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1. 发明专利

JP2007335456A Manufacturing method of sensor device 有权
标题翻译：传感器装置的制造方法
公开(公告)号：JP2007335456A
公开(公告)日：2007-12-27
申请号：JP2006162363
申请日：2006-06-12
申请人： Denso Corp , 株式会社デンソー
发明人： KONDO ICHIJI , SAKAI MINEICHI , ABE RYUICHIRO , YAMANAKA AKITOSHI
IPC分类号： H01L21/301 , B81C1/00 , G01C19/56 , G01C19/5769 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To prevent deterioration of sensor characteristics due to chips and breakage when a wafer is diced and divided into individual chips to manufacture semiconductor chips. SOLUTION: A silicon substrate 50 is divided into individual chips by a dicing method to form semiconductor chips 2, and immediately after that, a coating agent 17 is applied to each of the semiconductor chips 2 so that its cut surface 2a is covered. In this way, even if a process of peeling a tape 30 or a cover film 20 is executed after that, since the chips or breakage caused in dicing can be fixed by the coating agent 17, its adhesion on a vibrator 12 constituting a sensing unit can be prevented. Thus, deterioration of the sensor characteristics can be prevented. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止当晶片被切割并分成单个芯片以制造半导体芯片时由于芯片和断裂导致的传感器特性的劣化。解决方案：通过切割方法将硅衬底50分成单独的芯片以形成半导体芯片2，并且随后将涂覆剂17施加到每个半导体芯片2上，使得其切割表面2a被覆盖。以这种方式，即使执行剥离带30或覆盖膜20的处理，由于切片引起的切屑或断裂可以通过涂布剂17固定，所以其对构成感测单元的振动器12的粘附力可以防止。因此，可以防止传感器特性的劣化。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2009275695A Fuel injection device, pressure-accumulation type fuel injection device system used for it 有权
标题翻译：燃料注入装置，用于其的压力累积型燃料注入装置系统
公开(公告)号：JP2009275695A
公开(公告)日：2009-11-26
申请号：JP2009009935
申请日：2009-01-20
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： YAMANAKA AKITOSHI , KONDO ATSUSHI
IPC分类号： F02M51/06 , F02M47/00 , F02M51/00 , F02M61/16 , G01L23/22 , H01L29/84
CPC分类号： F02M47/027 , F02M57/005 , F02M61/168 , F02M2200/247 , F02M2200/8076 , G01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a pressure detection function integrated fuel injection device capable of replacing a pressure detection part while enhancing productivity. SOLUTION: An injector 2 includes a head body 90 formed separately from an actuator body (injector body) 151, replaceably integrally fixed relative to the actuator body 151 and having a pressure detection part 80 comprising a diaphragm part 18n and a pressure sensor chip 18f at the inside. In this case, before fixing to the injector body, action check of the pressure detection part 80 can be singly performed by the head body 90. Accordingly, since the one determined as normal one can be fixed to the injector body, before completion of the injector 2, reduction of yield of the injector 2 caused by the pressure detection part 80 can be suppressed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在提高生产率的同时更换压力检测部的集成燃料喷射装置的压力检测功能。解决方案：喷射器2包括与致动器主体（喷射器主体）151分开形成的头主体90，相对于致动器主体151可置换地一体地固定，并具有包括隔膜部分18n和压力传感器的压力检测部分80 芯片18f在里面。在这种情况下，在固定到喷射器主体之前，压头检测部80的动作检查可以由头部主体90单独执行。因此，由于可以将正常的那一个固定到喷射器主体上，所以在完成喷射器2可以抑制由压力检测部件80引起的喷射器2的产量的降低。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009222049A Fuel injection valve and fuel injection device 有权
标题翻译：燃油喷射阀和燃油喷射装置
公开(公告)号：JP2009222049A
公开(公告)日：2009-10-01
申请号：JP2008239746
申请日：2008-09-18
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： KONDO ATSUSHI , TAGUCHI TORU , FUJINO TOMOKI , ARIKAWA FUMIAKI , YAMANAKA AKITOSHI
IPC分类号： F02M51/06 , F02M47/00
CPC分类号： F02M47/027 , F02D41/2096 , F02M51/005 , F02M57/005 , F02M63/0026 , F02M2200/24
摘要： PROBLEM TO BE SOLVED: To provide a fuel injection valve enabling the mounting of a fuel pressure sensor without increasing the number of connectors. SOLUTION: A fuel injection valve has an injector body 4z having high-pressure paths 6az, 6bz, 6cz allowing high-pressure fuel to flow to an injection hole formed inside and receiving a piezo actuator 2z (drive means) or the like for operating a needle (valve element) to open and close the injection hole; a fuel pressure sensor 50z mounted on the body 4z and detecting pressure of the high-pressure fuel; a sensor terminal 55z for externally outputting detected pressure value obtained from the fuel pressure sensor 50z; a drive terminal 56z to which electric power for the piezo actuator 2z is supplied; and a connector housing 70z for holding the sensor terminal 55z and the drive terminal 56z. The sensor terminal 55z, the drive terminal 56z, and the connector housing 70z form a single connector. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不增加连接器数量的情况下安装燃料压力传感器的燃料喷射阀。解决方案：燃料喷射阀具有喷射器主体4z，喷射器主体4z具有高压路径6az，6bz，6cz，允许高压燃料流到形成在内部的喷射孔并且接收压电致动器2z（驱动装置）等用于操作针（阀元件）以打开和关闭注射孔; 安装在主体4z上并检测高压燃料的压力的燃料压力传感器50z; 用于从外部输出从燃料压力传感器50z获得的检测压力值的传感器端子55z; 供给压电致动器2z的电力的驱动端子56z; 以及用于保持传感器端子55z和驱动端子56z的连接器壳体70z。传感器端子55z，驱动端子56z和连接器壳体70z形成单个连接器。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009222048A Fuel injection valve and fuel injection device 有权
标题翻译：燃油喷射阀和燃油喷射装置
公开(公告)号：JP2009222048A
公开(公告)日：2009-10-01
申请号：JP2008239745
申请日：2008-09-18
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： KONDO ATSUSHI , TAGUCHI TORU , ARIKAWA FUMIAKI , UEDA TAIJI , YAMANAKA AKITOSHI
IPC分类号： F02M61/16
CPC分类号： F02M47/027 , F02M51/005 , F02M57/005 , F02M63/0026 , F02M63/023 , F02M2200/24
摘要： PROBLEM TO BE SOLVED: To provide a fuel injection valve enabling the mounting of a fuel pressure sensor so as to accurately detect fuel pressure fluctuation occurring during injection by inhibiting the fuel pressure sensor from being affected by the flow of fuel. SOLUTION: This device is provided with an injector body 4z having high-pressure paths 6bz, 6cz for allowing high-pressure fuel to flow to an injection hole formed inside and receiving a piezo actuator 2z (opening/closing mechanism), a back pressure control mechanism 3z (opening/closing mechanism), and other elements for opening and closing the injection hole and a fuel pressure sensor 50z mounted on the body 4z and detecting pressure of high-pressure fuel. In the body 4z, a branch path 6ez branched from the high-pressure paths 6bz, 6cz and introducing the high-pressure fuel into the fuel pressure sensor 50z. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种燃料喷射阀，其能够安装燃料压力传感器，以便通过禁止燃料压力传感器受到燃料流的影响来精确地检测在喷射期间发生的燃料压力波动。解决方案：该装置设置有具有高压路径6bz，6cz的喷射器主体4z，用于允许高压燃料流动到内部形成的喷射孔并且接收压电致动器2z（打开/关闭机构），背压控制机构3z（打开/关闭机构）以及用于打开和关闭喷射孔的其它元件和安装在主体4z上的燃料压力传感器50z并检测高压燃料的压力。在主体4z中，从高压路径6bz，6cz分支的分支路径6ez，并将高压燃料引入燃料压力传感器50z。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2004047096A Optical head for optical recording and reproducing device 有权
标题翻译：光学记录和再现设备的光学头
公开(公告)号：JP2004047096A
公开(公告)日：2004-02-12
申请号：JP2003314029
申请日：2003-09-05
申请人： Denso Corp , 株式会社デンソー
发明人： SUGAWARA RYOICHI , MATSUI TAKESHI , ITO TOSHIKI , KAWAI SHOICHI , YAMANAKA AKITOSHI
IPC分类号： G11B7/125 , G11B7/135 , G11B7/22 , H01S5/022 , H01S5/22
摘要： PROBLEM TO BE SOLVED: To facilitate the optical axis setting of a recording beam and a reproducing beam in an optical head for an optical recording and reproducing device. SOLUTION: A plurality of semiconductor laser chips for outputting laser beams for recording and reproduction are arranged along a guide groove of a substrate 23 as a laser light source of the optical head for the optical recording and reproducing device. A semiconductor laser chip is constructed by stacking semiconductor laser components 32 to 36 including an active layer 34 on a semiconductor substrate 31. The semiconductor laser components output the recording beam and reproducing beam from at least two separated element areas each, and the bandgaps of the active layers in the respective element areas are different from each other. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了便于用于光学记录和再现装置的光学头中的记录光束和再现光束的光轴设置。解决方案：用于输出用于记录和再现的激光束的多个半导体激光器芯片沿着作为光学记录和再现装置的光学头的激光源的基板23的引导槽布置。通过在半导体衬底31上堆叠包括有源层34的半导体激光器部件32至36来构成半导体激光器芯片。半导体激光器部件从至少两个分离的元件区域输出记录光束和再现光束，并且，各个元件区域中的有源层彼此不同。版权所有（C）2004，JPO

6. 发明专利

JP2010216853A Vibration type angular velocity sensor 有权
标题翻译：振动型角速度传感器
公开(公告)号：JP2010216853A
公开(公告)日：2010-09-30
申请号：JP2009061251
申请日：2009-03-13
申请人： Denso Corp , 株式会社デンソー
发明人： HIGUCHI YUJI , YAMANAKA AKITOSHI , FUJII TETSUO
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： G01C19/5719
摘要： PROBLEM TO BE SOLVED: To achieve a structure in which a detection section and a drive section are arranged in appropriate environments, respectively, in a vibration type angular velocity sensor. SOLUTION: The vibration type angular velocity sensor includes: a first cap section 10 which is secured around the detection section 30 in which a detection fixed electrode 38, a detection movable electrode 36 and a detection beam 34 are arranged and is spaced apart from the detection section 30 and covers them, thereby sealing the detection section 30 in a first space 11 on one side of a substrate 1; and second cap section 20 which is secured around the position at which the drive section 40 including a drive movable electrode 42, a drive fixed electrode 43, and a drive beam 41 is arranged and is spaced apart from the drive section 40 and covers the drive section 40, thereby sealing the drive section 40 in a second space 21 which is separated from the first space 11 on one side of the substrate 1. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了实现在振动型角速度传感器中分别在适当环境中布置检测部分和驱动部分的结构。解决方案：振动型角速度传感器包括：第一盖部分10，其固定在检测部分30周围，检测固定电极38，检测可动电极36和检测光束34布置在其中并被间隔开从检测部30覆盖它们，从而将检测部30密封在基板1的一侧的第一空间11中; 以及第二盖部20，其固定在包括驱动可动电极42，驱动固定电极43和驱动梁41的驱动部40的位置处，并且与驱动部40隔开并且覆盖驱动部部分40，从而将驱动部分40密封在与基板1的一侧上的第一空间11分离的第二空间21中。（C）2010，JPO＆INPIT

7. 发明专利

JP2009222051A Fuel injection valve and fuel injection device 有权
标题翻译：燃油喷射阀和燃油喷射装置
公开(公告)号：JP2009222051A
公开(公告)日：2009-10-01
申请号：JP2008243807
申请日：2008-09-24
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： KONDO ATSUSHI , TAGUCHI TORU , ARIKAWA FUMIAKI , YAMANAKA AKITOSHI
IPC分类号： F02M51/06 , F02M45/00 , F02M47/00 , F02M47/02 , F02M61/10
CPC分类号： F02M47/027 , F02D2200/0602 , F02D2400/08 , F02M51/005 , F02M57/005 , F02M63/0026 , F02M2200/24 , G01L23/18
摘要： PROBLEM TO BE SOLVED: To provide a fuel injection valve enabling the mounting of a fuel pressure sensor to accurately detect fuel pressure fluctuation generated during injection by inhibiting a sensor element from receiving influence of deformation of a body. SOLUTION: A fuel injection valve has an injector body 4z having high-pressure paths 6az, 6bz, 6cz allowing high-pressure fuel to flow to an injection hole formed inside and receiving a piezo actuator 2z (opening/closing mechanism), a back pressure control mechanism 3z (opening/closing mechanism), and the like; a stem 51z (deformable body) mounted on the body 4z and elastically deforming when subjected to pressure of the high-pressure fuel; and a strain gauge 52z (sensor element) mounted on the stem 51z and converting magnitude of deformation of the stem 51z into an electric signal and outputting it as a detected pressure value. In the structure above, the strain gauge 52z is mounted on the stem 51z formed as a separate body from the body 4z. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种燃料喷射阀，其能够安装燃料压力传感器，以通过抑制传感器元件不受身体变形的影响来精确地检测在注射期间产生的燃料压力波动。解决方案：燃料喷射阀具有喷射器主体4z，喷射器主体4z具有高压路径6az，6bz，6cz，允许高压燃料流到形成在内部的喷射孔并接收压电致动器2z（打开/关闭机构）背压控制机构3z（打开/关闭机构）等; 安装在主体4z上的杆51z（变形体），当受到高压燃料的压力时弹性变形; 以及安装在杆51z上的应变计52z（传感器元件），并且将杆51z的变形量变换为电信号并将其作为检测压力值输出。在上述结构中，应变仪52z安装在与主体4z形成为独立体的杆51z上。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009170173A El element, and manufacturing method thereof 审中-公开
标题翻译： EL元件及其制造方法
公开(公告)号：JP2009170173A
公开(公告)日：2009-07-30
申请号：JP2008004854
申请日：2008-01-11
申请人： Denso Corp , 株式会社デンソー
发明人： INO KOJI , YAMANAKA AKITOSHI , ISHIDA TAIZO , MORI KAORU , TATE KOJIRO
IPC分类号： H05B33/02 , H01L51/50 , H05B33/10 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide an EL element capable of preventing respective layers that form the EL element from being broken when the EL element is curved.
SOLUTION: A plate-like shape support 70 of juxtaposing a plurality of stripe-shaped cutout parts 71 composed of a pair of oblique lines adjacent at a predetermined angle on a surface, is arranged on an opposite side surface of a surface projecting when the EL element 100 is formed in a curved surface shape. A curved surface shape can be regulated by curving the EL element 100 up to a place of mutually contacting the pair of oblique lines, and can be regulated to a limit shape or less of the curved surface shape of the EL element 100 by forming so as not to be curved more than that. In this case, the respective layers for forming the EL element 100 can be prevented from being broken by adjusting an angle between the pair of oblique lines so as not to exceed a bending breaking limit of the most less flexible layer in the respective layers forming the EL element 100, the layer being cosidered as normal.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种当EL元件弯曲时能够防止形成EL元件的各层破裂的EL元件。解决方案：将与表面上以预定角度相邻的一对斜线组成的多个条形切口部71并列的板状形状支撑体70配置在表面突出部的相对侧面当EL元件100形成为曲面形状时。弯曲表面形状可以通过将EL元件100弯曲到相互接触一对斜线的位置来调节，并且可以通过形成为如下方式来调节到EL元件100的弯曲表面形状的极限形状或更小的位置不要比这更弯曲。在这种情况下，可以通过调整一对斜线之间的角度来防止用于形成EL元件100的各层被破坏，从而不会超过形成该EL线的各个层中最少柔性层的弯曲断裂极限 EL元件100，该层被正常地考虑。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2007258540A Sensor device and its manufacturing method 有权
标题翻译：传感器及其制造方法
公开(公告)号：JP2007258540A
公开(公告)日：2007-10-04
申请号：JP2006082733
申请日：2006-03-24
申请人： Denso Corp , 株式会社デンソー
发明人： KONDO ICHIJI , ABE RYUICHIRO , YAMANAKA AKITOSHI , NAKAJIMA NORIO
IPC分类号： H01L21/60 , G01C19/56 , G01C19/5769 , H01L25/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： G01P1/023 , G01P15/125 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/1305 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To prevent a bulged resin film from adhering to a sensor of a semiconductor chip when the resin film is provided between the semiconductor chip and a circuit chip to integrate the semiconductor chip with the circuit chip, and to suppress a reduction of a bonding strength of each bump due to a stress of the bulged resin film. SOLUTION: There is prepared a resin film 30 which has a first space 33 in a region containing a portion opposite to a sensor of the semiconductor chip of one face side of the resin film 30, and a second space 34 on an outer peripheral side of the first space 33. When the resin film 30 is sandwiched between a semiconductor chip 10 and the circuit chip and heated to bond each bump, the bulge of the resin film 30 is entered into the second space 34. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止在半导体芯片和电路芯片之间设置树脂膜以将半导体芯片与电路芯片集成在一起的凸起的树脂膜粘附到半导体芯片的传感器，并且抑制由于凸起的树脂膜的应力引起的每个凸起的接合强度的降低。解决方案：制备树脂膜30，该树脂膜30在包含与树脂膜30的一个面侧的半导体芯片的传感器相对的部分的区域中具有第一空间33，在外部具有第二空间34 当树脂膜30夹在半导体芯片10和电路芯片之间并被加热以粘合每个凸块时，树脂膜30的凸起进入第二空间34.
版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2010171368A Semiconductor device, and method for manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010171368A
公开(公告)日：2010-08-05
申请号：JP2009138031
申请日：2009-06-09
申请人： Denso Corp , 株式会社デンソー
发明人： FUJII TETSUO , YAMANAKA AKITOSHI , YOKURA HISANORI
IPC分类号： H01L29/84 , G01C19/56 , G01C19/5755 , G01C19/5769 , G01P15/08 , G01P15/125 , H01L23/02
CPC分类号： H01L2224/48463 , H01L2924/01013 , H01L2924/01322 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure capable of eliminating a bonding defect and a conduction defect between a cap portion and a sensor portion, and to provide a method for manufacturing the same. SOLUTION: A conductor layer 60 of Ge is formed on a second wiring layer 25 of Al, and heated while sandwiched between the second wiring layer 25 and a wiring layer 14 of the sensor portion 10. Consequently, the conductor layer 60 melts to form an eutectic alloy with a part of the second wiring layer 25 and the conductor layer 60 and also to form an eutectic alloy of the wiring layer 14 and conductor layer 60. The conductor layer 60 having melted fills concavities and convexities of a surface of the second wiring layer 25, and concavities and convexities of a surface of the wiring layer 14, and also achieves eutectic bonding between the both so as to leave no space between the surface of the second wiring layer 25 and the conductor 60 and no space between the surface of the wiring layer 14 and the conductor layer 60, thereby suppressing a decrease in bonding area between the second wiring layer 25 and wiring layer 14. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够消除盖部和传感器部之间的接合缺陷和导电缺陷的结构的半导体器件，并提供其制造方法。解决方案：Ge的导体层60形成在Al的第二布线层25上，并在夹在第二布线层25和传感器部分10的布线层14之间加热。因此，导体层60熔化与第二布线层25和导体层60的一部分形成共晶合金，并且还形成布线层14和导体层60的共晶合金。具有熔融填充的导体层60的表面的凹凸第二布线层25以及布线层14的表面的凹凸，并且也实现两者之间的共晶接合，以便在第二布线层25的表面和导体60之间不留空间，布线层14的表面和导体层60，从而抑制第二布线层25和布线层14之间的接合面积减小。（C）2010，JPO＆INPIT

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