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1. 发明专利

JP2004017229A Substrate polishing device 审中-公开
标题翻译：基板抛光装置
公开(公告)号：JP2004017229A
公开(公告)日：2004-01-22
申请号：JP2002176777
申请日：2002-06-18
申请人： Ebara Corp , Shimadzu Corp , 株式会社島津製作所 , 株式会社荏原製作所
发明人： TSUKUDA YASURO , YAMAUCHI HIRONORI , NAKAI SHUNSUKE , OZAWA HIDEKAZU
IPC分类号： G01B11/06 , B24B37/013 , B24B49/02 , B24B53/017 , B24B53/02 , H01L21/304 , B24B37/00 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To improve accuracy for detecting an end point of polishing without deteriorating a throughput of a CMP device. SOLUTION: A reflection plate 36 for generating reference lights is installed inside an annular dresser 32 on a bottom surface of a dresser head 30 for dressing a polishing surface of a polishing pad 12. During a dressing step, when a sensor part 47 of a spectrometry part 40 installed inside a turntable 10 passes below the reflection plate 36, reflection lights at n of measuring points on the reflection plate36 are measured, so as to obtain n of spectrums corresponding to respecting detection signals at a signal processing part 50. By integrating data of the spectrum, one reference spectrum as a reference at the time of calculating a reflection rate is calculated, so as to store the data. While a semiconductor substrate 21 is polished, a measured spectrum is obtained from the reflection lights by the substrate 21, and the reflection rate is found on the basis of the reference spectrum, so as to calculate a poliling degree. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提高用于检测抛光终点的精度，而不会降低CMP装置的生产量。解决方案：用于产生参考光的反射板36安装在修整器头30的底表面上的环形修整器32内部，用于修整抛光垫12的抛光表面。在修整步骤期间，当传感器部分47 安装在转盘10内的光谱测定部40在反射板36的下方通过，测量反射板36上的测量点的n处的反射光，从而在信号处理部50获得对应于检测信号的n个光谱。通过对频谱的数据进行积分，算出计算反射率时的基准频谱作为基准，计算数据。在对半导体基板21进行研磨的同时，通过基板21从反射光获得测定光谱，根据基准光谱求出反射率，计算出倾斜度。版权所有（C）2004，JPO

2. 发明专利

JP2011023604A Method of controlling robot for substrate transfer for cassette 有权
标题翻译：控制CASSETTE基板传送机器人的方法
公开(公告)号：JP2011023604A
公开(公告)日：2011-02-03
申请号：JP2009168136
申请日：2009-07-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , SONE CHUICHI , UMEMOTO MASAO , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , B25J9/22 , B65G49/07
摘要： PROBLEM TO BE SOLVED: To provide a method of controlling a robot for substrate transfer for a cassette, wherein substrates in respective stages of the cassette can be precisely delivered by a robot hand through simple sensorless teaching. SOLUTION: The cassette 30 for storing the substrates W in a plurality of stages and the robot 70 for substrate transfer configured to deliver the substrates W to the respective stages in the cassette 30 using the robot hand 50 are prepared. The robot hand 50 is moved to delivery positions for the substrates W in the bottom and top stages among the substrates W stored in the cassette 30, and those delivery positions are measured as position information on the robot hand 50. Based upon the measured position information on the bottom and top stages of the substrates W, and a positioning system, position information on delivery positions of the robot hand 50 for substrates W stored in other stages of the cassette 30 is calculated. The robot hand 50 is moved to the respective stages of the cassette 30 using those pieces of position information to deliver the substrates W. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种控制用于盒的基板传送的机器人的方法，其中通过简单的无传感器教导，可以通过机器人手将盒的各个阶段中的基板精确地传送。＆lt; P＆gt;解决方案：准备用于存储多层的基板W的盒30和用于基板传送的机器人70，其被配置为使用机器人手50将基板W传送到盒30中的各个台。机器人手50移动到存储在盒30中的基板W之间的底部和顶部的基板W的输送位置，并且这些输送位置被测量为机器人手50上的位置信息。基于测量位置信息在基板W的底部和顶部阶段以及定位系统中，计算存储在盒30的其他阶段中的基板W的机器人手50的输送位置的位置信息。使用这些位置信息将机器人手50移动到盒30的各个台阶以传送基板W.版权所有：（C）2011，JPO＆INPIT

3. 发明专利

JP2003048149A Quadrilateral substrate grinding device 有权
标题翻译：四极基板研磨装置
公开(公告)号：JP2003048149A
公开(公告)日：2003-02-18
申请号：JP2001240046
申请日：2001-08-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , ISHII YU , KOJIMA SHIYUNICHIROU , MORIYA JIRO , WATANABE MASATAKA , OKAZAKI SATOSHI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding device capable of finishing a surface of a quadrilateral photo mask substrate with excellent flatness, in particular, a grinding device capable of reducing any excessive grinding of a corner part of the photo mask substrate. SOLUTION: The grinding device 1 for grinding a photo mask substrate W with the quadrilateral outer periphery comprises a grinder 38 for grinding a surface W3 to be ground of the photo mask substrate W and a grinding head 21 which holds the photo mask substrate W and presses it against the grinder 38. The grinding head 21 has a quadrilateral opening 30 slightly larger than the outer peripheral quadrilateral photo mask substrate W, and has a guide ring 23 which can be pressed toward the grinder 38 independent from the substrate W.
摘要翻译：要解决的问题：提供一种能够完成平面度优异的四边形光掩模基板的表面的研磨装置，特别是能够减少光掩模基板的角部的过度研磨的研磨装置。解决方案：用于研磨具有四边形外周的光掩模基板W的研磨装置1包括用于研磨光掩模基板W的研磨面W3的研磨机38和保持光掩模基板W的研磨头21并压制研磨头21具有稍微大于外周四边形光掩模基板W的四边形开口30，并且具有能够独立于基板W而朝向研磨机38挤压的引导环23。

4. 发明专利

JP2011243911A Substrate conveyance method 有权
标题翻译：基板输送方法
公开(公告)号：JP2011243911A
公开(公告)日：2011-12-01
申请号：JP2010117125
申请日：2010-05-21
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , SONE CHUICHI , UMEMOTO MASAO , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , B65G49/07 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve throughput of a substrate conveyance system, by controlling the substrate conveying operation of a conveyance robot to omit or reduce a standby time of the conveyance robot, which conveys substrates and delivers substrates between itself and an In-line Thickness Monitor (ITM).SOLUTION: In a substrate conveyance method for conveying substrates with conveyance robots while one of the robots delivering substrates between itself and an In-line Thickness Monitor (ITM) for measuring thickness of the substrates, the ITM preliminary outputs an end notice signal a predetermined time before the measurement of the thickness of a substrate conveyed inside the ITM being finished, and the conveyance robot is controlled to start the substrate conveyance operation by preliminary receiving the end notice signal output from the ITM.
摘要翻译：要解决的问题：为了提高基板输送系统的生产能力，通过控制输送机器人的基板输送操作来省略或减少输送机器人的待机时间，该输送机器人传送基板并在其自身和In之间输送基板线路厚度监视器（ITM）。解决方案：在用于测量基板厚度的在线厚度监视器（ITM）中的机器人之间传送基板的一个机器人和用输送机器人输送基板的基板输送方法中，ITM初步输出结束通知信号在ITM内传送的基板的厚度的测量结束之前的预定时间，并且输送机器人被控制以通过预先接收从ITM输出的结束通知信号来开始基板输送操作。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2010258067A Substrate processing apparatus and substrate transfer method 审中-公开
标题翻译：基板加工设备和基板传输方法
公开(公告)号：JP2010258067A
公开(公告)日：2010-11-11
申请号：JP2009103719
申请日：2009-04-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , UMEMOTO MASAO , SONE CHUICHI , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , G01B21/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate transfer method, for reducing the decline of throughput.
SOLUTION: The substrate processing apparatus includes a measurement unit 10 and a transfer mechanism. The measurement unit 10 is provided with a measuring instrument 15 for measuring the state of a substrate W at a prescribed measuring position Pm, a first tray 11, a second tray 12, and a stage 16 for moving the substrate W between the prescribed measuring position Pm and the first tray 11 and the second tray 12. The transfer mechanism is provided with a robot hand 25 having a first holding part 21 and a second holding part 22 for holding the substrate W. Since the robot hand 25 which has mounted the substrate W to the first tray 11 takes out the substrate W after measurement to the outside of the measurement unit 10 without leaving the measurement unit 10, the substrates W before and after the measurement are replaced by the access of one time to the measurement unit 10, and the decline of the throughput is reduced.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减少吞吐量下降的基板处理装置和基板转印方法。解决方案：基板处理装置包括测量单元10和传送机构。测量单元10设置有用于测量在规定的测量位置Pm处的基板W的状态的测量仪器15，第一托盘11，第二托盘12和载物台16，用于使基板W在规定的测量位置 Pm和第一托盘11和第二托盘12.传送机构设置有具有第一保持部21和用于保持基板W的第二保持部22的机器人手25.由于安装了基板的机器人手25 W到第一托盘11，在测量单元10的外部将测量单元10的外部W取出而不离开测量单元10，测量之前和之后的基板W被替换为测量单元10一次，并且吞吐量的下降减少。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2000218522A POLISHING DEVICE 失效
公开(公告)号：JP2000218522A
公开(公告)日：2000-08-08
申请号：JP1965899
申请日：1999-01-28
申请人： EBARA CORP
发明人： OWADA SHIN , TAKAHASHI SABURO , OZAWA HIDEKAZU
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32
摘要： PROBLEM TO BE SOLVED: To operate stably and reduce a cost by preventing or reducing the shock and bite between a push-press ring and a top ring. SOLUTION: This device is provided with a polishing table having a polishing surface, a base plate hold member for holding a base plate W and push-pressing this to the polishing surface and a push-press ring 3, arranged around the base plate hold member, for push-pressing the polishing surface independently from the base plate hold member. A friction reduction mechanism 104 for reducing the friction between these vertical contact surfaces when both are moved relatively and vertically is provided on at least oneside of the push-press ring and base plate hold member.

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