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1. 发明专利

JP2011028994A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2011028994A
公开(公告)日：2011-02-10
申请号：JP2009173420
申请日：2009-07-24
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HIRONAKA YOSHIO , IIDA TAKU , KAMIYA TAKASHI , MIYAKE TOSHIHIRO , HORI MASAFUMI
IPC分类号： H01R12/72
CPC分类号： H01R12/721 , H01R12/82 , H01R13/11 , H01R13/41 , H01R31/06
摘要： PROBLEM TO BE SOLVED: To provide a card edge connector with an electronic substrate whose physical size is suppressed from being increased, and to provide a method for assembling the same. SOLUTION: The card edge connector is provided for electrically connecting a plurality of contact electrodes which are formed on the same flat surface at the end of the electronic substrate to a plurality of harnesses which are drawn to the outside when the electronic substrate is inserted at its end therein. Each relay terminal for electrically connecting a terminal to the contact electrode consists of a terminal contact portion extending from the housing face of a housing holding the electronic substrate and the terminal to the terminal of the harness, a connection portion connected to the end on the housing face side of the terminal contact portion and extending from a connection portion to the terminal contact portion along the housing face to an electronic substrate insertion hole, and an electrode contact portion protruded into the electronic substrate insertion hole while being connected to the end on the electronic substrate insertion hole side of the connection portion. The electrode contact portion is shaped to be bent at least once each in the inserting direction of the electronic substrate and in the opposite direction to the inserting direction. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有抑制物理尺寸的电子基板的卡缘连接器的增加，并提供其组装方法。解决方案：卡边缘连接器用于将形成在电子基板端部的同一平面上的多个接触电极电连接到多个线束，当电子基板为插入其末端。用于将端子电连接到接触电极的每个继电器端子包括从容纳电子基板和端子的壳体的壳体面延伸到端子到端子的端子接触部分，连接到壳体的端部的连接部分在端子接触部的正面侧并且从连接部向端子接触部沿着壳体面延伸到电子基板插入孔，以及电极接触部，该电极接触部在与电子基板的端部连接的同时突出到电子基板插入孔基板插入孔侧。电极接触部分被成形为在电子基板的插入方向上沿着与插入方向相反的方向至少弯曲一次。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011028993A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2011028993A
公开(公告)日：2011-02-10
申请号：JP2009173419
申请日：2009-07-24
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： KAMIYA TAKASHI , IIDA TAKU , HIRONAKA YOSHIO , MIYAKE TOSHIHIRO , HORI MASAFUMI
IPC分类号： H01R12/72 , H01R43/00
CPC分类号： H01R12/721 , H01R12/7082 , H01R12/778 , H01R13/24 , H01R31/06 , Y10T29/49204
摘要： PROBLEM TO BE SOLVED: To provide a card edge connector having reduced manufacturing cost, and to provide a method for assembling the same. SOLUTION: The card edge connector is provided for electrically connecting a plurality of contact electrodes which are formed on the same flat surface at the end of an electronic substrate, to a plurality of harnesses which are drawn to the outside, when the electronic substrate is inserted at its end thereinto. The terminals of the harnesses each have a first female terminal, and a second female terminal located farther from the flat surface of the electronic substrate in the direction perpendicular to the flat surface of the electronic substrate where the contact electrode is formed, than the first female terminal. The contact electrodes each have a first contact electrode located at the head of the electronic substrate in its inserting direction, and a second contact electrode located further inside the electronic substrate than the first contact electrode. The housing has a plurality of relay terminals for electrically connecting the terminals of the harnesses to the contact electrodes. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种降低制造成本的卡边连接器，并提供一种组装该卡边连接器的方法。解决方案：卡边缘连接器被设置用于将形成在电子基板的端部的同一平面上的多个接触电极电连接到被吸引到外部的多个线束，当电子衬底在其末端插入。线束的端子各自具有第一阴端子和第二阴端子，该第二阴端子与电子基板的平坦表面在垂直于形成有接触电极的电子基板的平坦表面的方向上比第一阴极终奌站。接触电极各自具有位于电子基板的插入方向的头部的第一接触电极和位于电子基板内部比第一接触电极更靠内侧的第二接触电极。壳体具有用于将线束的端子与接触电极电连接的多个中继端子。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2009181801A Board connection structure 审中-公开
标题翻译：板连接结构
公开(公告)号：JP2009181801A
公开(公告)日：2009-08-13
申请号：JP2008019578
申请日：2008-01-30
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
IPC分类号： H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a board connection structure which can perform electrical connection between a plurality of boards with a simple structure and is capable of coping with a large current flow. SOLUTION: A plurality of contact conductors 16, 17 which contacts contact terminals 5, 6 of a first electronic board 2 are installed in a housing of a card edge connector 40, and a plurality of contact conductors 18, 19 which contact the contact terminals 10. 11 of a second electronic board 7 are installed in the housing, and furthermore, connecting conductors 20, 21 which connect one of a plurality of contact conductors to contact the contact terminals 5, 6 of the first electronic board 2 and one of the plurality of contact conductor to contact the contact terminals 10, 11 of the second electronic board 7 are installed. Thereby, by only inserting the first electronic board 2 and the second electronic board 7 in the respective insertion holes of the housing 15, the first electronic board 2 and the second electronic board 7 can be electrically connected. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以简单结构在多个板之间进行电连接并能够应对大电流的板连接结构。解决方案：与第一电子板2的接触端子5,6接触的多个接触导体16,17安装在卡缘连接器40的壳体中，以及多个接触导体18,19接触第二电子基板7的接触端子10.11安装在壳体中，此外，连接导体20,21连接多个接触导体中的一个接触导体以接触第一电子板2的接触端子5,6和一个与第二电子板7的接触端子10,11接触的多个接触导体。因此，通过仅将第一电子基板2和第二电子基板7插入到壳体15的各个插入孔中，第一电子基板2和第二电子基板7也可以电连接。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2011028856A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2011028856A
公开(公告)日：2011-02-10
申请号：JP2009170311
申请日：2009-07-21
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： MIYAKE TOSHIHIRO , KAMIYA TAKASHI , IIDA TAKU , HIRONAKA YOSHIO , HORI MASAFUMI
IPC分类号： H01R12/72 , H01R12/50 , H01R13/41 , H01R13/52 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive electronic device with a simple structure in which an electronic circuit board is stored in a box-like case and which achieves the miniaturization of a connector by narrowing an interval between terminal units and prevents adhesion of dust or water-droplets to the electronic circuit board. SOLUTION: The electronic device 100 has an electronic circuit board 10, a case 20 for storing the electronic circuit board 10, and a connector housing 30 for covering the case 20. While the electronic circuit board 10 is stored in the case 20 and is covered with the connector housing 30, one ends 31a, 32a of connector pins 31, 32 provided in the connector housing 30 are brought into contact with terminal units 11, 12 provided on the electronic circuit board 10 so as to electrically connect between the connector pins 31, 32 and the electronic circuit board 10. The other ends 31b, 32b are exposed to the outside of the covered case 20 so as to function as a connector for connecting to the external wiring. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种廉价的电子设备，其结构简单，其中电子电路板被存储在盒状壳体中，并且通过缩小端子单元之间的间隔并且防止粘附而实现连接器的小型化的灰尘或水滴到电子电路板。电子设备100具有电子电路板10，用于存储电子电路板10的壳体20和用于覆盖壳体20的连接器壳体30.当电子电路板10被存储在壳体20中时并且被连接器壳体30覆盖，设置在连接器壳体30中的连接器销31,32的一端31a，32a与设置在电子电路板10上的端子单元11,12接触，以便电连接连接器针脚31,32和电子电路板10.另一端部31b，32b暴露于被覆盖壳体20的外侧，以作为连接到外部配线的连接器。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011028995A Card edge connector and method of assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2011028995A
公开(公告)日：2011-02-10
申请号：JP2009173421
申请日：2009-07-24
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： IIDA TAKU , KAMIYA TAKASHI , HIRONAKA YOSHIO , MIYAKE TOSHIHIRO , HORI MASAFUMI
IPC分类号： H01R12/72
CPC分类号： H01R12/721 , H01R4/185 , H01R13/2442 , H01R13/5208 , H01R13/5219 , H01R24/60 , H01R2107/00 , H05K1/117 , H05K2201/09709 , H05K2203/1572 , Y10T29/49826
摘要： PROBLEM TO BE SOLVED: To provide a card edge connector having improved robustness to the arrangement tolerance of a relay terminal and robustness to electrical connection between the relay terminal and a contact electrode, and to provide a method of assembling the same. SOLUTION: The card edge connector is provided for electrically connecting the plurality of contact electrodes which are formed on the same flat surface at the end of an electronic substrate, to a plurality of harnesses which are drawn to the outside, when the electronic substrate is inserted at its end thereinto. One end of the relay terminal which contacts the contact electrode formed on the surface of the electronic substrate and one end of the relay terminal which contacts the contact electrode formed on the backside of the electronic substrate are arranged along the inserting direction. One end of the relay terminal which contacts the contact electrode formed on the surface extends from the surface of the electronic substrate via a center line passing through the center of the electronic substrate to the backside thereof, and one end of the relay terminal which contacts the contact electrode formed on the backside extends from the backside via the center line to the surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种卡边缘连接器，其具有对继电器端子的布置公差的鲁棒性以及中继端子和接触电极之间的电连接的鲁棒性，并提供其组装方法。解决方案：卡边缘连接器被设置用于将形成在电子基板的端部处的同一平面上的多个接触电极电连接到被吸引到外部的多个线束，当电子衬底在其末端插入。与形成在电子基板的表面上的接触电极接触的中继端子的一端与形成在电子基板的背面的接触电极接触的中继端子的一端沿插入方向配置。与形成在表面上的接触电极接触的中继端子的一端从电子基板的表面经由穿过电子基板的中心的中心线延伸到其背面，中继端子的一端与形成在背面的接触电极通过中心线从背面延伸到表面。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2009176626A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2009176626A
公开(公告)日：2009-08-06
申请号：JP2008015472
申请日：2008-01-25
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
CPC分类号： H01R12/721 , H01R4/242 , H01R12/79 , Y10T29/49222
摘要： PROBLEM TO BE SOLVED: To multistage and install a conductive path conductive to a plurality of contact terminals in the direction perpendicular to an electronic substrate surface while forming those contact terminals on the same plane of the electronic substrate. SOLUTION: A connection terminal 5 is provided of which one end is connected to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, and which extends toward the direction separating from the surface of the electronic substrate 31 in the direction perpendicular to the surface of the electronic substrate 31, and has a through-groove 5b through which a conductor part 19b of a harness 19 penetrates. Accordingly, a first connector pin 10 electrically connected to a head contact terminal 32 of the electronic substrate 31, and the tip of the connection terminal 5 electrically connected to the inside contact terminal 33 can be installed with sufficient intervals in the direction perpendicular to the surface of the electronic substrate 31. As a result, harnesses 18, 19 become possible to be multistaged and provided which form conductive paths conductive to the head contact terminal 32 and the inside contact terminal 33, respectively. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在电子基板的同一平面上形成这些接触端子的同时，在垂直于电子基板表面的方向上多级并且安装导电到多个接触端子的导电路径。解决方案：设置连接端子5，其一端连接到与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，并且朝向与电子基板31沿着与电子基板31的表面垂直的方向，并具有贯通槽5b，线束19的导体部19b穿过该贯通槽5b。因此，电连接到电子基板31的头接触端子32的第一连接器引脚10和电连接到内部接触端子33的连接端子5的末端可以在垂直于表面的方向上具有足够的间隔结果，线束18,19成为可能的多级并且设置成分别形成导电路径，导电到头部接触端子32和内部接触端子33。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009176625A Card edge connector and method for assembling the same 有权
标题翻译：卡边缘连接器及其装配方法
公开(公告)号：JP2009176625A
公开(公告)日：2009-08-06
申请号：JP2008015471
申请日：2008-01-25
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HORI MASAFUMI , IIDA TAKU , MATSUMURA YASUSHI , HIRONAKA YOSHIO , KAMIYA TAKASHI , HIRAMATSU SATOSHI , MIYAKE TOSHIHIRO , KAMIYA HIROTERU
CPC分类号： H01R13/5205 , H01R31/06 , Y10T29/49002
摘要： PROBLEM TO BE SOLVED: To provide a card edge connector capable of multi-staging connector terminals (contact conductors) in the direction perpendicular to an electronic substrate surface while forming contact terminals on the same plane of an electronic substrate with sufficient intervals. SOLUTION: With respect to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, a third connector pin 13 as an auxiliary contact conductor is provided, and these second connector pin 4 and third connector pin 13 are electrically connected by a coupling conductor 5. The third connector pin 13 is positioned at a height position which is more separated from the surface of the electronic substrate 31 than a first connector pin 10. Accordingly, even if a head contact terminal 32 and the inside contact terminal 33 are formed along the insertion direction of the electronic substrate 31, the first connector pin 10 and the third connector pin 13 electrically connected to them, respectively, become possible to be multistaged and provided in the direction perpendicular to the electronic substrate surface with sufficient intervals. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够在垂直于电子基板表面的方向上多级连接器端子（接触导体）的卡缘连接器，同时以足够的间隔在电子基板的同一平面上形成接触端子。解决方案：对于与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，设置作为辅助接触导体的第三连接器引脚13，并且这些第二连接器引脚4和第三连接器销13通过耦合导体5电连接。第三连接器针13位于比第一连接器针10更离开电子基板31的表面的高度位置。因此，即使头部接触端子32 并且沿着电子基板31的插入方向形成内部接触端子33，分别与它们电连接的第一连接器引脚10和第三连接器引脚13可以是多个并沿垂直于电子的方向设置的基板表面有足够的间隔。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2014154688A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2014154688A
公开(公告)日：2014-08-25
申请号：JP2013022606
申请日：2013-02-07
申请人： Denso Corp , 株式会社デンソー
发明人： HIRONAKA YOSHIO , MIYAKE TOSHIHIRO , YAMAMOTO TOSHIHISA , HARA YOSHIMICHI , MINATO HIDEKI , KOBAYASHI YUJI , KAMEYAMA KOJI
IPC分类号： H01L23/36
CPC分类号： H01L23/36 , H01L23/3107 , H01L23/42 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/115 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01322 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a compact semiconductor device which can ensure a sufficient heat radiation performance even when there is variation in heights of heat radiation surfaces of semiconductor components mounted on a circuit board; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 10a, 10b in which a plurality of packaged semiconductor components using a surface on the side opposite to an exposed surface of terminals as a heat radiation surface and which are mounted on a circuit board and has a structure of releasing heat generated by the plurality of semiconductor components to a metallic material opposite to the heat radiation surface comprises a second thermally-conductive material 6a which is arranged on the heat radiation surface of the semiconductor components 1a-1d, 1e-1h and has heat conductivity higher than that of a flexible first thermally-conductive material 5a which can be molded after being mounted on a circuit board 2a, 2b. A clearance CL between the second thermally-conductive material 6a and a metallic material 4 is kept constant across the plurality of semiconductor components 1a-1d, 1e-1h and the first thermally-conductive material 5a lies in the clearance CL.
摘要翻译：要解决的问题：提供即使当安装在电路板上的半导体部件的散热表面的高度变化时也能确保足够的散热性能的紧凑型半导体器件; 并提供半导体器件的制造方法。解决方案：一种半导体器件10a，10b，其中使用与端子的暴露表面相对的一侧上的表面作为散热表面的多个封装半导体部件，其安装在并且具有将由多个半导体部件产生的热释放到与散热面相反的金属材料的结构，包括布置在半导体部件1a-1d的散热面上的第二导热材料6a， 1e-1h，其导热率高于柔性第一导热材料5a的导热率，其可以在安装在电路板2a，2b上之后被模制。第二导热材料6a和金属材料4之间的间隙CL在多个半导体部件1a-1d，1e-1h之间保持恒定，并且第一导热材料5a位于间隙CL中。

9. 发明专利

JP2013021126A Method of manufacturing multilayer substrate, and multilayer substrate 审中-公开
标题翻译：制造多层基板的方法和多层基板
公开(公告)号：JP2013021126A
公开(公告)日：2013-01-31
申请号：JP2011153182
申请日：2011-07-11
申请人： Denso Corp , 株式会社デンソー
发明人： HIRAMATSU SATOSHI , HIRONAKA YOSHIO , MIZUNO MICHIHIKO , SHIOMI TAKUMI , YAMAGUCHI HIROSHI
IPC分类号： H05K3/46 , H05K1/11 , H05K3/20 , H05K3/38 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate which can achieve inexpensive formation of the multilayer substrate by simplifying manufacturing steps, and the multilayer substrate.SOLUTION: A second substrate 22 having a via hole 23 is formed on one surface 21a of a first substrate 21 so that the second substrate 22 is adhered to the first substrate 21 and a land 34 of a first conductor pattern 31 is exposed from the via hole 23. Then, a second conductor pattern 32 is formed by punching a metal foil 25 into a predetermined shape by heat press, and a second wire 35 is formed by allowing a part of the second conductor pattern 32 to be thermocompressed against one surface 22b of the second substrate 22. The rest of the second conductor pattern 32 is pushed in the via hole 23, and an interlayer connection part 36 is formed by allowing a part of the second conductor pattern 32 thus pushed in to extend along an inclined surface 23a of the via hole 23, and by allowing the part of the second conductor pattern 32 thus pushed in to be thermocompressed against the inclined surface 23a. A connection part 37 as the rest of the second conductor pattern 32 thus pushed in is electrically connected to the land 34.
摘要翻译：要解决的问题：提供一种通过简化制造步骤可以实现廉价地形成多层基板的多层基板的制造方法和多层基板。解决方案：具有通孔23的第二基板22形成在第一基板21的一个表面21a上，使得第二基板22粘附到第一基板21，并且第一导体图案31的凸台34暴露然后，通过热压将金属箔25冲压成预定形状，形成第二导体图案32，并且通过使第二导体图案32的一部分被热压以抵抗第二导体图案32而形成第二导线35 第二基板22的一个表面22b。第二导体图案32的其余部分被推入通孔23中，并且通过使第二导体图案32的一部分被推入以沿着第二基板22延伸而形成层间连接部36 通孔23的倾斜表面23a，并且允许这样被推入的第二导体图案32的部分被压靠在倾斜表面23a上。因此，如此推动的第二导体图案32的其余部分的连接部分37电连接到焊盘34.版权所有：（C）2013，JPO＆INPIT

10. 发明专利

JP2011219076A Electronic control device and cooling device of the same 有权
标题翻译：电子控制装置及其冷却装置
公开(公告)号：JP2011219076A
公开(公告)日：2011-11-04
申请号：JP2010210753
申请日：2010-09-21
申请人： Denso Corp , 株式会社デンソー
发明人： HIRONAKA YOSHIO , MATSUMURA YASUSHI , HARAGUCHI KIYOHIRO , IWAMOTO KENJI , SATO HIDEAKI , SHITAYA MASAHIRO , INAGAKI MITSUHARU
IPC分类号： B60R16/02
CPC分类号： B60H1/143 , B60H2001/00178 , B60H2001/00614
摘要： PROBLEM TO BE SOLVED: To provide an electronic control device and a cooling device of the same which suitably cool a plurality of control circuits for controlling onboard equipment.SOLUTION: In a housing 21 in which radiating fins 22 are each installed, there are stored a plurality of control circuits 23 for controlling a plurality of pieces of onboard equipment individually. Then, the radiating fins 22 are each arranged to be exposed in an air suction side duct 12a, wherein respective heating elements 24 comprising the plurality of control circuits 23 are arranged in contact with a radiating surface 21b near an upper surface 21a on which radiating fins 22 are each installed.
摘要翻译：要解决的问题：提供一种电子控制装置及其冷却装置，其适当地冷却用于控制车载设备的多个控制电路。解决方案：在其中安装有散热片22的壳体21中，存储有多个用于单独控制多个机载设备的控制电路23。然后，散热片22分别被布置成暴露在空气吸入侧管道12a中，其中包括多个控制电路23的各个加热元件24被布置成与靠近上表面21a的辐射表面21b接触，散热片每个都安装了22个。版权所有（C）2012，JPO＆INPIT

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