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1. 发明专利

JP2005009749A Heating device 有权
标题翻译：加热装置
公开(公告)号：JP2005009749A
公开(公告)日：2005-01-13
申请号：JP2003173257
申请日：2003-06-18
申请人： Espec Corp , エスペック株式会社
发明人： SAKANE HIROKI , KANDA TOSHIRO , SATOGUCHI HIDEKI
IPC分类号： F27B9/36 , F27B9/06 , F27B9/10 , F27D7/02
摘要： PROBLEM TO BE SOLVED: To improve heat treatment efficiency by speeding up temperature rise of a substrate.
SOLUTION: The heating device is composed so that a surface Wa of the substrate W faces a heating surface 31 of an IR heater 3 and heating is carried out by the surface, hot air is discharged on a rear face Wb of the substrate W via a multiplicity of air supply holes 43 from an air supply chamber 42, and the hot air enters from an intake hole 52 opened in a side of the heating surface 31 into an exhaust chamber 51 arranged on the intake hole 52. By hot air heating of the rear face, surface heating by the IR heater is assisted without affecting a resist agent formed on the substrate surface, heat treatment efficiency can be improved by speeding up temperature rise, and sublimation gas or the like can be efficiently exhausted.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过加速基板的温度升高来提高热处理效率。解决方案：加热装置构成为使得基板W的表面Wa面对IR加热器3的加热面31，并且通过表面进行加热，热空气在基板的背面Wb上排出 W通过从供气室42的多个供气孔43，热空气从在加热面31侧开放的吸入孔52进入配置在吸气孔52上的排气室51。在不影响基板表面形成的抗蚀剂的情况下，辅助红外线加热器对表面进行加热，进行表面加热，可以通过加快升温而提高热处理效率，能够有效地排出升华气体等。版权所有（C）2005，JPO＆NCIPI

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