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1. 发明专利

JP2009176626A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2009176626A
公开(公告)日：2009-08-06
申请号：JP2008015472
申请日：2008-01-25
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
CPC分类号： H01R12/721 , H01R4/242 , H01R12/79 , Y10T29/49222
摘要： PROBLEM TO BE SOLVED: To multistage and install a conductive path conductive to a plurality of contact terminals in the direction perpendicular to an electronic substrate surface while forming those contact terminals on the same plane of the electronic substrate. SOLUTION: A connection terminal 5 is provided of which one end is connected to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, and which extends toward the direction separating from the surface of the electronic substrate 31 in the direction perpendicular to the surface of the electronic substrate 31, and has a through-groove 5b through which a conductor part 19b of a harness 19 penetrates. Accordingly, a first connector pin 10 electrically connected to a head contact terminal 32 of the electronic substrate 31, and the tip of the connection terminal 5 electrically connected to the inside contact terminal 33 can be installed with sufficient intervals in the direction perpendicular to the surface of the electronic substrate 31. As a result, harnesses 18, 19 become possible to be multistaged and provided which form conductive paths conductive to the head contact terminal 32 and the inside contact terminal 33, respectively. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在电子基板的同一平面上形成这些接触端子的同时，在垂直于电子基板表面的方向上多级并且安装导电到多个接触端子的导电路径。解决方案：设置连接端子5，其一端连接到与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，并且朝向与电子基板31沿着与电子基板31的表面垂直的方向，并具有贯通槽5b，线束19的导体部19b穿过该贯通槽5b。因此，电连接到电子基板31的头接触端子32的第一连接器引脚10和电连接到内部接触端子33的连接端子5的末端可以在垂直于表面的方向上具有足够的间隔结果，线束18,19成为可能的多级并且设置成分别形成导电路径，导电到头部接触端子32和内部接触端子33。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009176625A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2009176625A
公开(公告)日：2009-08-06
申请号：JP2008015471
申请日：2008-01-25
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
CPC分类号： H01R13/5205 , H01R31/06 , Y10T29/49002
摘要： PROBLEM TO BE SOLVED: To provide a card edge connector capable of multi-staging connector terminals (contact conductors) in the direction perpendicular to an electronic substrate surface while forming contact terminals on the same plane of an electronic substrate with sufficient intervals. SOLUTION: With respect to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, a third connector pin 13 as an auxiliary contact conductor is provided, and these second connector pin 4 and third connector pin 13 are electrically connected by a coupling conductor 5. The third connector pin 13 is positioned at a height position which is more separated from the surface of the electronic substrate 31 than a first connector pin 10. Accordingly, even if a head contact terminal 32 and the inside contact terminal 33 are formed along the insertion direction of the electronic substrate 31, the first connector pin 10 and the third connector pin 13 electrically connected to them, respectively, become possible to be multistaged and provided in the direction perpendicular to the electronic substrate surface with sufficient intervals. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够在垂直于电子基板表面的方向上多级连接器端子（接触导体）的卡缘连接器，同时以足够的间隔在电子基板的同一平面上形成接触端子。解决方案：对于与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，设置作为辅助接触导体的第三连接器引脚13，并且这些第二连接器引脚4和第三连接器销13通过耦合导体5电连接。第三连接器针13位于比第一连接器针10更离开电子基板31的表面的高度位置。因此，即使头部接触端子32 并且沿着电子基板31的插入方向形成内部接触端子33，分别与它们电连接的第一连接器引脚10和第三连接器引脚13可以是多个并沿垂直于电子的方向设置的基板表面有足够的间隔。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009181801A Board connection structure 审中-公开
标题翻译：板连接结构
公开(公告)号：JP2009181801A
公开(公告)日：2009-08-13
申请号：JP2008019578
申请日：2008-01-30
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
IPC分类号： H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a board connection structure which can perform electrical connection between a plurality of boards with a simple structure and is capable of coping with a large current flow. SOLUTION: A plurality of contact conductors 16, 17 which contacts contact terminals 5, 6 of a first electronic board 2 are installed in a housing of a card edge connector 40, and a plurality of contact conductors 18, 19 which contact the contact terminals 10. 11 of a second electronic board 7 are installed in the housing, and furthermore, connecting conductors 20, 21 which connect one of a plurality of contact conductors to contact the contact terminals 5, 6 of the first electronic board 2 and one of the plurality of contact conductor to contact the contact terminals 10, 11 of the second electronic board 7 are installed. Thereby, by only inserting the first electronic board 2 and the second electronic board 7 in the respective insertion holes of the housing 15, the first electronic board 2 and the second electronic board 7 can be electrically connected. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以简单结构在多个板之间进行电连接并能够应对大电流的板连接结构。解决方案：与第一电子板2的接触端子5,6接触的多个接触导体16,17安装在卡缘连接器40的壳体中，以及多个接触导体18,19接触第二电子基板7的接触端子10.11安装在壳体中，此外，连接导体20,21连接多个接触导体中的一个接触导体以接触第一电子板2的接触端子5,6和一个与第二电子板7的接触端子10,11接触的多个接触导体。因此，通过仅将第一电子基板2和第二电子基板7插入到壳体15的各个插入孔中，第一电子基板2和第二电子基板7也可以电连接。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2012007497A Electric compressor 有权
标题翻译：电动压缩机
公开(公告)号：JP2012007497A
公开(公告)日：2012-01-12
申请号：JP2010141804
申请日：2010-06-22
申请人： Denso Corp , 株式会社デンソー
发明人： HIGO NORIHITO , YAMADA MASAO , KAMIYA HIROTERU
IPC分类号： F04B39/00
摘要： PROBLEM TO BE SOLVED: To provide an electric compressor which can be miniaturized by simplifying the structure of a through terminal section.SOLUTION: The through terminal section 16 has such a simple structure that a substantially cylindrical insulating cylinder member 162 made of a rubber material or a polymer alloy material containing rubber is interposed between a substantially columnar through pin member 161 and a substantially cylindrical pressure-fit compression ring 163. The through terminal section 16 is pressure-fitted into a through hole 1d formed in a housing 1. Thereby, the peripheral surface of the pressure-fit compression ring 163 is brought into pressure contact with the inner surface of the through hole 1d formed in the housing 1 over the whole periphery so that a portion between the pressure-fit compression ring 163 and the housing 1 is airtightly sealed, and also the pressure-fit compression ring 163 is reduced in diameter in association with pressure-fitting to compress the insulating cylinder member 162 in a radial direction so that a portion between the through pin member 161 and the pressure-fit compression ring 163 is airtightly sealed while being insulated.
摘要翻译：要解决的问题：提供一种能够通过简化通过端子部的结构而能够小型化的电动压缩机。解决方案：贯通端子部分16具有如下简单结构：将由橡胶材料制成的大致圆柱形的绝缘圆筒部件162或含有橡胶的聚合物合金材料插入到大致圆柱形的销构件161和基本上圆柱形的压力通过端子部16压入形成在壳体1中的通孔1d中。由此，压配合压缩环163的周面与内侧面通孔1d形成在壳体1的整个周边上，使得压配合压缩环163与壳体1之间的部分被气密地密封，并且压配合压缩环163的直径也随压力 - 适合于在径向方向上压缩绝缘圆筒构件162，使得贯通销构件161和压配合体162之间的部分压环163在绝缘时气密密封。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2009218441A Multilayer circuit board, and method for manufacturing the same 审中-公开
标题翻译：多层电路板及其制造方法
公开(公告)号：JP2009218441A
公开(公告)日：2009-09-24
申请号：JP2008061740
申请日：2008-03-11
申请人： Denso Corp , 株式会社デンソー
发明人： KAMIYA HIROTERU , SHIMIZU MOTONORI , KONDO KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer circuit board in which cracks are hardly generated in an insulating base existing around a chip component, and to provide a method for manufacturing the multilayer circuit board.
SOLUTION: In the multilayer circuit board 100, the insulating base 1 is formed by sticking resin films composed of thermoplastic resin and the chip component is buried in the insulating base 1. intermediate insulating materials 5a, 5b of which the coefficient of thermal expansion in a base thickness direction (Z direction) is a middle between that of the insulating base 1 and that of the chip component 3 are arranged so as to be abutted on the side face of the chip component 3 in the base thickness direction (Z direction).
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在芯片部件周围的绝缘基体中几乎不产生裂纹的多层电路板，并提供一种多层电路板的制造方法。解决方案：在多层电路板100中，绝缘基体1通过粘附由热塑性树脂构成的树脂膜形成，并且芯片部件被埋在绝缘基底1中。其中的绝热材料5a，5b的热导率基底厚度方向（Z方向）的膨胀是绝缘基体1与芯片部件3的间隔的中间，以与基板厚度方向（Z）的芯片部件3的侧面抵接的方式方向）。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008141007A Method for manufacturing multilayer substrate 审中-公开
标题翻译：制造多层基板的方法
公开(公告)号：JP2008141007A
公开(公告)日：2008-06-19
申请号：JP2006326152
申请日：2006-12-01
申请人： Denso Corp , 株式会社デンソー
发明人： KAMIYA HIROTERU
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/04105 , H01L2224/19 , H01L2224/25 , H01L2224/2518 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer substrate which decreases the stress acting on electronic components, embedded in the multilayer substrate and can suppress the electronic components from receiving damages. SOLUTION: The height A of an electronic component 30 is smaller than the thickness B of a resin film 11c, formed with a through hole 15 for inserting the electronic part 30 (A COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造多层基板的方法，其减少了嵌入在多层基板中的电子部件上的应力，并且能够抑制电子部件的损伤。解决方案：电子部件30的高度A小于树脂膜11c的厚度B，树脂膜11c形成有用于插入电子部件30的通孔15（A

7. 发明专利

JP2011247215A Electric compressor 有权
标题翻译：电动压缩机
公开(公告)号：JP2011247215A
公开(公告)日：2011-12-08
申请号：JP2010123227
申请日：2010-05-28
申请人： Denso Corp , 株式会社デンソー
发明人： HIGO NORIHITO , YAMADA MASAO , KAMIYA HIROTERU
IPC分类号： F04B39/06 , F04B39/00 , F04B39/12
摘要： PROBLEM TO BE SOLVED: To provide an electric compressor which can improve cooling of a drive circuit part.SOLUTION: An opening 9 is formed in a housing 1 and a plate 50 is arranged so that the opening 9 is blocked and the back surface 50b faces a cooling medium flow passage 60. A thermal insulation gasket 51 made of a material with a thermal conductivity lower than the materials of the housing 1 and the plate 50 is arranged between the housing 1 and the plate 50. On the front surface 50a of the plate 50, a first substrate 21 with a built-in power element 214 of an inverter circuit 20 which is a drive circuit part is mounted.
摘要翻译：要解决的问题：提供一种可以改善驱动电路部件的冷却的电动压缩机。解决方案：开口9形成在壳体1中，并且板50布置成使得开口9被阻挡，并且后表面50b面向冷却介质流动通道60.由绝缘垫圈51制成的绝热垫圈51 在壳体1和板50之间布置有低于壳体1和板50的材料的导热率。在板50的前表面50a上，具有内置功率元件214的第一基板21 安装作为驱动电路部的逆变器电路20。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2009224401A Manufacturing method of multilayer circuit board 审中-公开
标题翻译：多层电路板的制造方法
公开(公告)号：JP2009224401A
公开(公告)日：2009-10-01
申请号：JP2008064663
申请日：2008-03-13
申请人： Denso Corp , 株式会社デンソー
发明人： KAMIYA HIROTERU , TAKEUCHI SATOSHI , KONDO KOJI , SHIMIZU MOTONORI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board hardly causing a crack in an insulation base material around a chip component, and capable of suppressing increase of manufacturing cost.
SOLUTION: In this manufacturing method of a multilayer circuit board, through-holes H6a-H6d or conductor patterns are formed on a plurality of resin films 6a-6d, respectively, so that first distances A6a, A6d between end surfaces of resin films 6a, 6d in MD of one or more resin films 6a, 6d within a plurality of resin films 6a-6d, and an end surface of the chip component 3, or second distances between end surfaces of the conductor patterns 2 formed on the resin films and the end surface of the chip component 3 are set smaller than first distances A6b, A6c or the second distances in the MD of the other resin films 6b, 6c when the chip component 3 is inserted and arranged in a housing space S6 in a resin film preparation process.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种难以在芯片部件周围的绝缘基材中引起裂纹的多层电路板的制造方法，并且能够抑制制造成本的增加。解决方案：在这种多层电路板的制造方法中，分别在多个树脂膜6a-6d上形成通孔H6a-H6d或导体图案，使得在树脂的端面之间的第一距离A6a，A6d 在多个树脂膜6a-6d中的一个或多个树脂膜6a，6d的MD中的膜6a，6d和芯片部件3的端面，或形成在树脂上的导体图案2的端面之间的第二距离当芯片部件3插入并布置在壳体空间S6中时，将片和芯片部件3的端面设置为小于第一距离A6b，A6c或其他树脂膜6b，6c的MD中的第二距离树脂膜制备工艺。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008263116A Method of manufacturing electronic component built-in board 审中-公开
标题翻译：制造电子元件内置板的方法
公开(公告)号：JP2008263116A
公开(公告)日：2008-10-30
申请号：JP2007105742
申请日：2007-04-13
申请人： Denso Corp , 株式会社デンソー
发明人： SHIMIZU MOTONORI , TAKEUCHI SATOSHI , KAMIYA HIROTERU
IPC分类号： H05K13/04 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component built-in board which can reduce the improper mounting of an electronic component. SOLUTION: A hole is formed at a board to have a depth equal to the height of an electronic component 40 inserted in the hole. The electronic component 40 is stored in a component storing section 31 provided at a component storing member 30 for supply. A component mounting device includes a nozzle 13a having an absorption surface 13b covering the component storing section 31. After the electronic component 40 stored in the component storing section 31 has been stuck to the absorption surface 13b of the nozzle 13a, the absorption surface 13b of the nozzle 13a is moved to the surface of the board and the electronic component 40 is inserted into the hole. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造电子部件内置板的方法，其可以减少电子部件的不正确安装。解决方案：在板上形成一个孔，其深度等于插入孔中的电子元件40的高度。电子部件40被存储在设置在部件存储部件30供给的部件收容部31中。部件安装装置包括具有覆盖部件收容部31的吸收面13b的喷嘴13a。在容纳在部件收纳部31中的电子部件40已经粘贴在喷嘴13a的吸收面13b上之后，吸收面13b 喷嘴13a移动到板的表面，电子部件40插入孔中。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2004209425A Recycling method and recycling apparatus for printed circuit board 有权
公开(公告)号：JP2004209425A
公开(公告)日：2004-07-29
申请号：JP2003001238
申请日：2003-01-07
申请人： Denso Corp , 株式会社デンソー
发明人： KAMIMURA RIKIYA , KAMIYA HIROTERU , SAKAIDA ATSUSUKE , KONDO KOJI
IPC分类号： B09B5/00 , B01D39/14 , B01D39/20 , B09B3/00 , B29B17/02 , B29B17/04 , H05K3/00
CPC分类号： Y02W30/625 , Y02W30/82 , Y02W30/822
摘要： PROBLEM TO BE SOLVED: To provide a recycling method for a printed circuit board which can prevent a metal from being contained in a resin separated and recovered by a resin/metal separating process even if a part of paste remains on the wasted printed circuit board in a manufacturing process, and a recycling apparatus for the same. SOLUTION: In the recycling method for the printed circuit board comprising the steps of heating the wasted printed circuit board 100 to a temperature capable of softening the board and allowing passage of only the resin 2a by filtering for separating and collecting the resin 2a and the metal 2b, the printed circuit board 101 having conductor patterns 22 formed in a plurality of layers on an insulation substrate 23 made of the thermoplastic resin 2a and a conductive composition 51 for connecting the patterns 22 with one another which composition comprises a metal paste 50 made of a first metal 61 having a melting point lower than the melting point of the resin 2a and a second metal 62 capable of being sintered with the first metal 61 is used, and the material of the filter 17 for allowing the passage of only the resin for filtering is a metallic material chemically reacting with the first metal 61 to produce an intermetallic compound having a melting point higher than a specified temperature. COPYRIGHT: (C)2004,JPO&NCIPI

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