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1. 发明专利

JP2006303112A Semiconductor wafer peripheral edge polisher and method therefor 有权
标题翻译：半导体波形外围边缘抛物面及其方法
公开(公告)号：JP2006303112A
公开(公告)日：2006-11-02
申请号：JP2005121464
申请日：2005-04-19
申请人： Ebara Corp , Nihon Micro Coating Co Ltd , 日本ミクロコーティング株式会社 , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , ITO KENYA , SHIRAKASHI MICHIHIKO , INOUE KAZUYUKI , YAMAGUCHI KENJI , SEKI MASAYA , SATO SATORU , WATANABE ATSUSHI , KATO KENJI , TAMURA ATSUSHI , ASAKAWA SOICHI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B49/12 , B24B55/08
CPC分类号： B24B9/065 , B24B21/16
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer peripheral edge polisher and method therefor, which efficiently polishes the notch and the bevel of a semiconductor wafer in a single apparatus. SOLUTION: The apparatus 10 is composed of a wafer stage unit 20, having a wafer stage 23 for holding a semiconductor wafer W, stage-moving means 30, 32 for moving the wafer stage unit 20 in a direction parallel to the surface of the wafer stage 23, a notch polisher 40 for polishing the notch of the semiconductor wafer W held on the wafer stage 23, and a bevel polisher 50 for polishing the bevel of the semiconductor wafer W held on the wafer stage 23. It further has a wafer-chucking means 80 for taking up the semiconductor wafer W held on the wafer stage 23, from the wafer stage 23, after mounting the semiconductor wafer W that has been carried in the inside of a housing 11 on the wafer stage 23. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体晶片周边抛光机及其方法，其在单个设备中有效地抛光半导体晶片的凹口和斜面。解决方案：设备10由具有用于保持半导体晶片W的晶片台23的晶片台单元20组成，用于在平行于表面的方向上移动晶片台单元20的平台移动装置30,32 晶片载物台23上的凹槽抛光机40，用于抛光保持在晶片台23上的半导体晶片W的凹口的凹口抛光机40以及用于抛光保持在晶片台23上的半导体晶片W的斜面的斜面抛光机50。在将载置在壳体11的内部的半导体晶片W安装在晶片台23上之后，从晶片台23取出保持在晶片台23上的半导体晶片W的晶片夹紧装置80。 P>版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2014202289A ロータリーバルブ有权
标题翻译：旋转阀
公开(公告)号：JP2014202289A
公开(公告)日：2014-10-27
申请号：JP2013079153
申请日：2013-04-05
申请人：株式会社荏原製作所 , Ebara Corp , リックス株式会社 , Rix Corp
发明人： TAKAHASHI YOSHIMIZU , HATANO SHINJI
IPC分类号： F16K11/074 , F16K3/06
摘要：【課題】流体圧力によるスラスト方向の荷重を低減させることで同じ容量に対して安価かつ小型のベアリングを使用可能とし、また、これまで使用可能なベアリングが無いため対応出来なかった大型化や高圧化にも対応できるようにしたロータリーバルブを提供する。【解決手段】バルブ本体2と、バルブ本体2に回転可能に収容されるローター3と、ローター3又はバルブ本体2に設けられた摺動面と摺動する弁体4P,4Tとを備え、ローター3の回転によりローター3の流路と弁体の流路3FPを連通又は閉止することで流体の流路切換を行うロータリーバルブにおいて、ローター3とバルブ本体2とにより空間10,20を形成し、該空間を水密又は気密に密閉するシールを配置し、該空間を作動流体の供給ポート(Pポート)又は作動流体の排出ポート(Tポート)に連通した。【選択図】図1
摘要翻译：要解决的问题：提供一种由于流体压力而减小推力方向的负载的旋转阀，因此可以使用相同容量的低成本和小尺寸的轴承，相反，可以响应于较大尺寸或更高的压力使用，由于适当的轴承不可用，常规技术不能满足。解决方案：旋转阀包括：阀主体2; 可旋转地容纳在阀主体2内的转子3; 以及与设置在转子3或阀主体2上的滑动面滑动的阀体4P，4T，通过使转子3的通道和阀体的通道3FP旋转而进行流体切换，其中，空间10,20由转子3和阀主体2形成，设置密封空间密封或气密的密封件，并且空间与供给口（ P端口）的致动流体或排出口（T端口）。

3. 发明专利

JP2012231191A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2012231191A
公开(公告)日：2012-11-22
申请号：JP2012189768
申请日：2012-08-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SEKI MASAYA , KUSA HIROAKI , YAMAGUCHI KENJI , NAKANISHI MASAYUKI
IPC分类号： H01L21/304 , B24B9/00 , B24B21/00 , B24B37/00 , B24B37/04
CPC分类号： B24B21/002 , B24B9/065 , B24B37/042 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of reducing an entire polishing time, and easily exchanging a polishing tape.SOLUTION: This polishing device for polishing a notch part of a substrate W comprises: a rotation holding mechanism 3 for holding the substrate W parallel and rotating it; plural polishing head modules 70A, 70B, 70C, 70D polishing the substrate W using the polishing tape; and a movement mechanism for moving the plural polishing head modules independently. Each of the plural polishing head modules has a polishing head 30 for sliding the polishing tape in contact with the notch part of the substrate W, and tape supply and recovery mechanisms 2A, 2B, 2C, 2D for supplying the polishing tape to the polishing head and recovering it.
摘要翻译：要解决的问题：提供能够减少整个抛光时间并且容易更换研磨带的抛光装置。解决方案：用于抛光基板W的切口部分的抛光装置包括：用于平行地保持基板W并使其旋转的旋转保持机构3; 多个研磨头模块70A，70B，70C，70D使用研磨带对基板W进行研磨; 以及用于独立地移动多个抛光头模块的移动机构。多个研磨头模块中的每一个具有用于使研磨带与基板W的切口部分接触的研磨头30，以及用于将抛光带供给到抛光头的胶带供给和回收机构2A，2B，2C，2D 并恢复它。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012096151A Seawater desalination system and energy exchange chamber 有权
标题翻译：海水淡化系统和能源交换室
公开(公告)号：JP2012096151A
公开(公告)日：2012-05-24
申请号：JP2010245206
申请日：2010-11-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , MAEDA KAZUAKI
IPC分类号： B01D61/06 , C02F1/44
CPC分类号： Y02A20/131
摘要： PROBLEM TO BE SOLVED: To provide a seawater desalination system, capable of reducing mixing of condensed seawater with seawater in an energy exchange chamber while solving the problem of abrasion of a slide member by constituting the energy exchange chamber in a piston-free form.SOLUTION: The seawater desalination system for producing fresh water from seawater by passing seawater pressurized by a pump to a reverse osmosis membrane separation device 4 to separate the seawater into fresh water and condensed seawater includes the energy exchange chamber 20 wherein the pressure energy of the condensed seawater discharged from the reverse osmosis membrane separation device 4 is used as energy for pressurizing part of the seawater. The energy exchange chamber 20 includes a condensed seawater port P1 letting the condensed seawater in and out, a seawater port P2 letting the seawater in and out, and a plurality of sectioned channels R provided inside the chamber to communicate the condensed seawater port P1 with the seawater port P2. The plurality of sectioned channels R have the same sectional area and the same shape, and no fluid flows in other parts than the channels.
摘要翻译：要解决的问题：提供一种海水淡化系统，其能够在能量交换室中减少冷凝的海水与海水的混合，同时通过将能量更换室构造成无活塞的方式解决滑动构件的磨损问题形成。解决方案：通过将由水加压的海水通过反渗透膜分离装置4将海水分离成淡水和冷凝的海水，用于从海水生产淡水的海水淡化系统包括能量交换室20，其中压力能使用从反渗透膜分离装置4排出的浓缩海水作为对部分海水进行加压的能量。能量交换室20包括使冷凝的海水进出的冷凝的海水口P1，使海水进出的海水口P2，以及设置在室内的多个分段通道R，以使冷凝的海水口P1与海水P2。多个分段通道R具有相同的截面积和相同的形状，并且在其它部分中没有流体流过通道。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2009154285A Polishing device and method 有权
标题翻译：抛光装置和方法
公开(公告)号：JP2009154285A
公开(公告)日：2009-07-16
申请号：JP2008292193
申请日：2008-11-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SEKI MASAYA , KUSA HIROAKI , YAMAGUCHI KENJI , NAKANISHI MASAYUKI
IPC分类号： B24B9/00 , B24B21/00 , B24B37/00 , B24B37/04 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： PROBLEM TO BE SOLVED: To provide a polishing device allowing shortening of the whole polishing time and easy replacement of a polishing tape. SOLUTION: This polishing device includes a rotary holding mechanism 3 for horizontally holding a substrate W and rotating the substrate W, a plurality of polishing head assemblies 1A, 1B, 1C and 1D, a plurality of tape supplying and recovering mechanisms 2A, 2B, 2C and 2D, and a plurality of moving mechanisms for moving the plurality of polishing head assemblies 1A, 1B, 1C and 1D in radial directions of the substrate W. Each of the polishing head assemblies 1A, 1B, 1C and 1D has a polishing head 30 for making a polishing tape abut on a peripheral edge part of the substrate W and a tilt mechanism for rotating a polishing head with a shaft parallel to a tangential line of the substrate W as a center. The polishing head has a tape feed mechanism for holding the polishing tape and delivering the polishing tape at prescribed speed. The tape supplying and recovering mechanisms 2A, 2B, 2C and 2D are arranged outwardly of the plurality of polishing head assemblies 1A, 1B, 1C and 1D in the radial directions of the substrate, and the positions are fixed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够缩短整个抛光时间并且容易更换抛光带的抛光装置。解决方案：该抛光装置包括用于水平地保持基板W并旋转基板W的旋转保持机构3，多个抛光头组件1A，1B，1C和1D，多个胶带供应和恢复机构2A， 2B，2C和2D以及用于在基板W的径向方向上移动多个抛光头组件1A，1B，1C和1D的多个移动机构。每个抛光头组件1A，1B，1C和1D具有用于制造抛光带的抛光头30与基板W的周缘部分邻接;以及倾斜机构，用于以平行于基板W的切线为中心的轴旋转抛光头。抛光头具有用于保持研磨带并以规定速度输送研磨带的带进给机构。磁带供给和恢复机构2A，2B，2C和2D沿着基板的径向布置在多个抛光头组件1A，1B，1C和1D的外侧，并且位置是固定的。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009018364A Polishing apparatus and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2009018364A
公开(公告)日：2009-01-29
申请号：JP2007181617
申请日：2007-07-11
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： FUKUSHIMA MASARU , SHIGETA ATSUSHI , TAKAHASHI YOSHIMIZU , ITO KENYA , SEKI MASAYA , KUSA HIROAKI
IPC分类号： B24B21/08 , B24B9/00 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which can polish the central portion of a bevel of a substrate by high polishing pressure. SOLUTION: The polishing apparatus comprises a substrate holding section 32 for holding and turning the substrate W, a pressing pad 50 for pressing the polishing surface of a polishing tape 41 against the bevel of the substrate held by the substrate holding section, and a feed mechanism 45 for feeding the polishing tape in its longitudinal direction. The pressing pad 50 has a hard member 51 having a pressing surface 51a for pressing the bevel of the substrate via the polishing tape, and at least one elastic member 53 for pressing the hard member against the bevel of the substrate via the polishing tape. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以通过高抛光压力抛光衬底的斜面的中心部分的抛光装置。＆lt; P＆gt;解决方案：抛光装置包括用于保持和转动基板W的基板保持部32，用于将研磨带41的抛光表面压靠在由基板保持部保持的基板的斜面上的按压垫50，以及用于在其纵向方向上馈送抛光带的进给机构45。按压垫50具有硬质构件51，该硬质构件51具有用于经由研磨带挤压基板的斜面的按压面51a，以及至少一个弹性构件53，用于经由研磨带将硬构件压靠在基板的斜面上。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2005214267A Hydraulic device 审中-公开
标题翻译：液压装置
公开(公告)号：JP2005214267A
公开(公告)日：2005-08-11
申请号：JP2004020330
申请日：2004-01-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SUGAWARA HIROSHI , YAMASHINA CHISHIRO
IPC分类号： F15B11/08 , B30B1/32 , B30B15/18 , F15B11/00
摘要： PROBLEM TO BE SOLVED: To provide a hydraulic device capable of extending maintenance cycles of a selector valve, an electric motor, a pump, or the like, and reducing energy loss.
SOLUTION: The hydraulic device is provided with a servomotor 13 operating and stopping on the basis of command signals, a pump 12, an actuator (a pressurizing part 40) driven by high pressure fluid delivered from the pump 12, a control valve 14 controlling operating direction, speed, position, and generated force of the actuator, and the selector valve 15 opening and closing a passage between the control valve 14 and the actuator. It is provided with a controller 1 capable of carrying out position holding by a first position holding means for holding the position of the actuator by closing the selector valve 15 and stopping the pump 12, and a second position holding means for holding the position of the actuator by driving the pump, generating high pressure fluid, and carrying out position control by the control valve 14 when carrying out position holding of the actuator, and automatically changing from the second position holding means to a first position holding system.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够延长选择阀，电动机，泵等的维护周期的液压装置，并且减少能量损失。解决方案：液压装置设有基于指令信号操作和停止的伺服电动机13，泵12，由从泵12输送的高压流体驱动的致动器（加压部40），控制阀控制致动器的操作方向，速度，位置和产生的力，以及选择阀15打开和关闭控制阀14和致动器之间的通道。设置有能够通过关闭选择阀15并停止泵12来保持致动器的位置的第一位置保持装置执行位置保持的控制器1和用于保持该位置的位置的第二位置保持装置致动器，通过驱动泵，产生高压流体，并且在执行致动器的位置保持时由控制阀14执行位置控制，并且从第二位置保持装置自动地变为第一位置保持系统。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004249458A Endpoint detection method of polishing 审中-公开
公开(公告)号：JP2004249458A
公开(公告)日：2004-09-09
申请号：JP2004117208
申请日：2004-04-12
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KIMURA NORIO , SAKATA FUMIHIKO , TAKAHASHI YOSHIMIZU
IPC分类号： B24B49/16 , B24B37/013 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a method to stably detect a polishing end point during polishing. SOLUTION: The polishing end point detection method in polishing a polishing object 14 into a flat and mirror face by pressing a top ring 13 holding the polishing object 14 on a piece of polishing cloth 11 bonded on the turntable 12 comprises the steps of: detecting the current of a drive motor 16 of a turntable 12; and detecting the change of polishing frictional force with the change of a signal obtained by filtering high frequency noises from the detected motor current signal. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2013075358A Polishing apparatus and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2013075358A
公开(公告)日：2013-04-25
申请号：JP2012273699
申请日：2012-12-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI YOSHIMIZU , SEKI MASAYA , KUSA HIROAKI , ITO KENYA
IPC分类号： B24B21/00 , B24B9/00 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which achieves stable polishing performance by keeping the tension of a polishing tape almost constant during polishing, and has an increased polishing speed.SOLUTION: The polishing apparatus includes a polishing head 42 configured to bring a polishing tape 41 into contact with a workpiece and a swinging mechanism configured to cause the polishing head 42 to perform a swinging motion with its pivot laid on a predetermined point. The swinging mechanism includes a swing arm 60 to which the polishing head 42 is fixed, a support arm 62, a connection shaft 67 for rotatably connecting the swing arm 60 to the support arm 62, and a drive mechanism M1 causing the swing arm 60 to perform a swinging motion with its pivot laid on the connection shaft 67. The center point of the swinging motion of the polishing head 42 is on the center line of the connection shaft 67.
摘要翻译：要解决的问题：提供一种抛光装置，其通过在抛光时保持抛光带的张力几乎恒定而获得稳定的抛光性能，并且具有增加的抛光速度。抛光装置包括：抛光头42，其被配置为使研磨带41与工件接触;以及摆动机构，其构造成使抛光头42以其摆动摆放在预定点上进行摆动运动。摆动机构包括：固定有抛光头42的摆臂60，支撑臂62，用于将摆臂60可旋转地连接到支撑臂62的连接轴67;以及驱动机构M1，使摆臂60 执行摆动运动，其枢轴布置在连接轴67上。抛光头42的摆动运动的中心点在连接轴67的中心线上。（C）2013，JPO＆INPIT

10. 发明专利

JP2010162624A Polishing device and method 审中-公开
标题翻译：抛光装置和方法
公开(公告)号：JP2010162624A
公开(公告)日：2010-07-29
申请号：JP2009005102
申请日：2009-01-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKANISHI MASAYUKI , ITO KENYA , TAKAHASHI YOSHIMIZU , MIYAMOTO KUMIKO , KODERA KENJI
IPC分类号： B24B9/00 , B24B21/00 , H01L21/304
CPC分类号： B24B9/065 , B24B21/004
摘要： PROBLEM TO BE SOLVED: To provide polishing device and method allowing realizing of a polishing process capable of forming a smooth polished surface at a low cost. SOLUTION: This polishing device includes a substrate holding part 3 for rotating a substrate W with the axial center as a center, first polishing parts 1B and 1D for polishing a peripheral edge part of the rotated substrate W by bringing the peripheral edge part into contact with a polishing layer of a first polishing tool 23A, and second polishing parts 1A and 1C for polishing the peripheral edge part by bringing the peripheral part into contact with a polishing layer of a second polishing tool 23B. The polishing layer of the first polishing tool 23A has hard first abrasive grain, while the polishing layer of the second polishing tool 23B has second abrasive grain softer than the first abrasive grain. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够以低成本实现能够形成平滑抛光表面的抛光工艺的抛光装置和方法。解决方案：该抛光装置包括：以轴心为中心旋转基板W的基板保持部3;第一研磨部1B，1D，其通过使旋转基板W的周缘部的周缘部与第一研磨工具23A的研磨层接触，以及第二研磨部1A，1C，其通过使周缘部与第二研磨工具23B的研磨层接触来研磨周缘部。第一研磨工具23A的研磨层具有硬质的第一磨粒，而第二研磨工具23B的研磨层具有比第一磨粒更软的第二磨粒。版权所有（C）2010，JPO＆INPIT

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