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1. 发明专利

JP2004270004A Sn PLATING ELECTRODE AND Sn PLATING METHOD USING THE SAME 有权
公开(公告)号：JP2004270004A
公开(公告)日：2004-09-30
申请号：JP2003065272
申请日：2003-03-11
申请人： Daiso Co Ltd , Nippon Steel Corp , Showa Entetsu:Kk , ダイソー株式会社 , 新日本製鐵株式会社 , 株式会社昭和鉛鉄
发明人： TAKAYASU AKIRA , MARUHASHI TOSHIHIRO , SHIMIZU HIROKATSU , OTOGAWA RYUICHI
IPC分类号： C25D5/26 , C25D7/06 , C25D17/10 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To provide an Sn plating electrode which, even when applied to a line where the workpiece moves at a high speed, suffers little from the separation of an active material layer and prevents an Sn deposit from being formed on the electrode. SOLUTION: The electrode 201 has an electrode base 30 and a discharge member 35. The discharge member 35 has an active material support and a discharge member. The active material support is disposed on the side opposite to the member SS to be treated of the electrode base 30 and fixed on the electrode base 30 so as to be electrically connected with the base 30. The discharge member has a conductive active material layer which covers the surface side acting as the discharge surface of the active material support. The conductive active material layer comprises metal oxides containing 70 to 75 mass % Ir in terms of IrO 2 , 15 to 20 mass % Ta in terms of Ta 2 O 5 , and 5 to 15 mass% Sn in terms of SnO 2 . COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2002256497A INSOLUBLE ANODE 失效
公开(公告)号：JP2002256497A
公开(公告)日：2002-09-11
申请号：JP2001110624
申请日：2001-03-05
申请人： DAISO CO LTD , NIPPON STEEL CORP , SHOWA ENTETSU KK
发明人： HIGOHASHI HIROYOSHI , OTOGAWA RYUICHI , SHIMIZU HIROKATSU , IDOKO SHINJI , HAMAGUCHI KATSUHIRO , TAKAYASU AKIRA
IPC分类号： C25D17/10 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To reduce working such as mending or exchange of an electrode, by extending a usable period of the electrode such as insoluble anodes used in electroplating both sides of a steel plate, which are often cathodically polarized during the electrolysis. SOLUTION: The insoluble anodes used in an apparatus for electroplating a steel strip as a cathode, which travels between two plates of insoluble anodes immersed in an electrolytic bath with a predetermined space, is characterized in that the external marginal parts 4 of the electrode surface, which are cathodically polarized due to potential difference between two plates of electrodes, are covered with platinum 5' as an electrode activation material.

3. 发明专利

JPH028395A DEVICE FOR PREVENTING SHORT CIRCUIT OF ELECTRODE FOR PLATING STEEL SHEET 失效
公开(公告)号：JPH028395A
公开(公告)日：1990-01-11
申请号：JP15707588
申请日：1988-06-24
申请人： DAISO CO LTD
发明人： SHIMIZU HIROKATSU , HIRAI RYUJI
IPC分类号： C25D7/06 , C25D17/00 , C25D17/12
摘要： PURPOSE:To prevent a short circuit between anode and cathode by screwing plural plastic bolts into the porous metal anode and fixing the bolts so that the heads are projected from the front side of the anode. CONSTITUTION:Plural metal nuts 7 are adhered to the rear side of a porous metal anode 1. Plural plastic bolts 6 are screwed into the anode 1 from the front side and fixed by the nuts 7 so that the heads of the bolts 6 are projected from the front side of the anode 1 and faced to a steel sheet as cathode. Thus, a short circuit between the anode and cathode can be prevented.

4. 发明专利

JP2004269955A Copper sulfate plating device, and plating method 有权
公开(公告)号：JP2004269955A
公开(公告)日：2004-09-30
申请号：JP2003061621
申请日：2003-03-07
申请人： Daiso Co Ltd , Osaka Prefecture , Uingu:Kk , ダイソー株式会社 , 大阪府 , 有限会社ウイング
发明人： YOKOI MASAYUKI , MORIKAWA TSUTOMU , NAKADE TAKAO , SATO SHINICHI , YUYA SUSUMU , SHIMIZU HIROKATSU
IPC分类号： C25D17/00 , C25D17/10 , C25D21/14
摘要： PROBLEM TO BE SOLVED: To provide a copper sulfate plating device and a plating method where various points at issue in the case when a metal anode and an insoluble anode are used are solved. SOLUTION: The plating device is provided a copper plating tank (A) where an insoluble anode is installed in the inside of an anode chamber separated from a plating liquid with a cation exchange membrane and a circulation type dissolution tank (B) for dissolving copper oxide. When plating is performed using the device, copper oxide in an amount equivalent to the loss of copper ions in the plating liquid having a chlorine ion concentration of 35 to 1,100 ppm is charged/dissolved into the dissolution tank, and the copper ion concentration in the circulating plating liquid is controlled. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2003293178A Method for preparing chemical for water treatment 审中-公开
标题翻译：制备水处理化学品的方法
公开(公告)号：JP2003293178A
公开(公告)日：2003-10-15
申请号：JP2002102207
申请日：2002-04-04
申请人： Daiso Co Ltd , ダイソー株式会社
发明人： HIGOHASHI HIROYOSHI , SHIMIZU HIROKATSU , OTOGAWA RYUICHI
IPC分类号： C02F1/50 , C02F1/46 , C25B1/26 , C25B11/10 , C25B13/08
摘要： PROBLEM TO BE SOLVED: To provide a method for preparing chemicals for water treatment capable of preparing an alkali hypochlorite solution having an effective chlorine concentration of 2 to 6 wt.% with high current efficiency for a log period of time within a range of from 1.0 to 10.0 ppm in concentrations of Ca
2+ and Mg
2+ , without requiring a process step for circulating anolyte and an apparatus for refining brine in an electrolytic cell of an on-site system using an ion exchange membrane.
SOLUTION: The chemicals for water treatment containing the alkali hypochlorite of 2 to 6 wt.% in terms of the concentration of effective chlorine are prepared in a diaphragm electrolytic cell. The anode to be used is formed by depositing a coating layer consisting of an electrode active substance containing a platinum group metal or its oxide on a conductive base material consisting of metal titanium or its alloy. The ion exchange membrane to be used has only sulfonic acid groups as its ion exchange groups. The concentration of the impurities Ca
2+ and Mg
2+ in the resultant alkali chloride solution ranges from 1.0 to 10.0 ppm, more preferably 1.0 to 3.0 ppm.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决问题的方法：提供一种水处理用化学品的制造方法，能够以高电流效率制备有效氯浓度为2〜6重量％的碱性次氯酸盐溶液，的浓度为1.0〜10.0ppm，不需要在阳极电解液中循环阳极电解液的处理工序和精炼盐水的装置，使用离子交换膜的现场系统。
解决方案：在隔膜电解槽中制备含有次氯酸碱为2-6重量％的用于有效氯浓度的水处理化学品。所使用的阳极通过在由金属钛或其合金构成的导电性基材上沉积由含铂族金属或其氧化物的电极活性物质构成的被覆层而形成。所使用的离子交换膜仅具有磺酸基作为其离子交换基团。所得碱金属氯化物溶液中杂质Ca 2 + 和Mg 2 + 的浓度范围为1.0至10.0ppm，更优选为1.0至3.0ppm。版权所有（C）2004，JPO

6. 发明专利

JP2002088495A METHOD FOR PRODUCING METALLIC FOIL 失效
公开(公告)号：JP2002088495A
公开(公告)日：2002-03-27
申请号：JP2000318590
申请日：2000-09-12
申请人： DAISO CO LTD
发明人： HIGOHASHI HIROYOSHI , OTOGAWA RYUICHI , SHIMIZU HIROKATSU
IPC分类号： C25D1/04 , C25D3/38 , C25D7/06 , C25D17/10 , C25D21/14 , C25D21/18
摘要： PROBLEM TO BE SOLVED: To prolong the service life of an electrode used as an anode when producing metallic foil by electrolytic reaction and to improve the mechanical strength of the metallic foil. SOLUTION: In an electrolytic cell for producing metallic foil in which an electrode obtained by providing the surface of an electrically conductive substrate with a coating layer containing iridium oxide is used as an anode, and objective metal is precipitated over the surface of a cathode face, strontium carbonate is added to an electrolytic solution to be fed, and formed precipitation is removed away to reduce the concentration of lead ions in the electrolytic solution to

7. 发明专利

JP2001020090A MANUFACTURE OF METALLIC FOIL 失效
公开(公告)号：JP2001020090A
公开(公告)日：2001-01-23
申请号：JP22681399
申请日：1999-07-06
申请人： DAISO CO LTD
发明人： OTOGAWA RYUICHI , YAMAUCHI SHINJI , SHIMIZU HIROKATSU
IPC分类号： C25D1/04 , C25D17/10
摘要： PROBLEM TO BE SOLVED: To manufacture a homogeneous foil by suppressing the generation of pin hole defect of the foil in the manufacture of the electrolytic metallic foil. SOLUTION: In the manufacture of the metallic foil by a method by stripping a metallic layer formed on a rotary cylindrical cathode A by and electrolytic reaction, an electrode provided with a coated layer of an electrode activating material containing a platinum group metal oxide through an intermediate layer of tantalum on a conductive metallic base body such as titanium as an assistant anode E for controlling the current density in the start of the electrodeposition is used.

8. 发明专利

JPH10287998A INSOLUBLE ANODE 失效
公开(公告)号：JPH10287998A
公开(公告)日：1998-10-27
申请号：JP10011497
申请日：1997-04-17
申请人： DAISO CO LTD , NIPPON STEEL CORP
发明人： SODA KOICHI , OTOGAWA RYUICHI , YAMAUCHI SHINJI , SHIMIZU HIROKATSU , KITAIKE HIROYUKI , KASUYA AKIHIRO
IPC分类号： C25B11/06 , C25D17/10 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To lessen the consumption of two sheets of insoluble anodes and to prolong the service life of these anodes by changing the amt. of the electrode active substances according to the potential difference to be impressed on the electrodes at the time of applying the electroplating on both surfaces of a steel sheet in different amts. by using two sheets of the insoluble anodes. SOLUTION: At the time of allowing the steel sheet to travel between two sheets of the insoluble anodes in the plating liquid and applying the electroplating of the different amts. on both surfaces thereof, the width of the insoluble anodes is set larger than the width of the steel sheet to be plated and both surfaces of the steel sheet are plated by giving a difference in the potential of the anodes by a difference in the plating amts. The insoluble anodes are formed by coating the surfaces of titanium substrates with iridium oxide or a compound oxide of iridium-tantalum, iridium- titanium, etc., as the electrode active substances. The coating material, of the electrode active substance on the anode surface where cathode polarization is induced by the difference in the potential between the two anodes is set at 60 g/m and the coating amt. of the electrode active substance of the anode where the cathode polarization does not arise is set at 15 to 60 g/m . As a result, the consumption of the electrode active substance by the cathode polarization of the anodes is decreased.

9. 发明专利

JP2003231987A DEVICE FOR MANUFACTURING METALLIC FOIL 审中-公开
公开(公告)号：JP2003231987A
公开(公告)日：2003-08-19
申请号：JP2002071050
申请日：2002-02-07
申请人： DAISO CO LTD
发明人： HIGOHASHI HIROYOSHI , OTOGAWA RYUICHI , SHIMIZU HIROKATSU
IPC分类号： C25D1/04
摘要： PROBLEM TO BE SOLVED: To inhibit generation of a pin hole defect over a long period of time and manufacture a uniform metallic foil, in manufacture of the electrolytic metallic foil. SOLUTION: This device for manufacturing the metallic foil has an auxiliary anode for regulating current density at a start on electrodeposition, when manufacturing the metallic foil with a method of peeling the metallic foil formed on a rotation cylindrical cathode by an electrolytic reaction, wherein the auxiliary anode is provided with a coating layer of an electrode active material including a metal oxide of a platinum group, on an electroconductive metal substrate such as titanium, through an intermediate layer of tantalum, and has a center- line average roughness in a range of Ra=1-25 μm, on the electrode surface. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2001172793A ELECTRODE AND Sn PLATING DEVICE USING THE ELECTRODE 失效
公开(公告)号：JP2001172793A
公开(公告)日：2001-06-26
申请号：JP35210699
申请日：1999-12-10
申请人： NIPPON STEEL CORP , DAISO CO LTD , SHOWA ENTETSU KK
发明人： MIYAZAKI HIRONOBU , SHIMIZU HIROKATSU , TAKAYASU AKIRA
IPC分类号： C25D7/06 , C25D17/12 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To provide an electrode having a structure by which a negative pressure is hardly generated in a gap between the electrode and an article to be plated even when the electrode is applied to a line on which the article is moved at a high speed and hardly causing such a trouble as short circuiting. SOLUTION: A liquid (electrolyte) is circulated between the front side and rear side of an electrode 1 through the communicating part 7 of a discharge member 35 and the through part 6 of an electrode substrate 30 even if a member to be treated such as a steel strip is confronted with the discharge face and moved at a high speed to generate a liquid stream, and a negative pressure is hardly generated between the member and electrode 1. As a result, although the member and electrode 1 tend to be attracted and brought close to each other to cause a deficiency of short circuiting, etc., the deficiency is effectively prevented. Further, since the generation of a negative pressure is reduced, the feed rate of the member is increased, and the efficiency in electrochemical treatment such as plating and electrolytic pickling using the electrode is drastically improved.

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