专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004079576A Electronic control device 有权
标题翻译：电子控制装置
公开(公告)号：JP2004079576A
公开(公告)日：2004-03-11
申请号：JP2002233719
申请日：2002-08-09
申请人： Denso Corp , 株式会社デンソー
发明人： KAWABATA AKIRA , TANAKA YASUMITSU , FUKAYA YUICHIRO
IPC分类号： H05K7/14 , B60R16/02 , B60R16/023 , H05K3/30
CPC分类号： B60R16/0239 , H05K3/301 , H05K2201/10446 , H05K2201/10962
摘要： PROBLEM TO BE SOLVED: To provide an electronic control device, wherein an electronic component mounted on a substrate and an electronic component not mounted on a substrate are arranged in a case, excellent in vibration resistance and in heat dissipation.
SOLUTION: A case 2 is an aluminum case having a recess 4 for accommodating an electronic component 40 not mounted on a substrate. Inside the recess 4, a resin frame 30, which accommodates the electronic component 40 not mounted on a substrate, is arranged. A metal conductor 50 of the electronic component not mounted on a substrate is inserted into the resin frame 30, and is electrically connected to a circuit board 11 by a metallic foil 52.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种电子控制装置，其中安装在基板上的电子部件和未安装在基板上的电子部件布置在具有优异的抗振动性和散热性的情况下。解决方案：壳体2是具有用于容纳未安装在基板上的电子部件40的凹部4的铝壳体。在凹部4的内部设置有容纳未安装在基板上的电子部件40的树脂框架30。未安装在基板上的电子部件的金属导体50插入到树脂框架30中，并通过金属箔52与电路基板11电连接。（C）2004，JPO

2. 发明专利

JP2008033559A Electronic device 有权
标题翻译：电子设备
公开(公告)号：JP2008033559A
公开(公告)日：2008-02-14
申请号：JP2006205300
申请日：2006-07-27
申请人： Denso Corp , 株式会社デンソー
发明人： KAWABATA AKIRA , FUKAYA YUICHIRO
IPC分类号： G06F1/20 , H05K7/06
CPC分类号： H05K3/301 , H01M2/1055 , H05K1/0263 , H05K1/18 , H05K1/182 , H05K2201/10015 , H05K2201/1003 , H05K2201/10272 , H05K2201/10515 , H05K2201/10583 , H05K2201/10606 , H05K2201/2036
摘要： PROBLEM TO BE SOLVED: To provide an electronic device suppressing an increase in the mounting area to an attached body. SOLUTION: The electronic device comprises a case 10 (a cover 10a and a base 10b) having a mounting part 11a to the attached body (an engine 500); a circuit board 20 housed in the case 10; and a plurality of large electronic components (capacitors 30 and a coil 31) housed in the case 10 and electrically connected to the circuit board 20. The plurality of large electronic components (the capacitors 30 and coil 31) are arranged in a three-dimensional manner with respect to a surface which faces the attached body in the case 10. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种抑制对安装体的安装面积的增加的电子设备。电子设备包括具有到安装体（发动机500）的安装部分11a的壳体10（盖10a和基座10b）; 容纳在壳体10内的电路板20; 以及容纳在壳体10中并电连接到电路板20的多个大型电子部件（电容器30和线圈31）。多个大型电子部件（电容器30和线圈31）以三维方式相对于在案件10中面对附着物的表面。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006190901A Circuit board and its manufacturing method, and electronic circuit device 审中-公开
标题翻译：电路板及其制造方法和电子电路装置
公开(公告)号：JP2006190901A
公开(公告)日：2006-07-20
申请号：JP2005002944
申请日：2005-01-07
申请人： Denso Corp , 株式会社デンソー
发明人： KAWABATA AKIRA , KAMIMURA RIKIYA , AOYAMA MASAYUKI
IPC分类号： H05K1/18 , H01L23/12 , H05K1/11 , H05K1/16
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/13091 , H01L2924/15174 , H01L2924/15184 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit board having a high heat dissipation property and a method of manufacturing the same, and also to provide an electronic circuit device. SOLUTION: The circuit board 100 comprises a ceramic substrate 10, thermoplastic resins 20a and 20b, heating circuit element 30, IC 40, etc. On the ceramic substrate 10, a conductor pattern 11 is formed and the heating circuit element 30 such as MOSFET which generates heat in a conducting state is mounted via the conductor pattern 11. On the ceramic substrate 10 whereon the conductor pattern 11 and the heating circuit element 30 are formed, the thermoplastic resins 20a and 20b are stacked wherein a conductor pattern 21 and an interlayer connecting portion 22 are formed. On the thermoplastic resin 20b, a circuit element such as IC 40 is mounted. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有高散热性的电路板及其制造方法，并且还提供一种电子电路装置。电路板100包括陶瓷基板10，热塑性树脂20a和20b，加热电路元件30，IC 40等。在陶瓷基板10上，形成导体图案11，并且加热电路元件30 因为通过导体图案11安装产生导通状态的热的MOSFET。在形成导体图案11和加热电路元件30的陶瓷基板10上层叠热塑性树脂20a，20b，其中导体图案21和形成层间连接部22。在热塑树脂20b上安装诸如IC40的电路元件。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005315658A Electronic controller 审中-公开
标题翻译：电子控制器
公开(公告)号：JP2005315658A
公开(公告)日：2005-11-10
申请号：JP2004132130
申请日：2004-04-27
申请人： Denso Corp , 株式会社デンソー
发明人： KAWABATA AKIRA
IPC分类号： G01R31/30 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide an electronic controller which can perform a burn-in inspection by applying an external voltage load after the assembly and which can avoid the problem after the burn-in inspection. SOLUTION: In a case 2, a circuit board 11 on which an electronic component 10 is mounted is disposed, and connection terminals 22 of a connector 20 provided to the case 2 are electrically connected with the circuit board 11 via bonding wires 23. Two connection terminals 22a and 22b of the connection terminals 22 of the connector 20 and two bonding wires 23a and 23b connecting the two connection terminals 22a and 22b with the circuit board 11 are made as the external power supply terminals for the burn-in inspection and for cutting the burn-in voltage application line after the burn-in inspection. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子控制器，其可以在组装之后施加外部电压负载来进行老化检查，并且可以避免在老化检查之后的问题。＆lt; P＆gt;解决方案：在情况2中，安装有电子部件10的电路板11，并且设置在壳体2上的连接器20的连接端子22通过接合线23与电路板11电连接将连接器20的连接端子22的两个连接端子22a和22b以及将两个连接端子22a和22b与电路板11连接的两个接合线23a和23b作为用于老化检查的外部电源端子并在烧录检查后切割老化电压施加线。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2003298255A Electronic controller 审中-公开
标题翻译：电子控制器
公开(公告)号：JP2003298255A
公开(公告)日：2003-10-17
申请号：JP2002098555
申请日：2002-04-01
申请人： Denso Corp , 株式会社デンソー
发明人： TANAKA YASUMITSU , KAWABATA AKIRA , KATO KEIICHI
IPC分类号： H05K5/00 , H05K5/02
CPC分类号： H05K5/0213
摘要： PROBLEM TO BE SOLVED: To provide an electronic controller having a structure for uniformizing pressures in a casing and the outside, and being capable of preventing water droplets and the like from being sucked into the casing.
SOLUTION: The electronic controller 1 comprises a casing R (a case 20 in detail) for accommodating a circuit board 10 on which electronic parts 11 are mounted, and a cover 30 assembled across an opening 21 in the case 20. A recess 24 is formed in a mounting surface 22 of the opening 21 across which the cover 30 is assembled. A breather hole 25 communicating a space Rs in the casing R with the outside is formed by assembling the cover 30 and the case 20 with the recess 24 put therebetween. In the electronic controller 1, an opening area of the breather hole 25 is spread from the space to the outside.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种电子控制器，其具有使壳体和外部的压力均匀化的结构，并且能够防止水滴等被吸入壳体。解决方案：电子控制器1包括用于容纳其上安装有电子部件11的电路板10的壳体R（详细的壳体20）和组装在壳体20中的开口21上的盖30。 24形成在开口21的安装表面22中，盖30组装在该安装表面22上。通过将盖子30和壳体20组装在一起，形成有将壳体R中的空间Rs与外部连通的通气孔25，其间设置有凹部24。在电子控制器1中，通气孔25的开口区域从空间扩展到外部。版权所有（C）2004，JPO

6. 发明专利

JP2007027280A Electronic controller and its manufacturing method 有权
标题翻译：电子控制器及其制造方法
公开(公告)号：JP2007027280A
公开(公告)日：2007-02-01
申请号：JP2005204807
申请日：2005-07-13
申请人： Denso Corp , 株式会社デンソー
发明人： FUKAYA YUICHIRO , KAWABATA AKIRA , AOYAMA MASAYUKI , KAMIMURA RIKIYA , MIYAKE TOSHIHIRO
IPC分类号： H05K1/14 , H01R13/516
摘要： PROBLEM TO BE SOLVED: To provide an electronic controller in which increase in size of a circuit board can be suppressed. SOLUTION: The electronic controller comprises a cabinet equipped with a cover 2 and a base 3, a compound circuit board where a thermoplastic substrate 10 having a conductor pattern formed thereon is stacked on a ceramic substrate 11 and a circuit element 13 is mounted on the thermoplastic substrate 10, and a connector 20 for making electric connection between the compound circuit board and the outside and equipped with an exposed portion for external connection which is exposed at least partially to the outside of the cabinet. The compound circuit board is mounted on the cabinet such that the ceramic substrate 11 touches the inner wall of the cabinet. The thermoplastic substrate 10 has a profile stretching from the ceramic substrate 11, and a connector joint 10b including a conductor pattern is provided at the stretching portion. The connector 20 is connected electrically with the conductor pattern at the connector joint 10b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以抑制电路板的尺寸增加的电子控制器。电子控制器包括配备有盖2和基座3的机壳，复合电路板，其上形成有导体图案的热塑性基板10堆叠在陶瓷基板11上，并且电路元件13被安装以及用于在复合电路板和外部之间进行电连接的配备有至少部分地暴露于机壳外部的用于外部连接的暴露部分的连接器20。复合电路板安装在机柜上，使得陶瓷基板11接触机柜的内壁。热塑性基板10具有从陶瓷基板11延伸的轮廓，并且在拉伸部设置包括导体图案的连接器接头10b。连接器20在连接器接头10b处与导体图案电连接。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2002155789A PIEZO-ACTUATOR DRIVING CIRCUIT AND FUEL INJECTION DEVICE 失效
公开(公告)号：JP2002155789A
公开(公告)日：2002-05-31
申请号：JP2000352174
申请日：2000-11-20
申请人： DENSO CORP
发明人： KAWABATA AKIRA
IPC分类号： F02M51/00 , F02D41/20 , F02D41/40 , F02M51/06 , H01L41/083 , H01L41/09
摘要： PROBLEM TO BE SOLVED: To determine an electrostatic capacity of a piezo-stack at a high accuracy without using an energization inductor to the piezo-stack and receiving an influence of an internal inductance of the piezo-stack in a piezo-actuator driving circuit. SOLUTION: An A. C. Voltage is applied to a piezo-stack 3A from an A.C. power source 19 at a frequency of several points and a CPU 22 operates an electrostatic capacity of the piezo-stack 3A based on a frequency characteristic of a piezo-stack current flowing in the piezo-stack 3A.

8. 发明专利

JPH09203420A ELECTROMAGNETIC CLUTCH CONTROLLER 失效
公开(公告)号：JPH09203420A
公开(公告)日：1997-08-05
申请号：JP1124696
申请日：1996-01-25
申请人： DENSO CORP
发明人： KAWABATA AKIRA
IPC分类号： F16D48/06
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic clutch controller designed to decrease the number of series transistors and electromagnetic clutches which directly interrupt energizing current of an electromagnetic clutch. SOLUTION: A direct-current electromagnetic clutch 10 is engaged by applying voltage of a direct voltage source VB to an exciting coil 11 and is separated by dropping this voltage. A transistor 60 is connected between the direct voltage source VB and the exciting coil 11. When the transistor 60 is turned on, the voltage of the direct voltage source VB is applied to the exciting coil 11. When the transistor 60 is turned off, the voltage of the direct voltage source VB is not applied to the exciting coil 11. A negative voltage power circuit 90 applies the voltage having the reverse polarity of the direct voltage source VB to the exciting coil 11 when the transistor 60 is turned off.

9. 发明专利

JP2003258465A ELECTRONIC CIRCUIT UNIT 审中-公开
公开(公告)号：JP2003258465A
公开(公告)日：2003-09-12
申请号：JP2002057827
申请日：2002-03-04
申请人： DENSO CORP
发明人： KAWABATA AKIRA
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is able to suppress heat of high-powered parts from being transferred to control circuit elements, such as a microcomputer, while being able to efficiently emit the heat of the high- powered parts outside, in a construction having a casing in which the high- powered part, a control circuit including the microcomputer, and the like are accommodated. SOLUTION: The electronic circuit unit is characterized by forming a mounting area 12a for the high-powered part so as to have a thickness lager than that of a mounting area 12b for the microcomputer. Accordingly, the thermal density of the area 12a can be made lower than that of the area 12b, whereby the thermal resistance of the area 12a can be made relatively small. As a result, the heat generated from the high-powered part 15 is not transferred to the area 12b where the thermal resistance has become relatively large, but emitted outside from the casing 12 which is positioned in the direction opposite to the direction in which the area 12b is positioned relative to the area 12a. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2003264259A SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING THE SAME 审中-公开
公开(公告)号：JP2003264259A
公开(公告)日：2003-09-19
申请号：JP2002063072
申请日：2002-03-08
申请人： DENSO CORP
发明人： KAWABATA AKIRA
IPC分类号： H05K3/34 , H01L23/12 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a plurality of solder bumps provided on either of front and rear sides of a wiring substrate mounted on a mounting board electrically connected to a mounting substrate, a method for mounting the semiconductor device, and also to provide a method for suitably inspecting a connection state between the bumps and the mounting board. SOLUTION: Five inspecting solder bumps 11A and 11E of outer dimensions smaller than outer dimensions of the solder bumps 10 are provided in four corners and the central part of one surface of a wiring substrate 3. Continuity inspection between the inspecting solder bumps 11A to 11E is conducted. When the inspecting bumps 11A to 11D are electrically conducted with the inspecting bump 11E provided in the central part, it can be determined that all the bumps 10 are connected to the mounting substrate 3. Thus, a connection state between the bumps 10 and the mounting board 3 can be inspected without using an X ray. COPYRIGHT: (C)2003,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式