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1. 发明专利

JP2006253225A Circuit substrate, method of manufacturing the same, and electronic circuit apparatus 审中-公开
标题翻译：电路基板，其制造方法和电子电路设备
公开(公告)号：JP2006253225A
公开(公告)日：2006-09-21
申请号：JP2005064403
申请日：2005-03-08
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAKIMA TOSHIHIRO , AOYAMA MASAYUKI , KAMIMURA RIKIYA
IPC分类号： H05K1/18 , H05K1/11 , H05K1/14 , H05K3/36 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit substrate which can stabilize the bonding strength of a packaging element, and to provide a method of manufacturing the circuit substrate and an electronic circuit apparatus. SOLUTION: The circuit substrate 100 includes a ceramic substrate 10, thermoplastic resin films 20a and 20b, a circuit element 30, etc. A conductor pattern 11 is formed on the ceramic substrate 10. Thermoplastic resin films 20a and 20b have a pierced hole 23 which is closed by a conductor pattern 21 (first conductor pattern in this invention) in one opening and makes a bottomed via-hole. In the circuit element 30, an electrode 31 is inserted in the pierced hole 23, and carried on the thermoplastic resin film 20b so that the electrode 31 is inserted in the pierced hole 23 and the electrode 31 and the conductor pattern 21 may be joined. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够稳定包装元件的接合强度的电路基板，并且提供一种制造电路基板的方法和电子电路设备。电路基板100包括陶瓷基板10，热塑性树脂膜20a和20b，电路元件30等。导体图案11形成在陶瓷基板10上。热塑性树脂膜20a和20b具有穿孔孔23，其由一个开口中的导体图案21（本发明中的第一导体图案）封闭并且形成有底的通孔。在电路元件30中，将电极31插入穿孔23中，并将其载持在热塑性树脂膜20b上，使得电极31插入穿孔23中，电极31和导体图案21可以接合。版权所有（C）2006，JPO＆NCIPI

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