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1. 发明专利

JPS63289848A PACKAGE FOR ELECTRONIC CIRCUIT COMPONENT 失效
公开(公告)号：JPS63289848A
公开(公告)日：1988-11-28
申请号：JP12368587
申请日：1987-05-22
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , GOUNJI TAKU , TANI ATSUSHI , KISHI SHOICHI , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI , YAMADERA SHINICHI
IPC分类号： H01L23/04 , H01L23/50
摘要： PURPOSE:To prevent the generation of cracks in a junction part between lead terminals and a circuit substrate, an insulating member, etc., by arranging, outside the insulating member, a part from the middle portion of a lead terminal retained by the insulating member to an external end of the lead terminal, and separating said part from the insulating member. CONSTITUTION:A part 14a, 14b from the middle portion of a lead terminal 14 retained by an insulating member 13 to the external end of a lead terminal 14, is arranged outside the insulating member 13, separated therefrom, and bent in the form of a crank. Therefore, when the bottom part 14d of external end-portion side of the lead terminal 14 is soldered against the conductor pattern 19 of a circuit substrate 18, distortion mainly caused by the difference of thermal expansion coefficient between the insulating member 13 and the circuit substrate 18, can be absorbed by the parts 14b, 14c of the lead terminal 14 which are positioned outside the insulating member 13. Thereby, the generation of cranks in a junction part between the lead terminal and the circuit substrate, the insulating member, etc., can be prevented.

2. 发明专利

JPS61204952A LEADLESS PACKAGE 失效
公开(公告)号：JPS61204952A
公开(公告)日：1986-09-11
申请号：JP4470785
申请日：1985-03-08
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , KASAI YOSHIHIKO , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI
IPC分类号： H01L23/04 , H01L23/50 , H05K5/00
摘要： PURPOSE:To obtain a package characterized by a low height when it is mounted on a printed board, good heat resistance and airtight property, by providing glass as an insulating material at the lower surface of a body comprising a metal plate, providing a plurality of electrodes, which are contacted with the lower surface or the side surface, penetrate the glass and are extended on the body, and insulating and sealing the glass and the electrodes in an airtight manner. CONSTITUTION:Glass 6 is sealed along the lower surface of a metal body 1 to a side surface 4b. Meanwhile, electrodes 10 have flat parts 10a, which are contacted with the lower surface of the glass 6. The electrodes penetrate the inside of glass 6 and are extended on the body 1 through small holes 5 (5a) of the body 1. The electrodes 10 passing the small holes 5 other than the grounding electrode are insulated from the body 1. The grounding electrode passing through the small hole 5a is electrically connected to the body 1. On packages 20a and 20b after completion, a quartz crystal element, an IC substrate, a compound element circuit substrate and other elements are mounted. They are connected to the electrodes 10, and thereafter a cap 2 is attached.

3. 发明专利

JPS6411351A PACKAGE FOR SEALING CIRCUIT COMPONENT 失效
公开(公告)号：JPS6411351A
公开(公告)日：1989-01-13
申请号：JP16685087
申请日：1987-07-06
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , GOUNJI TAKU , TANI ATSUSHI , KISHI SHOICHI , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI , YAMADERA SHINICHI
IPC分类号： H01L23/50 , H01L23/06
摘要： PURPOSE:To eliminate the need for connecting earth terminals with silver solder and make a package lighter without using metal frames by using a base wherein the earth terminals are mounted at an electrode plate of a package base and further, by sealing earth and lead terminals, thereby forming a book-type body made of insulating materials around the above base. CONSTITUTION:A base 21 is equipped with a flat plate type electrode plate 22 and a number of earth terminals 5 are extended to the outside and are connected with a plate 24. A lead terminal 3 extends in the direction of the electrode plate 22 from the plate 24 and a pointed end 32 is formed into a sectional U-shape and allows circuit components 30 to be easily connected to the lead terminal 3. The other pointed end 51 of the terminal 5 has the same functions. A book-type body 26 made of insulating materials 4 is formed around the base 21 and it not only seals terminals 5 and 3 but also makes this package form an air-tight space 28 wherein circuit components are sealed. When the package is used, the plate 24 is cut-off from the terminals 5 and 3 so that mutual contact is cut between the above terminals and plate 24 and mounting of the circuit components 30 into the air-tight space 28 allows the circuit components 30 to be connected to the terminals 5 and 3. After that, the package is pressed using pressure after putting a lid 8 on it.

4. 发明专利

JPS6370449A LEADLESS PACKAGE 失效
公开(公告)号：JPS6370449A
公开(公告)日：1988-03-30
申请号：JP21273686
申请日：1986-09-11
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , HASHI TOSHIO , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI
IPC分类号： H01L23/50 , H01L23/04 , H05K3/34
摘要： PURPOSE:To ensure the absorption of difference in amounts in expansion and contraction between glass and a printed wiring board, by exposing a part of the vertical part of an electrode body, and providing a strain absorbing part. CONSTITUTION:A flat part 18a of an electrode body 18 is arranged at about the same level of a lower surface 6b of glass 6. A cut part 6a is provided at a part corresponding to at least the flat part 18a of the glass 6. A part of the flat part 18a and a part of a vertical part 18b neighboring the flat part 18a are exposed from the glass 6 at the cut part 6a. A part of the vertical part 18b is provided as a strain absorbing part 18c. Thus the glass 6 can be packaged on a printed wiring board 11 indirectly without changing a packaging height from a conventional device through the strain absorbing part 18c of the electrode body 18. Therefore, the difference in amounts of expansion and contraction of the glass 6 and the printed wiring board 11 can be absorbed with the strain absorbing part 18c. Thus the glass 6 and the printed wiring board 11 can be freely expanded and contracted independently without constraint to each other.

5. 发明专利

JPS62158348A LEADLESS PACKAGE 失效
公开(公告)号：JPS62158348A
公开(公告)日：1987-07-14
申请号：JP486
申请日：1986-01-04
申请人： FUJITSU LTD , FUJI DENKA KK
发明人： KAGAMI YOSHIO , HASHI TOSHIO , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI
IPC分类号： H01L23/02 , H01L23/48 , H01L23/50 , H05K3/34
摘要： PURPOSE:To prevent the generation of concentrated stress in glass, a printed wiring board, a soldering section, etc. positively by mounting glass for a package in a type that the glass is floated on the printed wiring board through a projecting section for an electrode body. CONSTITUTION:Electrode bodies 18 have flat sections 18a for connection arranged separated from the lower surface of glass 6 through projecting sections 18b projected from the lower surface of glass 6 while penetrating the inside of glass 6, and are extended onto an apparatus body 1 through small holes 5, 5a in the apparatus body 1. Glass 6 is mounted onto a printed wiring board 11 in a floated type at a regular interval through the projecting sections 18b for the electrode bodies 18. Even when the difference of the thermal expansion coefficients of glass 6 and the printed wiring board 11 is large, the difference of the quantities of the thermal expansion (or the quantities of shrinkage on cooling) of both the glass 6 and the printed wiring board 11 can be absorbed by the projecting sections 18b for the electrode bodies 8. Accordingly, the glass 6 and the printed wiring board 11 are not constrained mutually, and expansion action or shrinkage action can freely be conducted independently.

6. 发明专利

JPH0680744B2 失效
公开(公告)号：JPH0680744B2
公开(公告)日：1994-10-12
申请号：JP486
申请日：1986-01-04
申请人： FUJITSU KK , FUJI DENKA KK
发明人： KAGAMI YOSHIO , HASHI TOSHIO , ANDO KENICHI , SHIRATORI TAKESHI , NISHIMURA TADASHI
IPC分类号： H01L23/02 , H01L23/48 , H01L23/50 , H05K3/34 , H01L23/04

7. 发明专利

JPH0351259B2 失效
公开(公告)号：JPH0351259B2
公开(公告)日：1991-08-06
申请号：JP14622685
申请日：1985-07-03
申请人： TOYO TSUSHINKI KK , FUJI DENKA KK
发明人： HIRAMA KOICHI , TANAKA YOSHIAKI , ANDO KENICHI , NISHIMURA TADASHI , ISHII HARUO
IPC分类号： H03H9/02 , H01R33/76

8. 发明专利

JPS5836011A GLASS SEALING METHOD FOR AIRTIGHT PACKAGE OF CIRCUIT ELEMENT 失效
公开(公告)号：JPS5836011A
公开(公告)日：1983-03-02
申请号：JP13378681
申请日：1981-08-26
申请人： FUJI DENKA KK
发明人： KUSANO TOSHIYUKI , NISHIMURA TADASHI
IPC分类号： H01L41/02 , H01L41/22 , H03H3/007
摘要： PURPOSE:To improve yield by sealing the circumference of the lead wire insertion part of a glass body, where a lead wire is run, while pressing it. CONSTITUTION:On a cradle 7 which has a hole 6 where a lead wire 3 runs, a base 1 holding glass 2 where the lead wire 3 runs is placed with the inner side up, and a carbon weight 12 is mounted near the lead wire insertion part 11 to press the glass 2 by the weight of the carbon weight 12. The load by this pressing is favorably 2-10g. While the circumference of the lead wire insertion part 11 of the glass 2 is pressed, the glass 2 is fused by being heated at 900- 1,000 deg.C for sealing. Thus, the glass is prevented from rising along the lead wire, and consequently the yield is improved remarkably.

9. 发明专利

JPS5821912A BASE FOR AIRTIGHT PACKAGE OF CIRCUIT ELEMENT 失效
公开(公告)号：JPS5821912A
公开(公告)日：1983-02-09
申请号：JP12040281
申请日：1981-07-31
申请人： FUJI DENKA KK
发明人： NISHIMURA TADASHI
IPC分类号： H03H9/02
摘要： PURPOSE:To increase the dielectric strength characteristics compared with the conventional case when only the glass is used, by providing an epoxy resin layer at the glass sealed part. CONSTITUTION:The glass 30 through which a lead wire 20 is pierced is fitted to a lead wire piercing part 10a of the base main body 10, and then the wire 20 is sealed by the heating process. Then the epoxy resin is put on the glass 30 after the wire 20 is sealed and hardened by the heating process. The heating temperature is regulated to 130-200 deg.C with the heating time of 5-20min. If the heating temperature is at 200 deg.C. If the heating time is

10. 发明专利

JPH05144976A STRUCTURE OF SURFACE MOUNT PACKAGE 失效
公开(公告)号：JPH05144976A
公开(公告)日：1993-06-11
申请号：JP32946191
申请日：1991-11-18
申请人： FUJI DENKA KK , TOYO COMMUNICATION EQUIP
发明人： NISHIMURA TADASHI , YAMAZAKI KIYOSHI
IPC分类号： H01L23/04 , H01L23/12 , H01L23/15 , H01L23/50 , H01R9/16
摘要： PURPOSE:To suppress the height of a package to a minimum require level, and facilitate uneven processing of a junction surface between a lead and a printed pattern by hermetically and integrally providing conductor blocks at suitable areas along the outer periphery of the bottom plate of a package, so that the conductor blocks are visible from the internal bottom surface, external bottom surface and outer side wall surfaces of the package. CONSTITUTION:Cutouts 14 are previously formed on counter sides of a bottom plate 1, and conductor blocks 15 which are the same shape as the cutouts are fitted into the cutouts 14. A frame-shaped surrounding wall member 2 and a sealing ring 5 made of a frame-shaped thin plate conductor are stacked, one on top of the other, on the bottom plate, and these are connected together by heating. Piezo-vibrators, or the like, are fixedly housed in the package, and the vibrators are electrically connected to exposed surfaces of the conductor blocks 15 within the package. Thereafter, the package is sealed by a conductor cover 4. Thus, it is possible to obtain a J-lead type package without post- processing, and suppress the height of the package to a minimum required level because the bottom surface of the package is substantially flush with the terminal surface of an external lead.

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