会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • Vertical cavity surface emitting laser, image forming apparatus using the same
    • 垂直孔表面发射激光器,使用其的图像形成装置
    • JP2011249557A
    • 2011-12-08
    • JP2010121228
    • 2010-05-27
    • Canon Incキヤノン株式会社
    • INAO YASUHISAIKUTA MITSUHIROTAKEUCHI TETSUYA
    • H01S5/183B41J2/44
    • H01S5/187B82Y20/00G03G15/04G03G15/04072G03G15/326H01S5/18311H01S5/18358H01S5/3022H01S5/34326H01S5/3436H01S5/423
    • PROBLEM TO BE SOLVED: To provide a vertical cavity surface emitting laser which can prevent delamination at the interface of a selective oxidation layer and a spacer layer while suppressing the voltage rise, and can enhance reliability.SOLUTION: In a vertical cavity surface emitting laser, an n-type semiconductor Bragg reflector, a p-type semiconductor Bragg reflector, and an active layer interposed therebetween are laminated on a substrate, the p-type semiconductor Bragg reflector is provided on the active layer with a p-type spacer layer and a selective oxidation layer interposed therebetween, and a current constriction structure is formed by oxidizing the selective oxidation layer. A first intermediate layer provided contiguously to the selective oxidation layer and composed of a material that does not promote oxidation when the selective oxidation layer is oxidized, and a second intermediate layer provided contiguously to the first intermediate layer and a third intermediate layer provided contiguously to the second intermediate layer in order to adjust a band gap to the p-type spacer layer are interposed between the selective oxidation layer and the p-type spacer layer.
    • 要解决的问题:提供一种能够在抑制电压升高的同时防止选择性氧化层和间隔层的界面分层的垂直腔面发射激光器,并且可以提高可靠性。 解决方案:在垂直腔表面发射激光器中,在衬底上层叠n型半导体布拉格反射器,p型半导体布拉格反射器和夹在其间的有源层,提供p型半导体布拉格反射器 在具有p型间隔层的有源层和介于其间的选择性氧化层,并且通过氧化选择性氧化层形成电流收缩结构。 第一中间层与选择性氧化层连续地设置,并且在选择氧化层被氧化时由不会促进氧化的材料构成,第二中间层与第一中间层连续地设置,第三中间层邻接于 为了调整与p型隔离层的带隙的第二中间层插入在选择性氧化层和p型隔离层之间。 版权所有(C)2012,JPO&INPIT
    • 2. 发明专利
    • Method for manufacturing near field exposure mask, near field exposure method and near field exposure device
    • 制造近场曝露掩模的方法,近场曝光方法和近场曝光装置
    • JP2008015168A
    • 2008-01-24
    • JP2006185699
    • 2006-07-05
    • Canon Incキヤノン株式会社
    • INAO YASUHISAITO TOSHIKIYAMAGUCHI TAKAKOMIZUTANI NATSUHIKO
    • G03F1/54H01L21/027
    • G03F7/2014G03F1/50
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a near field exposure mask by which distortion on a mask surface can be suppressed and a flat mask can be formed in manufacturing a near field exposure mask using a rubber elastic material, and to provide a near field exposure method and a near field exposure device.
      SOLUTION: The method for manufacturing a near field exposure mask includes: a step of preparing a first substrate; a release layer forming step of forming a release layer on the first substrate; a light shielding layer forming step of forming a light shielding layer that blocks illumination light on the release layer; an aperture forming step of forming an aperture opening having a width shorter than the wavelength of the illumination light on the light shielding layer; a mask base forming step of forming a mask base material made of a rubber elastic material that is transparent to the illumination light, on the light shielding layer where the aperture is formed; a second substrate joining step of joining a second substrate that is transparent to the illumination light on the mask base material; and a first substrate peeling step of peeling the first substrate from the light shielding layer via the peeling layer.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 解决的问题:提供一种制造近场曝光掩模的方法,通过该方法可以抑制掩模表面上的变形并且可以在使用橡胶弹性材料制造近场曝光掩模时形成平面掩模,以及 以提供近场曝光方法和近场曝光装置。 解决方案:近场曝光掩模的制造方法包括:制备第一衬底的步骤; 释放层形成步骤,在所述第一基板上形成剥离层; 遮光层形成步骤,形成遮光层,遮光层阻挡在剥离层上的照明光; 开口形成步骤,形成具有比遮光层上的照明光的波长短的宽度的开口; 掩模基底形成步骤,在形成有孔的遮光层上形成由对照明光透明的橡胶弹性材料制成的掩模基材; 第二基板接合步骤,将对所述照明光透明的第二基板接合在所述掩模基材上; 以及经由剥离层从遮光层剥离第一基板的第一基板剥离工序。 版权所有(C)2008,JPO&INPIT
    • 4. 发明专利
    • Photomask and near-field exposure method
    • 光电和近场曝光方法
    • JP2006019445A
    • 2006-01-19
    • JP2004194819
    • 2004-06-30
    • Canon Incキヤノン株式会社
    • MIZUTANI NATSUHIKOINAO YASUHISA
    • H01L21/027G03F1/36G03F1/68G03F7/20
    • G03F7/7035B82Y10/00G03F1/36G03F1/50G03F7/70325
    • PROBLEM TO BE SOLVED: To equate the intensity distribution of near-field light in each slit in a photomask used for near-field exposure.
      SOLUTION: Exposure is made by exposure light having a wavelength of 436nm by using the photomask. Five slits (s) are formed mutually in parallel in a light-shielding film 102 in the photomask. The opening length of each slit (s) is 2,000nm, and the pitch (p) (distance between centers) between respective slits S is 100nm. The opening width of three inner slits S is set to 40nm, and that of two outer slits S is set to 50nm. As a result, when exposure is made by exposure light having a wavelength of 436nm, the intensity distribution of near-field light in each slit (s) can be made equal.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:将用于近场曝光的光掩模中的每个狭缝中的近场光的强度分布相等。

      解决方案:使用光掩模对波长为436nm的曝光进行曝光。 五个狭缝在光掩模中的遮光膜102中相互平行地形成。 每个狭缝的开口长度为2,000nm,各狭缝S之间的间距(p)(中心之间的距离)为100nm。 三个内部狭缝S的开口宽度设定为40nm,两个外部狭缝S的开口宽度设定为50nm。 结果,当通过具有波长为436nm的曝光光进行曝光时,可以使每个狭缝中的近场光的强度分布相等。 版权所有(C)2006,JPO&NCIPI

    • 7. 发明专利
    • Surface emitting laser
    • 表面发射激光
    • JP2013157473A
    • 2013-08-15
    • JP2012017092
    • 2012-01-30
    • Canon Incキヤノン株式会社
    • UCHIDA TATSUROINAO YASUHISA
    • H01S5/183
    • H01S5/18B82Y20/00G03G15/04072H01S5/18311H01S5/18338H01S5/18391H01S5/209H01S5/3202H01S5/34326H01S2301/166
    • PROBLEM TO BE SOLVED: To provide a mesa-structure surface emitting laser having a current constriction structure, which inhibits increase in value of oscillation threshold current even when an off substrate and a surface relief structure are used.SOLUTION: A surface emitting laser having a mesa structure comprises: an off substrate; a lower reflection mirror; an active layer; a current constriction structure; an upper reflection mirror; and a surface relief structure. A central axis of a high reflectance region of the surface relief structure and a central axis of the mesa structure are not coincident with each other and a value of oscillation threshold current is lower than when the central axis of the high reflectance region of the surface relief structure and the central axis of the mesa structure are coincident with each other.
    • 要解决的问题:提供一种具有电流收缩结构的台面结构表面发射激光器,其即使在使用截止基板和表面浮雕结构时也抑制了振荡阈值电流的增加。解决方案:具有 台面结构包括:离开基板; 下反射镜; 活性层 目前的收缩结构; 上反射镜; 和表面浮雕结构。 表面浮雕结构的高反射率区域和台面结构的中心轴的中心轴线彼此不一致,并且振荡阈值电流的值低于表面浮雕的高反射率区域的中心轴线 结构和台面结构的中心轴彼此重合。
    • 8. 发明专利
    • Surface emitting laser and surface emitting laser array, method for manufacturing surface emitting laser and surface emitting laser array, and optical apparatus including surface emitting laser array
    • 表面发射激光和表面发射激光阵列,用于制造表面发射激光和表面发射激光阵列的方法,以及包括表面发射激光阵列的光学装置
    • JP2012104522A
    • 2012-05-31
    • JP2010249129
    • 2010-11-05
    • Canon Incキヤノン株式会社
    • INAO YASUHISAUCHIDA TATSUROUCHIDA TAKESHI
    • H01S5/187
    • H01S5/18391H01S5/18313H01S2301/166H01S2301/176
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface emitting laser capable of suppressing variations of characteristics for every surfaces and wafers, and oscillating in single fundamental transverse mode.SOLUTION: The method for manufacturing a surface light emitting laser comprises a step for exposing a bottom surface of a surface relief structure by etching a second semiconductor layer using a first semiconductor layer in which the surface relief structure pattern is formed as an etching mask and using a third semiconductor layer as an etching stop, after a selective oxidation step; a step for exposing an upper surface of the surface relief structure by etching the first semiconductor layer in which the surface relief structure pattern is formed using the second semiconductor layer and the third semiconductor layer as etching stops; and a contact part protection step for protecting a first semiconductor layer region acting as the contact part and arranged at an outer peripheral side of the bottom surface of the surface relief structure which is the opposite side to the upper surface of the surface relief structure.
    • 要解决的问题:提供一种能够抑制每个表面和晶片的特性变化并且以单个基本横向振荡的表面发射激光器的制造方法。 解决方案:制造面发光激光器的方法包括通过使用形成表面浮雕结构图案作为蚀刻的第一半导体层蚀刻第二半导体层来暴露表面起伏结构的底表面的步骤 在选择性氧化步骤之后,使用第三半导体层作为蚀刻停止层; 通过蚀刻使用第二半导体层和第三半导体层蚀刻形成表面浮雕结构图案的第一半导体层来暴露表面浮雕结构的上表面的步骤停止; 以及接触部分保护步骤,用于保护用作接触部分的第一半导体层区域并且布置在与表面浮雕结构的上表面相对的表面浮雕结构的底表面的外周侧。 版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Manufacturing method of surface-emitting laser, manufacturing method of surface-emitting laser array, surface-emitting laser and surface-emitting laser array, and optical equipment comprising surface-emitting laser array
    • 表面发射激光的制造方法,表面发射激光阵列,表面发射激光和表面发射激光阵列的制造方法以及包含表面发射激光阵列的光学设备
    • JP2010040600A
    • 2010-02-18
    • JP2008198951
    • 2008-07-31
    • Canon Incキヤノン株式会社
    • IKUTA MITSUHIROINAO YASUHISAYAMAGUCHI TAKAKO
    • H01S5/183
    • H01S5/18391H01S5/18311H01S5/18347H01S2301/166H01S2301/176
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface-emitting laser, reducing process damage applied on a surface relief structure to obtain a stable single lateral mode characteristic. SOLUTION: The surface-emitting laser has a surface relief structure of step construction for controlling a reflection index at the light-emitting part of an upper mirror. The manufacturing method thereof includes: a step in which a resist pattern comprising the pattern for forming a mesa structure and the pattern for forming a step construction is formed on or above the upper mirror, and a surface layer of the upper mirror is etched as a first etching for determining a horizontal position of the step structure; a step of forming a current constriction structure after the step of first etching; and a step in which, after the step of forming the current constriction structure, a place subjected to first etching is further etched, as a second etching for determining a depth position of the step construction. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供表面发射激光器的制造方法,减少施加在表面浮雕结构上的工艺损伤,以获得稳定的单一横向模式特性。 解决方案:表面发射激光器具有用于控制上反射镜的发光部分的反射指数的台阶结构的表面浮雕结构。 其制造方法包括:在上反射镜上或上方形成包括形成台面结构的图案的抗蚀剂图案和用于形成台阶结构的图案的步骤,并且将上镜的表面层蚀刻为 用于确定台阶结构的水平位置的第一蚀刻; 在第一蚀刻步骤之后形成电流收缩结构的步骤; 以及在形成电流收缩结构的步骤之后进一步蚀刻经受第一蚀刻的位置作为用于确定台阶结构的深度位置的第二蚀刻的步骤。 版权所有(C)2010,JPO&INPIT
    • 10. 发明专利
    • Exposure mask and method for manufacturing the same
    • 曝光掩模及其制造方法
    • JP2008070622A
    • 2008-03-27
    • JP2006249433
    • 2006-09-14
    • Canon Incキヤノン株式会社
    • YASUI NOBUHIROITO TOSHIKIINAO YASUHISADEN TORU
    • G03F1/38G03F1/68H01L21/027
    • PROBLEM TO BE SOLVED: To provide an exposure mask having high perpendicularity of a side wall by imparting a porous structure having a reinforcing effect to an opening portion in a light shielding layer, and capable of reducing loss of light due to reflection, and to provide a method for manufacturing the mask.
      SOLUTION: The exposure mask comprises a substrate 100 having a transmitting property for exposure light and a light shielding layer 101 disposed in contact on the substrate and having a light shielding region 102 and a transmissive region 103, wherein the transmissive region 103 comprises a porous structure having a plurality of pores 104 perpendicular to the substrate 100.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了通过赋予遮光层中的开口部分具有增强作用的多孔结构并且能够减少由于反射引起的光的损失而提供具有高侧垂直度的曝光掩模, 并提供一种制造掩模的方法。 解决方案:曝光掩模包括具有曝光光的透射特性的基板100和与基板接触设置并具有遮光区域102和透射区域103的遮光层101,其中透射区域103包括 多孔结构具有垂直于衬底100的多个孔104.权利要求(C)2008,JPO&INPIT