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1. 发明专利

JP2013220460A Solder supply device 有权
标题翻译：焊接设备
公开(公告)号：JP2013220460A
公开(公告)日：2013-10-28
申请号：JP2012094821
申请日：2012-04-18
申请人： Denso Corp , 株式会社デンソー
发明人： FURUMOTO ATSUSHI , KAMIMURA RIKIYA , INOMATA NORIYASU , SONODA YASUHIDE
IPC分类号： B23K3/06 , B23K101/40 , H01L21/52
CPC分类号： B23K1/0016 , B23K3/0638
摘要： PROBLEM TO BE SOLVED: To simplify the constitution and to improve the flexibility of an applying place in a solder supply device with which molten solder can be supplied to many points collectively.SOLUTION: An energization control part 88 controls the driving of a motor 70 so that the outer surface 16b of a bottom plate 16 constituting a solder vessel 14 may become a contact position contacting with a workpiece from a noncontact position that is not come in contact with the workpiece and may return to the noncontact position between the time when the workpiece 102 is carried in on a stage 100 and the time when the workpiece is carried out from the stage after a supply of the molten solder 12. Further, the driving of a motor 38 is controlled so that, in the state where the solder vessel is in the contact position, a shutter shaft 26 may become the open position from the close position and, next, may return to the close position. The close position is set so that, when the solder vessel returns to the noncontact position from the contact position, the molten solder in the cut-down space formed with the shutter shaft, the circumferential part 16c opposing the shutter shaft, the wall surface of each through hole and the workpiece may be separated from the molten solder in the other part and may be transferred to the workpiece.
摘要翻译：要解决的问题：为了简化构造并且提高在可以向多个点集中供给熔融焊料的焊料供应装置中的施加位置的柔性。解决方案：通电控制部分88控制电动机70的驱动构成焊料容器14的底板16的外表面16b可以成为从不与工件接触的非接触位置与工件接触的接触位置，并且可以在工件的时间之间返回非接触位置 102被载置在台架100上，并且在供给熔融焊料12之后从工作台进行工件的时间。此外，控制电动机38的驱动，使得在焊料容器为在接触位置，闸门轴26可以从关闭位置变为打开位置，接下来可以返回到关闭位置。关闭位置被设定为使得当焊料从接触位置返回到非接触位置时，在形成有闸门轴的切割空间中的熔融焊料，与闸门轴相对的周向部分16c，每个通孔和工件可以与另一部分中的熔融焊料分离，并且可以被传送到工件。

2. 发明专利

JP2004250300A Thick film dielectric paste and thick film circuit board 审中-公开
公开(公告)号：JP2004250300A
公开(公告)日：2004-09-09
申请号：JP2003044925
申请日：2003-02-21
申请人： Denso Corp , Sumitomo Metal Mining Co Ltd , 住友金属鉱山株式会社 , 株式会社デンソー
发明人： KAMIMURA RIKIYA , NOMURA TORU , MAKUTA FUJIO
IPC分类号： C04B35/00 , C04B35/632 , C08K3/40 , C08L25/02 , H01L23/15 , H05K3/12 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a thick film dielectric paste containing a lead-free glass powder, from which a good thick film dielectric can be formed even when it is fired in a nitrogen atmosphere at 500-700°C. SOLUTION: The thick film dielectric paste is obtained by dispersing the lead-free glass powder and a resin in an organic solvent and forms a film when it is fired in a nitrogen atmosphere at 500-700°C. The resin contains 8-20 wt.% poly(α-methylstyrene) and 0.1-1 wt.% acrylic to the total weight of the thick film dielectric paste. Thereby, the thick film dielectric formed by firing can be formed as a dense film. Further, it is characterized in that the iron content in the thick film dielectric paste is ≤300 ppm. Thereby, discoloration of the thick film dielectric formed by firing can be suppressed. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2004209425A Recycling method and recycling apparatus for printed circuit board 有权
公开(公告)号：JP2004209425A
公开(公告)日：2004-07-29
申请号：JP2003001238
申请日：2003-01-07
申请人： Denso Corp , 株式会社デンソー
发明人： KAMIMURA RIKIYA , KAMIYA HIROTERU , SAKAIDA ATSUSUKE , KONDO KOJI
IPC分类号： B09B5/00 , B01D39/14 , B01D39/20 , B09B3/00 , B29B17/02 , B29B17/04 , H05K3/00
CPC分类号： Y02W30/625 , Y02W30/82 , Y02W30/822
摘要： PROBLEM TO BE SOLVED: To provide a recycling method for a printed circuit board which can prevent a metal from being contained in a resin separated and recovered by a resin/metal separating process even if a part of paste remains on the wasted printed circuit board in a manufacturing process, and a recycling apparatus for the same. SOLUTION: In the recycling method for the printed circuit board comprising the steps of heating the wasted printed circuit board 100 to a temperature capable of softening the board and allowing passage of only the resin 2a by filtering for separating and collecting the resin 2a and the metal 2b, the printed circuit board 101 having conductor patterns 22 formed in a plurality of layers on an insulation substrate 23 made of the thermoplastic resin 2a and a conductive composition 51 for connecting the patterns 22 with one another which composition comprises a metal paste 50 made of a first metal 61 having a melting point lower than the melting point of the resin 2a and a second metal 62 capable of being sintered with the first metal 61 is used, and the material of the filter 17 for allowing the passage of only the resin for filtering is a metallic material chemically reacting with the first metal 61 to produce an intermetallic compound having a melting point higher than a specified temperature. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2010199152A Mold sealing method of electronic component and electronic component made by the same 审中-公开
标题翻译：电子元件和电子元件的模具密封方法
公开(公告)号：JP2010199152A
公开(公告)日：2010-09-09
申请号：JP2009039732
申请日：2009-02-23
申请人： Denso Corp , 株式会社デンソー
发明人： ARAO OSAMU , AOKI KOJI , KAMIMURA RIKIYA , KATO KAZUO
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a mold sealing method of a power semiconductor module and an electronic component made by the same.
SOLUTION: The method, which is a molding method of an electronic component, includes: a step of setting, to an interior of a die 8, a two-layers structure 10 in which a lead frame 3, in which an active element 1 is mounted, and a substrate 5, in which a passive element 2 is mounted, are coupled parallel with each other by a connection terminal 6; and a step of flowing the sealing resin into the inside of the die, to which the two-layers structure is set, by pouring the sealing resin into the die from the same direction as the lead frame, so that generation of void is prevented in the two-layers structure.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种功率半导体模块和由其制成的电子部件的模具密封方法。解决方案：作为电子部件的模制方法的方法包括：将模具8的内部设置为两层结构10的步骤，其中引线框架3具有主动安装元件1，并且其中安装无源元件2的基板5通过连接端子6彼此并联连接; 以及通过从与框架相同的方向将密封树脂注入到模具中，将密封树脂流入设置有两层结构的模具的内部的步骤，从而防止了空隙的产生两层结构。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2006190901A Circuit board and its manufacturing method, and electronic circuit device 审中-公开
标题翻译：电路板及其制造方法和电子电路装置
公开(公告)号：JP2006190901A
公开(公告)日：2006-07-20
申请号：JP2005002944
申请日：2005-01-07
申请人： Denso Corp , 株式会社デンソー
发明人： KAWABATA AKIRA , KAMIMURA RIKIYA , AOYAMA MASAYUKI
IPC分类号： H05K1/18 , H01L23/12 , H05K1/11 , H05K1/16
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit board having a high heat dissipation property and a method of manufacturing the same, and also to provide an electronic circuit device. SOLUTION: The circuit board 100 comprises a ceramic substrate 10, thermoplastic resins 20a and 20b, heating circuit element 30, IC 40, etc. On the ceramic substrate 10, a conductor pattern 11 is formed and the heating circuit element 30 such as MOSFET which generates heat in a conducting state is mounted via the conductor pattern 11. On the ceramic substrate 10 whereon the conductor pattern 11 and the heating circuit element 30 are formed, the thermoplastic resins 20a and 20b are stacked wherein a conductor pattern 21 and an interlayer connecting portion 22 are formed. On the thermoplastic resin 20b, a circuit element such as IC 40 is mounted. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有高散热性的电路板及其制造方法，并且还提供一种电子电路装置。电路板100包括陶瓷基板10，热塑性树脂20a和20b，加热电路元件30，IC 40等。在陶瓷基板10上，形成导体图案11，并且加热电路元件30 因为通过导体图案11安装产生导通状态的热的MOSFET。在形成导体图案11和加热电路元件30的陶瓷基板10上层叠热塑性树脂20a，20b，其中导体图案21和形成层间连接部22。在热塑树脂20b上安装诸如IC40的电路元件。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2010103231A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2010103231A
公开(公告)日：2010-05-06
申请号：JP2008271952
申请日：2008-10-22
申请人： Denso Corp , 株式会社デンソー
发明人： TAKENAKA MASAYUKI , ASAI YASUTOMI , UCHIBORI SHINYA , KOBAYASHI WATARU , SUZUKI TOSHIO , KAMIMURA RIKIYA , KAYUKAWA KIMIJI
IPC分类号： H01L25/07 , H01L23/34 , H01L25/18
CPC分类号： H01L2224/16225 , H01L2224/48227 , H01L2224/4903 , H01L2924/13055 , H01L2924/13091 , H01L2924/19015 , H01L2924/19105 , H01L2924/19107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic device which seals with a mold resin what a power element mounted on a first substrate is electrically connected to a second substrate disposed thereon, wherein a structure suitable for reducing a thickness of the electronic device is achieved. SOLUTION: This electronic device includes: a first substrate 10; a power element 30 mounted on one face of the first substrate 10; and a second substrate 20 disposed so that its one face is opposed to the one face of the first substrate 10 and the power element 30. The one face of the second substrate 20 is directly bonded to the power element 30 through a conductive bonding member 60 having conductivity for electric connection. The first substrate 10, the power element 30, and the second substrate 20 are sealed by a mold resin 50. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种与模具树脂密封的电子装置，将安装在第一基板上的功率元件电连接到设置在其上的第二基板，其中适于减小电子装置的厚度的结构已完成。解决方案：该电子设备包括：第一基板10; 安装在第一基板10的一个面上的功率元件30; 以及第二基板20，其设置成使得其一个面与第一基板10和功率元件30的一个面相对。第二基板20的一个面通过导电接合部件60直接接合到功率元件30 具有电连接的导电性。第一基板10，功率元件30和第二基板20由模制树脂50密封。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2007027280A Electronic controller and its manufacturing method 有权
标题翻译：电子控制器及其制造方法
公开(公告)号：JP2007027280A
公开(公告)日：2007-02-01
申请号：JP2005204807
申请日：2005-07-13
申请人： Denso Corp , 株式会社デンソー
发明人： FUKAYA YUICHIRO , KAWABATA AKIRA , AOYAMA MASAYUKI , KAMIMURA RIKIYA , MIYAKE TOSHIHIRO
IPC分类号： H05K1/14 , H01R13/516
摘要： PROBLEM TO BE SOLVED: To provide an electronic controller in which increase in size of a circuit board can be suppressed. SOLUTION: The electronic controller comprises a cabinet equipped with a cover 2 and a base 3, a compound circuit board where a thermoplastic substrate 10 having a conductor pattern formed thereon is stacked on a ceramic substrate 11 and a circuit element 13 is mounted on the thermoplastic substrate 10, and a connector 20 for making electric connection between the compound circuit board and the outside and equipped with an exposed portion for external connection which is exposed at least partially to the outside of the cabinet. The compound circuit board is mounted on the cabinet such that the ceramic substrate 11 touches the inner wall of the cabinet. The thermoplastic substrate 10 has a profile stretching from the ceramic substrate 11, and a connector joint 10b including a conductor pattern is provided at the stretching portion. The connector 20 is connected electrically with the conductor pattern at the connector joint 10b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以抑制电路板的尺寸增加的电子控制器。电子控制器包括配备有盖2和基座3的机壳，复合电路板，其上形成有导体图案的热塑性基板10堆叠在陶瓷基板11上，并且电路元件13被安装以及用于在复合电路板和外部之间进行电连接的配备有至少部分地暴露于机壳外部的用于外部连接的暴露部分的连接器20。复合电路板安装在机柜上，使得陶瓷基板11接触机柜的内壁。热塑性基板10具有从陶瓷基板11延伸的轮廓，并且在拉伸部设置包括导体图案的连接器接头10b。连接器20在连接器接头10b处与导体图案电连接。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006253225A Circuit substrate, method of manufacturing the same, and electronic circuit apparatus 审中-公开
标题翻译：电路基板，其制造方法和电子电路设备
公开(公告)号：JP2006253225A
公开(公告)日：2006-09-21
申请号：JP2005064403
申请日：2005-03-08
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAKIMA TOSHIHIRO , AOYAMA MASAYUKI , KAMIMURA RIKIYA
IPC分类号： H05K1/18 , H05K1/11 , H05K1/14 , H05K3/36 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit substrate which can stabilize the bonding strength of a packaging element, and to provide a method of manufacturing the circuit substrate and an electronic circuit apparatus. SOLUTION: The circuit substrate 100 includes a ceramic substrate 10, thermoplastic resin films 20a and 20b, a circuit element 30, etc. A conductor pattern 11 is formed on the ceramic substrate 10. Thermoplastic resin films 20a and 20b have a pierced hole 23 which is closed by a conductor pattern 21 (first conductor pattern in this invention) in one opening and makes a bottomed via-hole. In the circuit element 30, an electrode 31 is inserted in the pierced hole 23, and carried on the thermoplastic resin film 20b so that the electrode 31 is inserted in the pierced hole 23 and the electrode 31 and the conductor pattern 21 may be joined. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够稳定包装元件的接合强度的电路基板，并且提供一种制造电路基板的方法和电子电路设备。电路基板100包括陶瓷基板10，热塑性树脂膜20a和20b，电路元件30等。导体图案11形成在陶瓷基板10上。热塑性树脂膜20a和20b具有穿孔孔23，其由一个开口中的导体图案21（本发明中的第一导体图案）封闭并且形成有底的通孔。在电路元件30中，将电极31插入穿孔23中，并将其载持在热塑性树脂膜20b上，使得电极31插入穿孔23中，电极31和导体图案21可以接合。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006032777A Thick film circuit board 有权
标题翻译：厚膜电路板
公开(公告)号：JP2006032777A
公开(公告)日：2006-02-02
申请号：JP2004211631
申请日：2004-07-20
申请人： Denso Corp , 株式会社デンソー
发明人： SHIMOIDE SACHIHIRO , NOMURA TORU , KAMIMURA RIKIYA
IPC分类号： H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a thick film circuit board in which the resistor characteristics can be prevented from being unsettled to cause a trouble in circuit operation.
SOLUTION: Projection L of a buffer conductor 3 from the distal end of conductor wiring 5 is set equal to 0 or above. When a current is fed to a resistor material 4, the current flows from one conductor wiring 5 through the buffer conductor 3, and thereafter through the resistor material 4. Then the current flows into the other buffer conductor 3 and flows through the conductor wiring 5. Since a current does not flow through the part of a reaction layer even if the reaction layer is formed at the contact between the conductor wiring 5 and the resistor material 4, open circuit does not take place and the resistor characteristics are not affected. Consequently, stabilized resistor characteristics can be attained.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以防止电阻特性不稳定的厚膜电路板，导致电路操作中的故障。解决方案：将导体布线5的前端的缓冲导体3的投影L设定为0以上。当电流馈送到电阻器材料4时，电流从一个导体布线5流过缓冲导体3，然后通过电阻器材料4流动。然后电流流入另一个缓冲导体3并流过导体布线5 即使反应层形成在导体布线5与电阻材料4之间的接触处，由于电流不流过反应层的一部分，所以不会发生开路，电阻特性不受影响。因此，可以获得稳定的电阻器特性。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005039070A Thick-film circuit board 有权
标题翻译：厚膜电路板
公开(公告)号：JP2005039070A
公开(公告)日：2005-02-10
申请号：JP2003274803
申请日：2003-07-15
申请人： Denso Corp , 株式会社デンソー
发明人： NOMURA TORU , KAMIMURA RIKIYA , SHIRAISHI YOSHIHIKO , KASUGAI HIROSHI
IPC分类号： H05K3/28 , H05K1/02 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a thick-film circuit board where the peripheral part of a conductor layer never peels off from the base material.
SOLUTION: The feature of the thick-film circuit board has the base material 1, the conductor layer 2 and a glass layer 3 or a protection coat.
COPYRIGHT: (C)2005,JPO&NCIPI

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