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1. 发明专利

JPH0351259B2 失效
公开(公告)号：JPH0351259B2
公开(公告)日：1991-08-06
申请号：JP14622685
申请日：1985-07-03
申请人： TOYO TSUSHINKI KK , FUJI DENKA KK
发明人： HIRAMA KOICHI , TANAKA YOSHIAKI , ANDO KENICHI , NISHIMURA TADASHI , ISHII HARUO
IPC分类号： H03H9/02 , H01R33/76

2. 发明专利

JP2001326003A AIRTIGHT TERMINAL 失效
公开(公告)号：JP2001326003A
公开(公告)日：2001-11-22
申请号：JP2000143029
申请日：2000-05-16
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16 , H01L23/02 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To use lead terminals for grounding in the same process as the lead terminal for insulation. SOLUTION: The airtight terminal comprises a lead terminal 3 which is inserted through the metal base 1 and adhered for sealing with glass to the metal base. Metal powder is added in a least one part of the glass so as to make it conductive glass and the above lead terminal 31 is made a ground terminal. As the ground lead terminal is formed in the same process as the of the lead terminal for insulation and does not require an additional process, cost reduction is made. As there is no damage brought about by a process of re-heating an the glass sealing portion, high reliability is secured.

3. 发明专利

JPH08148208A AIRTIGHT TERMINAL 失效
公开(公告)号：JPH08148208A
公开(公告)日：1996-06-07
申请号：JP31110894
申请日：1994-11-21
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PURPOSE: To provide an airtight terminal of a metal base having a good bonding characteristic and good productivity. CONSTITUTION: In an airtight terminal constructed by providing a lead terminal inserting hole 2 in a metal base 1, inserting a lead terminal 3 through the lead terminal inserting hole and sealing itself by glass, a glass layer includes the metal base 1, a sealing glass layer 41 for sealing the lead terminal and a laminated glass layer 42 provided on the upper layer of this sealing glass layer for supporting one tip of the lead terminal. The uppermost layer 421 and lowermost layer 423 of the laminated glass layer 42 are sealing glass layers adhered well to the lead terminal and the sealing glass layer and its intermediate layer 422 is a high melting point glass layer having a high strength and adhered well to the sealing glass. Since the laminated glass layer is provided below the head part 31 of the lead terminal for supporting the same and the strong high melting point glass layer is provided in the laminated glass layer, no resonance phenomena occur and the dimension of the inner side of the lead terminal can be made long.

4. 发明专利

JPH0845585A AIRTIGHT TERMINAL 失效
公开(公告)号：JPH0845585A
公开(公告)日：1996-02-16
申请号：JP19491194
申请日：1994-07-27
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PURPOSE:To make the airtight terminal excellent in thermal radiation, and also make it free from a bi-metal phenomenon by dividing a box shaped metallic base into a bottom section base and a frame shaped ring, joining the inner circumferential surface of the frame shaped ring with the outer circumferential surface of the bottom section base, and thereby integrating them all together. CONSTITUTION:An airtight terminal main body has lead terminal insertion holes bored in the side walls of a box shaped base 1, and is formed into a structure sealed with glass 5 in such a way that each lead terminal is penetrated through an air tight space 4. And the metallic base 1 includes a bottom section base 12 and a frame shaped ring 13 which is joined with the bottom section base 12. The bottom section base 12 is joined at its outer circumferential surface with the inner circumferential surface 131 of the frame shaped ring 13 at least at its one part by brazing. The frame shaped ring 13 is preferably made of for example, a Fe-Ni-Co alloy, Fe-Ni, Fe or of stainless. Meanwhile, the bottom section base 12 is preferably made of for example, copper or a copper alloy with thermal radiation taken into consideration.

5. 发明专利

JPH07326408A AIR-TIGHT TERMINAL 失效
公开(公告)号：JPH07326408A
公开(公告)日：1995-12-12
申请号：JP14089094
申请日：1994-05-31
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16
摘要： PURPOSE:To provide a reliable air-tight terminal the mounting area of which is smaller than that of a conventional one and the assembling process of which is simplified and the positional accuracy is improved and further which is excellent in shock resistance. CONSTITUTION:A lead wire insertion hole 2 is provided at the metallic bottom of a metallic base, which is constituted by bonding a frame-shaped seal ring 7 for sealing a cover and the said metallic bottom 8 to which a ground terminal 6 is connected, and a lead terminal 3 is inserted into this lead wire insertion hole so that it may pierce the air-tight space 4 made by the metallic base, and those are sealed by glass 5, inclusive of the said metallic bottom. Hereby, the protection of the air-tight terminal body and the improvement of the positional accuracy can be materialized by the frame having a pair of ground terminals, and further the installation of the circuit parts, the property check, and besides the packaging can be performed, with the air-tight terminal body connected to the frame.

6. 发明专利

JPH06231817A AIRTIGHT TERMINAL 失效
公开(公告)号：JPH06231817A
公开(公告)日：1994-08-19
申请号：JP3433693
申请日：1993-01-29
申请人： NIKKO ELECTRON KK , FUJI DENKA KK
发明人： WATANABE TAKAYA , ANDO KENICHI
IPC分类号： H01R9/16
摘要： PURPOSE:To provide an airtight terminal having small mounting volume and high reliability. CONSTITUTION:A lead terminal insertion hole 2 is provided on the bottom surface of a boxlike metallic base 1, and a lead terminal is inserted into the lead terminal insertion hole 2 so as to pass through an airtight space formed by the boxlike metallic base 1 to be sealed by glass 5. In this airtight terminal, a notched part 7 is provided in a thickness direction from the bottom surface 12 end part of the metallic base 1 and also a lead terminal insertion hole 2 is boredly provided on the notched part 7, and a hooklike lead terminal is hooked at the lead terminal insertion hole 2 and the notched part 7 by the glass 5 to be sealed.

7. 发明专利

JPH05315022A AIRTIGHT TERMINAL AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05315022A
公开(公告)日：1993-11-26
申请号：JP14001892
申请日：1992-05-01
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01R9/16 , H01R43/20
摘要： PURPOSE:To provide a small-sized airtight terminal excellent in heat radiation where a metal base with a deep recess formed thereon by coining work is used, and a method for easily manufacturing the airtight terminal. CONSTITUTION:In an airtight terminal sealed with glass where a lead terminal inserting hole 2 is bored in a recess 12 formed on a plate-like metal base 1, and a lead terminal is inserted into the lead terminal inserting hole 2, the recess 12 is provided on the bottom thereof with a through hole, to which a metal block 7 is bonded. An airtight terminal manufacturing method includes processes of forming the through hole on the plate-like metal base, of coining to form the recess 12 on the through hole, of forming the lead terminal inserting hole 2 to be inserted into the upper and lower surfaces of the recess except for the through hole, of bonding the metal block 7 to the through hole.

8. 发明专利

JP2003163300A METHOD FOR SEALING AIRTIGHT PACKAGE 审中-公开
公开(公告)号：JP2003163300A
公开(公告)日：2003-06-06
申请号：JP2001359633
申请日：2001-11-26
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01L23/02 , H01L23/04 , H03H9/02
摘要： PROBLEM TO BE SOLVED: To provide a method for sealing an airtight package in which the advantages of a method for sealing using a sealing material and a method for sealing by direct welding are applied to the maximum limit and defects are removed. SOLUTION: The method for sealing the airtight package comprises the steps of providing a plurality of lead terminal sealing holes 2 at the bottom or the sidewall of a metal container 1 having an opening, and welding a cover made of a metal to the opening of the terminal in which the lead terminal 3 is airtightly sealed by using a glass material 4 to the sealing holes of the terminal. The method further comprises the steps of holding a low melting point metal 6 between the opening and the cover, and seam welding the cover to the opening. Thus, limits of the position and the size of airtightly sealing the lead terminal using the glass of the terminal are reduced, and the degree of freedoms of the structure is high. Since the low melting point metal is melted in the seam welding method, it becomes local heating, and hence the limit of the connecting material when an element or the like is mounted therein is not required, and the fault due to the generation of the gas when the connecting material of the resin is used does not occur so that high reliability can be assured. COPYRIGHT: (C)2003,JPO

9. 发明专利

JPH1041431A PACKAGE FOR AIRTIGHT SEALING 失效
公开(公告)号：JPH1041431A
公开(公告)日：1998-02-13
申请号：JP21064096
申请日：1996-07-22
申请人： FUJI DENKA KK
发明人： ANDO KENICHI
IPC分类号： H01L23/12 , H01L23/08 , H03H9/02 , H03H9/10
摘要： PROBLEM TO BE SOLVED: To absorb the external stress propagation, while reducing the frequency fluctuation by external mechanical stress and the manufacturing steps by composing the material of inner electrode part of a soft metal, and setting the level thereof at least a specific value. SOLUTION: In the airtight sealing package, an inner electrode 65 is provided in a package substrate 61 composed of a ceramic and/or glass ceramic. The inner electrode 65 is connected to an outer electrode 66 provided on the bottom of a package substrate 61 through the intermediary of a conductive line 67. Besides, the inner electrode 65 is formed of a projecting soft metal of the height of at least 30μm. Through these procedures, a space can be given to the bottom of a piezoelectric element, thereby enabling the inner electrode 65 to be directly formed on the lower layer glass ceramic 61 besides, the external stress propagation to be absorbed to reduce the distortion in a chrystalline element. Furthermore, a sheetlike holding support can be eliminated thereby reducing the parts and steps.

10. 发明专利

JPH05315469A SURFACE INSTALLATION METAL PACKAGE 失效
公开(公告)号：JPH05315469A
公开(公告)日：1993-11-26
申请号：JP14102892
申请日：1992-05-06
申请人： NIKKO ELECTRON KK , FUJI DENKA KK
发明人： WATANABE TAKAYA , ANDO KENICHI
IPC分类号： H01L23/12 , H01L23/50
摘要： PURPOSE:To provide a surface installation part capable of decreasing the installation capacity without increasing the number of secondary processing steps and the part number in order to perform the surface installtion steps. CONSTITUTION:Within a surface installation metal package wherein through holes 2 are made in the recession bottom surface of a platelike metallic base 1 with a recession 12 formed therein so as to insert lead terminals 3 into the through holes 2 and then sealed with glassy material 4, furtheremore, the recession 12 is covered with a platelike cover 5, the ends of outer parts 31, 32 are to be slightly protruded out of the bottom surface of the metallic base 1.

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