专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014087908A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2014087908A
公开(公告)日：2014-05-15
申请号：JP2012240394
申请日：2012-10-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： UMEMOTO MASAO , ERIGUCHI MASAAKI , SONE CHUICHI , AIZAWA HIDEO , KOSUGE RYUICHI
IPC分类号： B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device having an atomizer cover that can prevent as much as possible liquid rebounding from a polished surface from remaining on an inner peripheral surface and further can be comparatively easily cleaned by cleaning liquid.SOLUTION: The polishing device comprises: a rotatable polishing table 12 with a polishing face 10a; and an atomizer 40 whose upper face is covered with an atomizer cover 42 and which injects fluid against the polishing face 10a of the polishing table 12 to clean the polishing face 10a. The atomizer cover 42 has: a semicircle-shaped apical plate 50 in which a first arc-shaped apical plate 50a having a contant radius and a second arc-shaped apical plate 50b with a radius gradually decreasing from the base end toward the apical end are connected to each other at the top thereof; and a pair of lateral plates 52 and 54 that continuously hang down from the apical plate 50.
摘要翻译：要解决的问题：提供一种具有雾化器盖的抛光装置，其可以尽可能多地防止从抛光表面的液体反弹残留在内周面上，并且还可以相对容易地通过清洗液体清洁。抛光装置包括：具有抛光面10a的可旋转抛光台12; 以及雾化器40，其上表面被雾化器盖42覆盖，并且将流体喷射到抛光台12的抛光面10a上以清洁抛光面10a。雾化器盖42具有：半圆形顶座板50，其具有从基端朝向顶端的半径逐渐减小的具有约半径的第一弧形顶片50a和第二弧形顶点板50b，在其顶部彼此连接; 以及从顶板50连续地下垂的一对侧板52和54。

2. 发明专利

JP2011243911A Substrate conveyance method 有权
标题翻译：基板输送方法
公开(公告)号：JP2011243911A
公开(公告)日：2011-12-01
申请号：JP2010117125
申请日：2010-05-21
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , SONE CHUICHI , UMEMOTO MASAO , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , B65G49/07 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To improve throughput of a substrate conveyance system, by controlling the substrate conveying operation of a conveyance robot to omit or reduce a standby time of the conveyance robot, which conveys substrates and delivers substrates between itself and an In-line Thickness Monitor (ITM).SOLUTION: In a substrate conveyance method for conveying substrates with conveyance robots while one of the robots delivering substrates between itself and an In-line Thickness Monitor (ITM) for measuring thickness of the substrates, the ITM preliminary outputs an end notice signal a predetermined time before the measurement of the thickness of a substrate conveyed inside the ITM being finished, and the conveyance robot is controlled to start the substrate conveyance operation by preliminary receiving the end notice signal output from the ITM.
摘要翻译：要解决的问题：为了提高基板输送系统的生产能力，通过控制输送机器人的基板输送操作来省略或减少输送机器人的待机时间，该输送机器人传送基板并在其自身和In之间输送基板线路厚度监视器（ITM）。解决方案：在用于测量基板厚度的在线厚度监视器（ITM）中的机器人之间传送基板的一个机器人和用输送机器人输送基板的基板输送方法中，ITM初步输出结束通知信号在ITM内传送的基板的厚度的测量结束之前的预定时间，并且输送机器人被控制以通过预先接收从ITM输出的结束通知信号来开始基板输送操作。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011023604A Method of controlling robot for substrate transfer for cassette 有权
标题翻译：控制CASSETTE基板传送机器人的方法
公开(公告)号：JP2011023604A
公开(公告)日：2011-02-03
申请号：JP2009168136
申请日：2009-07-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , SONE CHUICHI , UMEMOTO MASAO , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , B25J9/22 , B65G49/07
摘要： PROBLEM TO BE SOLVED: To provide a method of controlling a robot for substrate transfer for a cassette, wherein substrates in respective stages of the cassette can be precisely delivered by a robot hand through simple sensorless teaching. SOLUTION: The cassette 30 for storing the substrates W in a plurality of stages and the robot 70 for substrate transfer configured to deliver the substrates W to the respective stages in the cassette 30 using the robot hand 50 are prepared. The robot hand 50 is moved to delivery positions for the substrates W in the bottom and top stages among the substrates W stored in the cassette 30, and those delivery positions are measured as position information on the robot hand 50. Based upon the measured position information on the bottom and top stages of the substrates W, and a positioning system, position information on delivery positions of the robot hand 50 for substrates W stored in other stages of the cassette 30 is calculated. The robot hand 50 is moved to the respective stages of the cassette 30 using those pieces of position information to deliver the substrates W. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种控制用于盒的基板传送的机器人的方法，其中通过简单的无传感器教导，可以通过机器人手将盒的各个阶段中的基板精确地传送。＆lt; P＆gt;解决方案：准备用于存储多层的基板W的盒30和用于基板传送的机器人70，其被配置为使用机器人手50将基板W传送到盒30中的各个台。机器人手50移动到存储在盒30中的基板W之间的底部和顶部的基板W的输送位置，并且这些输送位置被测量为机器人手50上的位置信息。基于测量位置信息在基板W的底部和顶部阶段以及定位系统中，计算存储在盒30的其他阶段中的基板W的机器人手50的输送位置的位置信息。使用这些位置信息将机器人手50移动到盒30的各个台阶以传送基板W.版权所有：（C）2011，JPO＆INPIT

4. 发明专利

JP2014151381A Flow rate control device of liquid used for polishing device 有权
标题翻译：用于抛光装置的液体流速控制装置
公开(公告)号：JP2014151381A
公开(公告)日：2014-08-25
申请号：JP2013021457
申请日：2013-02-06
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ERIGUCHI MASAAKI , USHIMARU SEIYA
IPC分类号： B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a flow rate control device in which a flow rate regulating valve of a dressing liquid and/or nozzle cleaning liquid can be easily operated while protecting a device arranged in the flow rate control device from a liquid such as a polishing liquid and the dressing liquid.SOLUTION: Polishing liquid transfer pipes 130, 131, 132, flow rate sensors 134, 135, 136 for measuring a flow rate of a polishing liquid flowing in the polishing liquid transfer pipes 130, 131, 132, a dressing liquid transfer pipe 110 in which a dressing liquid flows, and a dressing liquid flow rate regulating valve 112 which regulates a flow rate of the dressing liquid flowing in the dressing liquid transfer pipe 110 are arranged in a housing container 104. An opening part 104b is formed on the housing container 104 in a position corresponding to the dressing liquid flow rate regulating valve 112, and the housing container 104 includes a lid member 106 for covering the opening part 104b.
摘要翻译：要解决的问题：提供一种流量控制装置，其中可以容易地操作修整液和/或喷嘴清洁液体的流量调节阀，同时保护布置在流量控制装置中的装置免受诸如研磨液和敷料液。溶液：用于测量在抛光液体输送管130,131,132中流动的研磨液的流量的抛光液传输管130,131,132，流量传感器134,135,136，a 敷料液体流通的敷料液体输送管110和调节在修整液输送管110中流动的修补液的流量的调剂液体流量调节阀112配置在容纳容器104内。开口部104b 形成在与敷料液流量调节阀112对应的位置的容纳容器104上，容纳容器104包括用于覆盖开口部104b的盖部件106 。

5. 发明专利

JP2010258067A Substrate processing apparatus and substrate transfer method 审中-公开
标题翻译：基板加工设备和基板传输方法
公开(公告)号：JP2010258067A
公开(公告)日：2010-11-11
申请号：JP2009103719
申请日：2009-04-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OZAWA HIDEKAZU , UMEMOTO MASAO , SONE CHUICHI , MOTOJIMA YASUYUKI , ERIGUCHI MASAAKI
IPC分类号： H01L21/677 , G01B21/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate transfer method, for reducing the decline of throughput.
SOLUTION: The substrate processing apparatus includes a measurement unit 10 and a transfer mechanism. The measurement unit 10 is provided with a measuring instrument 15 for measuring the state of a substrate W at a prescribed measuring position Pm, a first tray 11, a second tray 12, and a stage 16 for moving the substrate W between the prescribed measuring position Pm and the first tray 11 and the second tray 12. The transfer mechanism is provided with a robot hand 25 having a first holding part 21 and a second holding part 22 for holding the substrate W. Since the robot hand 25 which has mounted the substrate W to the first tray 11 takes out the substrate W after measurement to the outside of the measurement unit 10 without leaving the measurement unit 10, the substrates W before and after the measurement are replaced by the access of one time to the measurement unit 10, and the decline of the throughput is reduced.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减少吞吐量下降的基板处理装置和基板转印方法。解决方案：基板处理装置包括测量单元10和传送机构。测量单元10设置有用于测量在规定的测量位置Pm处的基板W的状态的测量仪器15，第一托盘11，第二托盘12和载物台16，用于使基板W在规定的测量位置 Pm和第一托盘11和第二托盘12.传送机构设置有具有第一保持部21和用于保持基板W的第二保持部22的机器人手25.由于安装了基板的机器人手25 W到第一托盘11，在测量单元10的外部将测量单元10的外部W取出而不离开测量单元10，测量之前和之后的基板W被替换为测量单元10一次，并且吞吐量的下降减少。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式