , NAKATANI TADASHI , KATSUKI TAKASHI
IPC分类号： H01H57/00 , B81C1/00 , H01H49/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device capable of improving reliability.SOLUTION: A method for manufacturing an electronic device in which a gap is formed between a first electrode 22 and a second electrode 33 located above the first electrode comprises the steps of: forming a first conductive film 24 including a noble metal and serving as the first electrode on a substrate 10; forming a first adhesion film 25 of silicon dioxide on the first conductive film; forming a sacrificial layer 27 of silicon dioxide on the first adhesion film; forming a second adhesion film 29 of silicon dioxide on the sacrificial layer; forming a second conductive film 30 including a noble metal and serving as the second electrode on the second adhesion film; and forming a gap between the first electrode and the second electrode by removing the sacrificial layer together with the first adhesion film and the second adhesion film by etching.
摘要翻译：要解决的问题：提供一种能够提高可靠性的电子设备的制造方法。解决方案：一种在第一电极22和位于第一电极上方的第二电极33之间形成间隙的电子器件的制造方法包括：以下步骤：在基板10上形成包括贵金属并用作第一电极的第一导电膜24; 在第一导电膜上形成二氧化硅的第一粘附膜25; 在第一粘合膜上形成二氧化硅牺牲层27; 在牺牲层上形成二氧化硅的第二粘附膜29; 在第二粘合膜上形成包括贵金属并用作第二电极的第二导电膜30; 以及通过蚀刻与第一粘合膜和第二粘合膜一起去除牺牲层，在第一电极和第二电极之间形成间隙。

10. 发明专利

JP2014072048A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2014072048A
公开(公告)日：2014-04-21
申请号：JP2012217417
申请日：2012-09-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KATSUKI TAKASHI , NAKATANI TADASHI , SHIMAUCHI TAKEAKI , OKUDA HISAO
IPC分类号： H01H57/00 , B81B3/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic device for sufficiently keeping connection of a movable electrode and a stationary electrode in an upward and downward direction.SOLUTION: An electronic device has: a movable beam 13 having flexibility between a first end 13a and a second end 13b that are fixed on a substrate 11; a piezoelectric film 17b that is formed on the movable beam 13 and extends toward a first flexion point x of the movable beam 13 under a curved state from the first end 13a, and whose length from a root of the movable beam 13 is set in a range of 90%-110% of a distance from the root of the movable beam 13 to the first flexion point x; a pair of drive electrodes 17a, 17c sandwiching the piezoelectric film 17b from above and below; a movable electrode 21b provided on the movable beam 13 between the first end 13a and the second end 13b; and a stationary electrode 23a formed at an upper part of the movable electrode 21b.
摘要翻译：要解决的问题：提供一种用于充分保持可动电极和固定电极在上下方向上的连接的电子装置。解决方案：一种电子装置具有：在第一端13a和第二端之间具有柔性的可移动梁13 端部13b固定在基板11上; 压电膜17b，其形成在可动梁13上并且从第一端13a向弯曲状态朝着可动梁13的第一弯曲点x延伸，并且其从可动梁13的根部的长度设定为距离可移动梁13的根部到第一屈曲点x的距离的90％-110％的范围; 一对驱动电极17a，17c，其从上下夹着压电膜17b; 设置在第一端部13a和第二端部13b之间的可动梁13上的可动电极21b; 以及形成在可动电极21b的上部的固定电极23a。

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