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1. 发明专利

JP2014050029A On-vehicle antenna device 有权
标题翻译： ON-VEHICLE天线装置
公开(公告)号：JP2014050029A
公开(公告)日：2014-03-17
申请号：JP2012193249
申请日：2012-09-03
申请人： Denso Corp , 株式会社デンソー , Nippon Soken Inc , 株式会社日本自動車部品総合研究所
发明人： KATAOKA RYOHEI , SUZUKI TADAO , SUGIMOTO YUJI
IPC分类号： H01Q1/22 , H01Q1/32
CPC分类号： H01Q1/32 , H01Q1/3275 , H01Q1/40
摘要： PROBLEM TO BE SOLVED: To improve the life of a connection part between a circuit part and an antenna element part while inhibiting the performance deterioration of the circuit part in an on-vehicle antenna device where a frequency of a used electric wave is high.SOLUTION: An on-vehicle antenna includes: a substrate (26) having an antenna element part (42); a circuit part (28) which forms at least a part of a radio communication circuit electrically connecting with the antenna element part (42) and is mounted on the substrate (26); and a housing (34) which is formed by a resin material and forms a protruding part of a vehicle outline. The substrate (26) and the circuit part (28) are disposed in an internal space of the housing (34). A heat transmission path having heat conductivity higher than air is formed between the circuit part (28) and the housing (34). The circuit part (28) and the antenna element part (42) are electrically connected by solid phase diffusion bonding.
摘要翻译：要解决的问题：为了提高电路部件和天线元件部件之间的连接部分的寿命，同时抑制使用电波频率高的车载天线装置中的电路部件的性能劣化。车载天线包括：具有天线元件部分（42）的基板（26）; 电路部分（28），其形成与天线元件部分（42）电连接并安装在基板（26）上的无线电通信电路的至少一部分; 以及由树脂材料形成并形成车辆轮廓的突出部分的壳体（34）。基板（26）和电路部分（28）设置在壳体（34）的内部空间中。在电路部分（28）和壳体（34）之间形成有导热率高于空气的传热路径。电路部分（28）和天线元件部分（42）通过固相扩散接合电连接。

2. 发明专利

JP2013130571A Current sensor 审中-公开
标题翻译：电流传感器
公开(公告)号：JP2013130571A
公开(公告)日：2013-07-04
申请号：JP2012255392
申请日：2012-11-21
申请人： Nippon Soken Inc , 株式会社日本自動車部品総合研究所 , Denso Corp , 株式会社デンソー
发明人： SUZUKI YOICHIRO , MIZOGUCHI MIYUKI , KIMURA TOMONORI , KATAOKA RYOHEI , KAJINO HIDETADA
IPC分类号： G01R15/18
摘要： PROBLEM TO BE SOLVED: To provide a compact current sensor for contactlessly detecting an AC current with high accuracy, while allowing easy installation when in use.SOLUTION: A current sensor 100 includes a Rogowski coil 40 formed around an opening 30 of a multilayer substrate 20, and composed of a plurality of wiring layers 40a-40c of the multilayer substrate 20 and a connection conductor 70 for electrically connecting the wiring layers 40a-40c, to contactlessly detect an AC current flowing through a conductor 10 that penetrates through the opening 30. The multilayer substrate 20 has flexibility. A slit-like notch 80 for connecting an outer periphery of the opening 30 with an outer periphery of the multilayer substrate 20 is formed in the multilayer substrate 20.
摘要翻译：要解决的问题：提供一种紧凑型电流传感器，用于以高精度无接触地检测交流电流，同时在使用时易于安装。解决方案：电流传感器100包括围绕多层基板20的开口30形成的罗氏线圈40 并且由多层基板20的多个布线层40a-40c和用于电连接布线层40a-40c的连接导体70构成，以非接触地检测流过穿过开口30的导体10的AC电流。多层基板20具有柔性。在多层基板20中形成有用于将开口30的外周与多层基板20的外周连接的狭缝状的切口80。

3. 发明专利

JP2014119390A Current sensor 有权
标题翻译：电流传感器
公开(公告)号：JP2014119390A
公开(公告)日：2014-06-30
申请号：JP2012276030
申请日：2012-12-18
申请人： Nippon Soken Inc , 株式会社日本自動車部品総合研究所 , Denso Corp , 株式会社デンソー
发明人： MIZOGUCHI MIYUKI , FUKUI SHINJI , KATAOKA RYOHEI
IPC分类号： G01R15/18
摘要： PROBLEM TO BE SOLVED: To provide a current sensor allowing the size of a hollow part to be easily adjusted.SOLUTION: While at least one of first and second components 20a, 20b, 30a, 30b constituting a main member 10 is bent, one end of the first component 20a, 20b and one end of the second component 30a, 30b are fixed, and the other end of the first component 20a, 20b and the other end of the second component 30a, 30b are fixed, to form a hollow part 11 inside and a coil pattern 12 surrounding the hollow part 11. When at least one of the first and second components 20a, 20b, 30a, 30b is bent to form the hollow part 11, the size of the hollow part can be easily adjusted by changing the bend size.
摘要翻译：要解决的问题：提供允许容易调节中空部件尺寸的电流传感器。解决方案：当构成主构件10的第一和第二部件20a，20b，30a，30b中的至少一个弯曲时，一端第一部件20a，20b和第二部件30a，30b的一端固定，第一部件20a，20b的另一端和第二部件30a，30b的另一端固定，形成中空部 11和围绕中空部分11的线圈图案12.当第一和第二部件20a，20b，30a，30b中的至少一个被弯曲以形成中空部分11时，中空部分的尺寸可以容易地通过改变弯曲尺寸。

4. 发明专利

JP2013168553A Printed coil 有权
标题翻译：印刷线圈
公开(公告)号：JP2013168553A
公开(公告)日：2013-08-29
申请号：JP2012031595
申请日：2012-02-16
申请人： Nippon Soken Inc , 株式会社日本自動車部品総合研究所 , Denso Corp , 株式会社デンソー
发明人： OOKA SHINJI , KATAOKA RYOHEI
IPC分类号： H01F17/00 , H01F27/36
摘要： PROBLEM TO BE SOLVED: To provide a printed coil which can suppress propagation of high frequency noise between a primary winding and a secondary winding.SOLUTION: Shields 4, 5 for spatially shielding between a primary winding 2 and a secondary winding 3 formed in a printed coil 1 are provided. Consequently, parasitic capacitance between the primary winding 2 and the secondary winding 3 can be suppressed, and propagation of high frequency noise between the primary winding 2 and the secondary winding 3 can be suppressed.
摘要翻译：要解决的问题：提供一种能够抑制初级绕组和次级绕组之间的高频噪声的传播的印刷线圈。解决方案：用于在初始绕组2和形成在印刷的次级绕组3之间的空间屏蔽的屏蔽件4,5 线圈1。因此，可以抑制初级绕组2和次级绕组3之间的寄生电容，并且可以抑制初级绕组2和次级绕组3之间的高频噪声的传播。

5. 发明专利

JP2014050031A On-vehicle antenna device 有权
标题翻译： ON-VEHICLE天线装置
公开(公告)号：JP2014050031A
公开(公告)日：2014-03-17
申请号：JP2012193251
申请日：2012-09-03
申请人： Nippon Soken Inc , 株式会社日本自動車部品総合研究所 , Denso Corp , 株式会社デンソー
发明人： SUGIMOTO YUJI , MATSUI HIROHITO , SUZUKI TADAO , KATAOKA RYOHEI
IPC分类号： H01Q1/32 , H01Q1/22 , H01Q1/42
CPC分类号： H01Q1/3275 , H01Q1/02 , H01Q1/42 , H01Q9/42 , H05K1/0203 , H05K1/028 , H05K1/181 , H05K5/003 , H05K2201/10098
摘要： PROBLEM TO BE SOLVED: To inhibit the performance deterioration of a circuit part while securing the design of a housing in an on-vehicle antenna device where a frequency of a used electromagnetic wave is high.SOLUTION: An on-vehicle antenna device 20 includes: a base 22 attached to a vehicle roof 11; a substrate 24 which has an antenna element part 26 and is erected on the base 22; a circuit part 28 which forms at least a part of a radio communication circuit electrically connected with the antenna element part 26 and is mounted on the substrate; and a housing 30 which is formed by a resin material and forms a protruding part of a vehicle outline. The substrate 24 and the circuit part 28 are housed in a space formed by the base 22 and the housing 30. A heat transmission path, which has heat conductivity higher than air, is formed between the circuit part 28 and the housing 30 without disposing the base 22 therebetween.
摘要翻译：要解决的问题：在使用电磁波的频率高的车载天线装置中，将外壳的设计确保的同时，抑制电路部件的性能劣化。车载天线装置20包括：安装在车顶11上的基座22; 具有天线元件部26并竖立在基座22上的基板24; 形成与天线元件部26电连接并安装在基板上的无线通信电路的至少一部分的电路部28; 以及由树脂材料形成并形成车辆轮廓的突出部分的壳体30。基板24和电路部分28容纳在由基座22和壳体30形成的空间中。在电路部分28和壳体30之间形成导热率高于空气的传热路径，基座22。

6. 发明专利

JP2014050030A On-vehicle antenna device 有权
标题翻译： ON-VEHICLE天线装置
公开(公告)号：JP2014050030A
公开(公告)日：2014-03-17
申请号：JP2012193250
申请日：2012-09-03
申请人： Denso Corp , 株式会社デンソー , Nippon Soken Inc , 株式会社日本自動車部品総合研究所
发明人： YUZUKIZAKI YASUMUNE , SUZUKI TADAO , KATAOKA RYOHEI , SUGIMOTO YUJI
IPC分类号： H01Q1/22
CPC分类号： H01Q1/3275 , H01Q1/02 , H01Q1/241 , H01Q1/42 , H01Q9/42 , H05K1/181 , H05K5/003 , H05K2201/10098 , H05K2201/10507
摘要： PROBLEM TO BE SOLVED: To inhibit the performance deterioration of a circuit part while securing a design of a housing in an on-vehicle antenna device where a frequency of a used electric wave is high.SOLUTION: An on-vehicle antenna device (20) includes: a base (22) attached to a roof (11) of a vehicle (10); a substrate (24) which has an antenna element part (26) and is erected on one surface of the base (22) so that a second direction that is its plate thickness direction differs from a first direction perpendicular to the one surface (22a) of the base (22); a circuit part (30) which forms at least a part of a radio communication circuit electrically connected with the antenna element part (26); and a housing (32) formed by a resin material and forming a protruding part of a vehicle outline. The substrate (24) and the circuit part (30) are housed in a space formed by the base (22) and the housing (32). The circuit part (30) is mounted on the substrate (24) at a position separated from the base (22) in the first direction.
摘要翻译：要解决的问题：在使用电波频率高的车载天线装置中确保壳体的设计的同时，抑制电路部件的性能劣化。解决方案：车载天线装置（20）包括：附接到车辆（10）的车顶（11）的底座（22）; 基板（24），其具有天线元件部（26）并竖立在基座（22）的一个表面上，使得其板厚方向的第二方向与垂直于所述一个表面（22a）的第一方向不同，的基部（22）; 形成与天线元件部分（26）电连接的无线电通信电路的至少一部分的电路部分（30）。以及由树脂材料形成并形成车辆轮廓的突出部分的壳体（32）。基板（24）和电路部分（30）容纳在由基座（22）和壳体（32）形成的空间中。电路部件（30）在与基座（22）沿第一方向分离的位置处安装在基板（24）上。

7. 发明专利

JP2012249089A Antenna device 有权
标题翻译：天线设备
公开(公告)号：JP2012249089A
公开(公告)日：2012-12-13
申请号：JP2011119370
申请日：2011-05-27
申请人： Nippon Soken Inc , 株式会社日本自動車部品総合研究所 , Denso Corp , 株式会社デンソー
发明人： SUGIMOTO YUJI , SUZUKI TADAO , KATAOKA RYOHEI , MIZOGUCHI MIYUKI
IPC分类号： H01Q7/00 , H01Q1/24 , H01Q1/44 , H01Q3/24
CPC分类号： H01Q1/3275 , H01Q3/247 , H01Q9/40 , H01Q21/245 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna device capable of effectively achieving miniaturization while restraining complication of design and configuration.SOLUTION: A radio communication module 1 includes a high frequency circuit board 3 vertically disposed on a first bottom board 2. The high frequency circuit board 3 includes high frequency transmission/reception circuits 6, 7 respectively formed on both ends thereof, and a second bottom board 4 that forms ground potential of the high frequency transmission/reception circuits 6, 7. Power feed lines 23, 28 from the respective high frequency transmission/reception circuits 6, 7 are connected to the first bottom board 2, and ground lines 24, 29 from the high frequency transmission/reception circuits 6, 7 are connected to the second bottom board 4 of the high frequency circuit board 3. With such configuration, an excitation current in the vertical direction flows at both ends of the second bottom board 4, which enables transmission/reception of a vertically polarized wave.
摘要翻译：要解决的问题：提供能够有效地实现小型化的天线装置，同时抑制设计和配置的复杂性。解决方案：无线电通信模块1包括垂直设置在第一底板2上的高频电路板3.高频电路板3包括分别形成在其两端的高频发送/接收电路6,7，以及形成高频发送/接收电路6,7的接地电位的第二底板4，来自各个高频发送/接收电路6,7的供电线23,28连接到第一底板2，并且接地来自高频发送/接收电路6,7的线路24,29与高频电路板3的第二底板4连接。通过这种结构，垂直方向上的激励电流在第二底部的两端流动板4，其能够发送/接收垂直极化波。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2015021895A 電流検出装置有权
标题翻译：电流检测器
公开(公告)号：JP2015021895A
公开(公告)日：2015-02-02
申请号：JP2013151770
申请日：2013-07-22
申请人：株式会社日本自動車部品総合研究所 , Nippon Soken Inc , 株式会社デンソー , Denso Corp
发明人： SUZUKI YOICHIRO , MIZOGUCHI MIYUKI , KATAOKA RYOHEI
IPC分类号： G01R15/18
摘要：【課題】基板上の導体を流れる電流を高精度に検出する電流検出装置を提供する。【解決手段】絶縁材料から形成されているベース部10には、コイル20および通電部30が設けられている。コイル20は、第1放射状配線21、第2放射状配線22、接続配線200から構成され、中心角が180?の円弧状に形成されている。通電部30は、コイル20の径内方向に設けられ、基板5に設けられる導体6に当接可能な当接部32、当接部32と接続する流通部31から構成されている。流通部31は、導体6に比べコイル20の近傍に位置し、当接部32が導体6に当接すると導体6を流れる電流の一部がコイル20の近傍を流れる。これにより、導体6を流れる電流の変化に応じてコイル20に発生する誘導起電力が大きくなる。したがって、導体6を流れる電流を高精度に検出することができる。【選択図】図1
摘要翻译：要解决的问题：提供一种电流检测器，其以高精度检测流过基板上的导体的电流。解决方案：由绝缘材料形成的基座部分10设置有线圈20和带电部件30.线圈 20由第一径向配线21，第二径向配线22和中心角为180°的圆弧形状的连接配线200构成。带电部件30设置在线圈20的径向方向上，并且由邻接部件32构成，该抵接部件32可抵靠设置在基板5中的导体6和与抵接部分32连接的分配部分31.分配部分 31与导体6相比位于线圈20的附近。当抵接部32与导体6抵接时，流过导体6的电流的一部分流过线圈20的附近。以这种方式根据流过导体6的电流的变化，在线圈20中产生的感应电动势变大。因此，可以高精度地检测流过导体6的电流。

9. 发明专利

JP2006093438A Printed substrate and its production method 审中-公开
标题翻译：印刷基板及其制作方法
公开(公告)号：JP2006093438A
公开(公告)日：2006-04-06
申请号：JP2004277790
申请日：2004-09-24
申请人： Denso Corp , Nec Electronics Corp , Necエレクトロニクス株式会社 , 株式会社デンソー
发明人： KONDO KOJI , KATAOKA RYOHEI , YOKOCHI TOMOHIRO , NAKAKOSHI MAKOTO , MURAI TADASHI , HAYASHI EISHU , SUZUKI KATSUNOBU
IPC分类号： H05K3/28 , H05K3/34
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： PROBLEM TO BE SOLVED: To provide a printed substrate which can improve the recognition rate of a land while constituting it of a thermoplastic resin, and to provide its manufacturing method. SOLUTION: The printed substrate 100 has a land 21 as an electrode on the surface of a thermoplastic resin 10. A colored film 30 which is formed of a thermoplastic resin 10 and colored so that the difference of optical reflectance to the land 21 is larger than that to the thermoplastic resin 10 is laminated and disposed on the land formation surface of the thermoplastic resin 10. The colored film 30 has an opening 31 to expose at least a part of the land 21. That is, when the printed substrate 100 is viewed from on the land formation surface, the colored film 30 whose difference of optical reflectance to the land 21 is larger than that to the thermoplastic resin 10 is disposed at the circumference of the land 21. Consequently, since the difference of the strength of reflection light between the land 21 and its circumference is large, the recognition rate of the land 21 can be improved while constituting it of a thermoplastic resin. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种印刷基板，其可以在构成热塑性树脂的同时提高焊盘的识别率，并提供其制造方法。解决方案：印刷基板100在热塑性树脂10的表面上具有作为电极的焊盘21。由热塑性树脂10形成并着色以使得与光阑21的光学反射率的差异的着色膜30 大于热塑性树脂10的层压并设置在热塑性树脂10的接合面形成面上。着色膜30具有露出至少一部分接合面21的开口31。也就是说，当印刷基板在地面形成面上观察到100个，与台阶21的光反射率的差大于热塑性树脂10的光反射率的着色膜30设置在焊盘21的周围。因此，由于强度的差异在陆地21和其周边之间的反射光大，可以在构成热塑性树脂的同时提高陆地21的识别率。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006073622A Semiconductor apparatus, package substrate therefor and manufacturing method thereof 有权
标题翻译：半导体器件，其封装基板及其制造方法
公开(公告)号：JP2006073622A
公开(公告)日：2006-03-16
申请号：JP2004252568
申请日：2004-08-31
申请人： Denso Corp , Nec Electronics Corp , Necエレクトロニクス株式会社 , 株式会社デンソー
发明人： HAYASHI EISHU , SUZUKI KATSUNOBU , OIKAWA RYUICHI , NAKAKOSHI MAKOTO , SERA NAOKO , MURAI TADASHI , OGIWARA CHIHO , KATAOKA RYOHEI , KONDO KOJI , YOKOCHI TOMOHIRO
IPC分类号： H01L23/12
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a package substrate for a semiconductor apparatus which is easily manufactured, easily multilayered, and high reliable in electric connection. SOLUTION: A film-like insulating body 10 comprises a conductive pattern 4 formed on its surface, and a conductive via 9 that penetrates in thickness direction. A plurality of the insulting body 10 are stacked together, collectively pressurized, and heated for integration. At one outermost layer of a multilayer substrate 1, a plurality of connection terminals 6 are exposed outside to which the connection bump 5 of an LSI chip 2 is fixed. At the outermost layer on the opposite side, many metal pads 7 are provided with a solder ball 8 fixed to each metal pad 7, to constitute a ball grid array (BGA) structure for connection to a motherboard 3. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种容易制造，容易多层化并且电连接高可靠性的半导体装置用封装基板。解决方案：膜状绝缘体10包括在其表面上形成的导电图案4和在厚度方向上穿透的导电通孔9。将多个绝缘体10堆叠在一起，共同加压并加热以进行一体化。在多层基板1的一个最外层，多个连接端子6暴露在LSI芯片2的连接凸块5固定的外部。在相对侧的最外层，许多金属焊盘7设置有固定到每个金属焊盘7的焊球8，以构成用于连接到母板3的球栅阵列（BGA）结构。版权所有（ C）2006，JPO＆NCIPI

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