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1. 发明专利

JP2016003880A 角速度センサ审中-公开
公开(公告)号：JP2016003880A
公开(公告)日：2016-01-12
申请号：JP2014122512
申请日：2014-06-13
申请人： DENSO CORP
发明人： SAKAI MINEICHI , SHIROMORI TOMOYA
IPC分类号： G01C19/5656 , H01L41/113
摘要：【課題】検出精度が低下することを抑制できる角速度センサを提供する。【解決手段】基板10の面方向における一方向を第1方向とし、基板10の面方向のうちの第1方向と直交する方向を第2方向としたとき、少なくとも第1方向に変位可能とされた第1梁構成部材16a〜17aと、第1梁構成部材16a〜17aと連結され、少なくとも第2方向に変位可能とされた第2梁構成部材16b〜17bとを有する複数の梁部16〜17を介して振動体12を外周部13に支持する。そして、複数の梁部16〜17の少なくとも一部において、第1、第2梁構成部材16a〜17bのうちの外周部13側の梁構成部材16b〜17bを互いに一体化する。【選択図】図1

2. 发明专利

JP2014021065A Physical quantity sensor 审中-公开
标题翻译：物理量传感器
公开(公告)号：JP2014021065A
公开(公告)日：2014-02-03
申请号：JP2012162920
申请日：2012-07-23
申请人： Denso Corp , 株式会社デンソー
发明人： SUGIMOTO YOSHIMASA , SAKAI MINEICHI , ARIKI FUMIYOSHI
IPC分类号： G01P15/08 , G01C19/5755 , G01P15/125 , H01L29/84
CPC分类号： H01L24/05 , H01L2224/05554 , H01L2224/49175 , H01L2224/73265
摘要： PROBLEM TO BE SOLVED: To reduce the hysteresis of a sensor output in a physical quantity sensor including a pad having aluminum films, as compared with a prior art.SOLUTION: A physical quantity sensor (11) includes: movable parts (27, 28, 29, and 46) that are formed as parts of semiconductor substrates (22 and 45) and displaced or deformed according to the application of a physical quantity; and a pad (31) as an external connection terminal, which is formed by having a metal film deposited on a part that is mechanically connected with the movable parts on the semiconductor substrates. The pad forms a multilayer structure, which includes aluminum films (31a, 31a1, and 31a2) that are formed using an aluminum simple substance and a high yield stress film (31b) that is formed using a metal material having a higher yield stress than aluminum.
摘要翻译：要解决的问题：与现有技术相比，减少包括具有铝膜的焊盘的物理量传感器中的传感器输出的滞后。物理量传感器（11）包括：可移动部件（27,28， 29和46），其形成为半导体衬底（22和45）的一部分并且根据物理量的应用而移位或变形; 以及作为外部连接端子的焊盘（31），其通过在半导体基板上与可移动部分机械连接的部分上沉积有金属膜而形成。衬垫形成多层结构，其包括使用铝单体形成的铝膜（31a，31a1和31a2）和使用比铝高的屈服应力的金属材料形成的高屈服应力膜（31b）。

3. 发明专利

JP2013160559A Acceleration sensor device 有权
标题翻译：加速传感器装置
公开(公告)号：JP2013160559A
公开(公告)日：2013-08-19
申请号：JP2012020880
申请日：2012-02-02
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAI MINEICHI
IPC分类号： G01P15/125 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide an acceleration sensor device improved in detection accuracy of acceleration.SOLUTION: An acceleration sensor device has: a left weight portion (25) and a right weight portion (26) supported by a first anchor (18); first electrodes (22) formed on those weight portions and second electrodes (23) respectively supported by two second anchors (19); a coupling beam (24) for coup;ing the first anchor (18), and the left weight portion (25) and the right weight portion (26); and a conductive layer (30) laminated on one of the two electrodes. A first capacitor is composed of the first electrode (22) formed on the left weight portion (25), the second electrode (23) opposing to the first electrode (22), and the conductive layer (30). A second capacitor is composed of the first electrode (22) formed on the right weight portion (26), the second electrode (23) opposing to the first electrode (22), and the conductive layer (30). The magnitude and direction of acceleration is calculated on the basis of the difference between the capacitances of the first capacitor and the second capacitor.
摘要翻译：要解决的问题：提供一种提高加速度检测精度的加速度传感器装置。解决方案：一种加速度传感器装置具有：由第一锚固件（18）支撑的左重锤部分（25）和右重锤部分（26）; 形成在这些配重部分上的第一电极（22）和分别由两个第二锚固件（19）支撑的第二电极（23）。第一锚固件（18）和左重量部分（25）和右重量部分（26）的联接梁（24）; 和层压在两个电极之一上的导电层（30）。第一电容器由形成在左配重部分（25）上的第一电极（22），与第一电极（22）相对的第二电极（23）和导电层（30）组成。第二电容器由形成在右重量部分（26）上的第一电极（22），与第一电极（22）相对的第二电极（23）和导电层（30）组成。基于第一电容器和第二电容器的电容之差来计算加速度的大小和方向。

4. 发明专利

JP2006245387A Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2006245387A
公开(公告)日：2006-09-14
申请号：JP2005060381
申请日：2005-03-04
申请人： Denso Corp , 株式会社デンソー
发明人： ABE RYUICHIRO , SAKAI MINEICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To suppress the scattering of water as much as possible to prevent the adhesion of water to a sensing part when exfoliating protective sheets from chips in a method for manufacturing a semiconductor device that removes the protective sheets from the chips, after segmenting the semiconductor wafer with the protective sheet adhered so as to cover the sensing part that exposes on the semiconductor wafer into chips. SOLUTION: The method for manufacturing the semiconductor device comprises steps of preparing the semiconductor wafer 10 having the sensing part 30 on its one surface 11 side, and exfoliating and removing the protective sheet 20 from the segmented chips 100 after segmenting semiconductor wafer 10 with the dicing cut with the protective sheet 20 covering the sensing part 30 adhered to the one surface 11 side of the semiconductor wafer 10. Further, the method proceeds a step of reducing water included in a bonded part at the segmented chips 100 and the protective sheets 20 between the dicing-cut step and the exfoliation step of the protective sheets 20. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在从芯片中去除保护片的制造半导体器件的方法中，尽可能地抑制水的散射，以防止在从芯片剥离保护片时将水粘附到感测部分在将半导体晶片与被粘附的保护片分割以将覆盖在半导体晶片上的感测部分覆盖成芯片之后。解决方案：制造半导体器件的方法包括以下步骤：在其一个表面11侧准备具有感测部分30的半导体晶片10，并且在分割半导体晶片10之后从分段芯片100剥离和去除保护片20 其中覆盖了粘附到半导体晶片10的一个表面11侧的感测部分30的保护片20进行切割。此外，该方法进行在分段芯片100处包含在接合部分中的水的还原和保护切割步骤和保护片20的剥离步骤之间的片材20。（C）版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2003337138A Apparatus having movable electrode, movable mirror apparatus, vibrating gyroscope and method for manufacturing them 有权
标题翻译：具有可移动电极的装置，可移动的镜子装置，振动陀螺仪及其制造方法
公开(公告)号：JP2003337138A
公开(公告)日：2003-11-28
申请号：JP2003059581
申请日：2003-03-06
申请人： Denso Corp , Toyota Central Res & Dev Lab Inc , 株式会社デンソー , 株式会社豊田中央研究所
发明人： TSUCHIYA TOMOYOSHI , FUNABASHI HIROBUMI , FUJITSUKA TOKUO , MITSUSHIMA KOICHI , SAKAI MINEICHI
IPC分类号： G01C19/56 , G01C19/5755 , G01C19/5769 , G01P15/125 , G01P21/00 , H02N1/00 , G01P9/04
CPC分类号： G01P2015/0814
摘要： PROBLEM TO BE SOLVED: To sense a direction in which a physical quantity acts perpendicular to a substrate although apparatuses are manufactured by a simple manufacturing process.
SOLUTION: A movable electrode 148a can be displaced in a z-axis direction (a direction perpendicular to the substrate). Faces 147a (131a, 131b) of the movable electrode 148a and a fixed electrode 132 opposite to the substrate are parallel to the substrate 120 and flat. These faces opposite to the substrate are equally positioned in the z-axis direction. Detection faces of the electrodes 148a, 132 extend in the z-axis direction. The detection face 149a-1 of the movable electrode 148 is wholly flat. The detection face of the fixed electrode 132 comprises a first flat part 133a positioned on a side separated from the substrate 120 and having a long distance from the detection face 149a-1 of the movable electrode 148a and a second flat part 133b positioned on a side near the substrate 120 and having a short distance from the detection face 149a-1 of the movable electrode 148a.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了感测物理量垂直于基板的方向，尽管通过简单的制造工艺制造设备。解决方案：可移动电极148a可以在z轴方向（垂直于衬底的方向）上移位。可移动电极148a的面147a（131a，131b）和与衬底相对的固定电极132平行于衬底120并平坦。与基板相对的这些面等同地位于z轴方向上。电极148a，132的检测面在z轴方向上延伸。可动电极148的检测面149a-1完全平坦。固定电极132的检测面包括位于与基板120分离的一侧并与可动电极148a的检测面149a-1相距很远的位置的第一平坦部133a和位于可动电极148a的第二平面部133b的一侧靠近基板120并且距离可移动电极148a的检测面149a-1具有短的距离。版权所有（C）2004，JPO

6. 发明专利

JP2003240798A CAPACITIVE PHYSICAL QUANTITY SENSOR 审中-公开
公开(公告)号：JP2003240798A
公开(公告)日：2003-08-27
申请号：JP2002041503
申请日：2002-02-19
申请人： DENSO CORP
发明人： SAKAI MINEICHI
IPC分类号： G01P15/125 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To allow the influence on a sensor characteristic due to a process fluctuation to be reduced without deteriorating sensitivity in a capacitive acceleration sensor. SOLUTION: The capacitive acceleration sensor S1 is provided with a beam part 22 having a spring function for displacing in Y direction in accordance with applied acceleration, a movable electrode 24 integrally formed in the beam 22 having a beam shape extending in the direction orthogonal to the displacement direction Y of the beam 22 and capable of displacing along with the beam 22 in the displacement direction of the beam, and fixed electrodes 32, 42 disposed opposite to the movable electrode 24. The acceleration is detected based on a capacitance change between the movable electrode 24 and the fixed electrodes 32, 42 generated by the application acceleration. In the capacitive acceleration sensor S1, an electrode interval (d) as an interval between the movable electrode 24 and the fixed electrodes 32, 42 in the displacement direction Y of the beam 22 is identical to a beam width (b) as a width of a part extending in a direction orthogonal to the displacement direction Y in the beam 22. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2002365306A DYNAMIC-RESPONSE SENSOR 失效
公开(公告)号：JP2002365306A
公开(公告)日：2002-12-18
申请号：JP2001171496
申请日：2001-06-06
申请人： DENSO CORP
发明人： SAKAI MINEICHI , OTA TAMEJI
IPC分类号： G01L5/16 , G01P15/125 , G01P15/18 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To achieve a sensor structure capable of improving the yield, while suppressing vibration in the direction different from the two axial directions, in a capacitive acceleration sensor having a movable electrode displacing depending on the application of acceleration and a fixed electrode facing the movable electrode having a detection space and capable of detecting the acceleration generated in the two axial directions. SOLUTION: A first and a second sensor chips 100 and 200, respectively, form comb like beam structural bodies having movable electrodes 120 and 220 and fixed electrodes 130, 140, 230 and 240 on a semiconductor substrate 10. Both sensor chips 100 and 200 are laminated on one circuit board 300, such that displacement direction X of the movable electrode 120 of the first sensor chip 100 is orthogonal to displacement direction Y of the movable electrode 220 of the second sensor chip 200.

8. 发明专利

JP2002131331A SEMICONDUCTOR DYNAMICAL QUANTITY SENSOR 失效
公开(公告)号：JP2002131331A
公开(公告)日：2002-05-09
申请号：JP2000324178
申请日：2000-10-24
申请人： DENSO CORP
发明人： SAKAI MINEICHI
IPC分类号： B60R21/01 , B81B3/00 , G01C19/56 , G01C19/5755 , G01C19/5762 , G01P15/125 , G01P15/18 , H01L29/84 , G01P9/04
摘要： PROBLEM TO BE SOLVED: To realize an easily miniaturizable constitution of a semiconductor acceleration sensor capable of detecting acceleration in two axial directions crossing at right angles each other. SOLUTION: A movable electrode 30 displaceable in a first direction X and in a second direction Y according to imposed acceleration, first fixed electrodes 40 and 50 forming first detection capacitance CS1 and CS2 together with the electrode 30 to detect the displacement of the electrode 30 in the direction X, and second fixed electrodes 60 and 70 forming second detection capacitance CS3 and CS4 together with the electrode 30 to detect the displacement of the electrode 30 in the direction Y, are formed on a semiconductor substrate 12. The electrode 30 is equipped with a weight portion 31 comprising two bars 31a and 31b crossing each other so as to form an X-shaped flat surface and electrode parts 32 shaped like comb teeth and extending from the weight part 31. The fixed electrodes 40 to 60 form comb-tooth shapes disposed so as to form the capacitance CS1 to CS4 together with the electrode parts 32.

9. 发明专利

JP2002040045A DYNAMIC QUANTITY SENSOR 失效
公开(公告)号：JP2002040045A
公开(公告)日：2002-02-06
申请号：JP2000220923
申请日：2000-07-21
申请人： DENSO CORP
发明人： SAKAI MINEICHI
IPC分类号： G01L1/14 , G01C19/56 , G01C19/5733 , G01P15/125 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To suppress the resonance of a bar-like movable electrode and fixed electrode in detection to improve the precision of sensor output in a dynamic quantity sensor for detecting an applied dynamic quantity on the basis of the change in space between the movable electrode and fixed electrode in the application of the dynamic quantity while giving a periodically changing carrier wave signal to the movable and fixed electrodes. SOLUTION: The individual movable electrode 24 has a bar-like shape extending protrusively from a weight part 21 supported displaceably in Y-axial direction to a first silicon base 11, and the individual fixed electrode 31, 32 has a bar-like shape cantilever-supported by the first silicon base 11 and having a side surface extending protrusively so as to be opposite to the side surface of the movable electrode 24, wherein 1/an integer times the natural frequency in the bending and vibration of the movable electrode 24 and the fixed electrodes 31 and 32 is out of the frequency of a carrier wave signal.

10. 发明专利

JP2002040044A DYNAMIC QUANTITY SENSOR 失效
公开(公告)号：JP2002040044A
公开(公告)日：2002-02-06
申请号：JP2000220913
申请日：2000-07-21
申请人： DENSO CORP
发明人： KATO YOSHIYUKI , SAKAI MINEICHI
IPC分类号： G01L1/14 , B81B3/00 , G01C19/56 , G01C19/5733 , G01P15/125 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To shorten the free vibration time of a movable electrode to a degree that a sensor output is never influenced thereby even in the application of a large impact in a dynamic quantity sensor for detecting an applied dynamic quantity on the basis of the interval change between the movable electrode and a fixed electrode in the application of the dynamic quantity. SOLUTION: The movable part 20 having the comb tooth-like movable electrode 24 is connected to and supported by a base part 11 through a beam part 22 as spring part so as to be displaceable in Y-axial direction. The comb tooth- like fixed electrodes 31 and 32 are arranged opposite to the movable electrode 24 through a detecting interval 40. The Q-value of the Y-axial vibration of the movable part 20 is smaller than 1/500 times the resonance frequency in the Y-axial vibration of the movable part 20 to hasten the damping of the free vibration of the movable part 20 to a degree that the sensor output is never influenced thereby.

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