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    • 2. 发明专利
    • Device for manufacturing magnetic recording medium
    • 制造磁记录介质的装置
    • JP2012099181A
    • 2012-05-24
    • JP2010246386
    • 2010-11-02
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • YAMANAKA KAZUTOHIRAMATSU SHOGO
    • G11B5/84G11B5/738
    • G11B5/855
    • PROBLEM TO BE SOLVED: To prevent a deterioration in an etching rate due to the adhesion of a film to be etched around a substrate holder.SOLUTION: This device for manufacturing a magnetic recording medium by performing respective processing on a substrate mounted on the substrate holder has a holder film forming chamber for forming a first film on the substrate holder with no substrate mounted, a substrate mounting chamber for mounting a substrate on the substrate holder with the first film formed, and a processing chamber for performing dry etching processing on a substrate with a resist layer of a prescribed pattern formed on a multilayer film including a magnetic film layer to process the magnetic film layer into a shape based on the prescribed pattern. The first film is a film that is more difficult to be etched than a film in the multilayer film removed by the dry etching processing, and the processing chamber, the holder film forming chamber and the substrate mounting chamber are connected such that the substrate holder can be carried under more decompressed condition than the atmosphere.
    • 要解决的问题:为了防止由于待蚀刻的膜周围的衬底保持器的粘附而引起的蚀刻速率的劣化。 解决方案:用于通过在安装在基板保持器上的基板上进行各种处理来制造磁记录介质的装置具有用于在不安装基板的基板保持器上形成第一膜的保持器膜形成室,用于 在形成有第一膜的基板保持器上安装基板,以及处理室,用于在具有规定图案的抗蚀剂层的基板上进行干蚀刻处理,所述处理室形成在包括磁性膜层的多层膜上,以将该磁性膜层加工成 基于规定图案的形状。 第一膜是通过干蚀刻处理除去的多层膜中的膜比难以蚀刻的膜,并且处理室,保持膜形成室和基板安装室被连接,使得基板保持器 在比大气更减压的条件下运载。 版权所有(C)2012,JPO&INPIT
    • 4. 发明专利
    • Plasma cvd apparatus, and vacuum processing apparatus
    • 等离子体CVD装置和真空加工装置
    • JP2014122376A
    • 2014-07-03
    • JP2012278183
    • 2012-12-20
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • YAKUSHIGAMI HIROSHISHIBAMOTO MASAHIROYAMANAKA KAZUTOHIRAMATSU SHOGOKANO SHIN
    • C23C16/44C23C16/27
    • C23C14/568C23C16/26C23C16/4401C23C16/509G11B5/85
    • PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which prevents generation of particles in a protection film forming chamber without providing an oxygen cleaning process for eliminating a DLC (Diamond Like Carbon) film deposited in the protection film forming chamber.SOLUTION: A protection film forming chamber 128 where a protection film consisting of carbon is made on a magnetic film includes: a gas introduction part 82 introducing raw material gas into a vacuum chamber; a discharge electrode 831 having a discharge surface provided in a position facing a substrate 1 transported to a predetermined position in the vacuum chamber; a plasma formation part applying voltage between the substrate 1 transported to the predetermined position and the discharge surface; a permanent magnet 835 provided on a rear surface of the discharge surface, including a first magnet of which a pole of one polarity is directed to the surface, and a second magnet of which a pole of the reverse polarity with respect to the first magnet is directed to the discharge surface; and a non-erosion part mask 838 which is provided parallel to the surface of the discharge electrode 831, and covers and surrounds a region facing the permanent magnet 835 out of the surface of the discharge electrode 831.
    • 要解决的问题:提供一种防止在保护膜形成室中产生颗粒的等离子体处理装置,而不提供用于消除沉积在保护膜形成室中的DLC(类金刚石)膜的氧气清洁工艺。解决方案:保护 在磁性膜上形成由碳构成的保护膜的成膜室128包括:将原料气体导入真空室的气体导入部82; 放电电极831,具有设置在面向被输送到真空室中的预定位置的基板1的位置的放电表面; 等离子体形成部分,其在传送到所述预定位置的所述基板1和所述排出表面之间施加电压; 设置在排出表面的后表面上的永磁体835,包括一个极性的极引导到表面的第一磁体和相对于第一磁体的相反极性的极的第二磁体是 指向排放表面; 以及平行于放电电极831的表面设置的非侵蚀部掩模838,并且覆盖并包围在放电电极831的表面之外的永久磁铁835的区域。
    • 5. 发明专利
    • Sputtering apparatus and sputtering method
    • 溅射装置和喷射方法
    • JP2009191356A
    • 2009-08-27
    • JP2008194733
    • 2008-07-29
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • SHIBAMOTO MASAHIROYAMANAKA KAZUTO
    • C23C14/34C23C16/455H01L21/285
    • PROBLEM TO BE SOLVED: To provide a gas introduction path for improving the uniformity of a process gas.
      SOLUTION: A sputtering apparatus has a substrate-holding means for holding a substrate, a gas introduction path which has a plurality of gas exhaust nozzles arranged in a shape of a closed curve at a plurality of positions surrounding the circumference of the substrate, and gas-introduction connection ports provided in at least two positions of approximately opposing to each other on the closed curve. Such two gas introduction paths are provided on the front surface side and the rear surface side of the substrate so as to be symmetrical with respect to the substrate.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供用于提高处理气体的均匀性的气体引入路径。 解决方案:溅射装置具有用于保持基板的基板保持装置,气体引入路径,其具有在围绕基板的周边的多个位置处以闭合曲线的形状布置的多个排气喷嘴 和气体导入连接口,其设置在闭合曲线上彼此大致相对的至少两个位置。 这样的两个气体导入路径设置在基板的表面侧和背面侧,以相对于基板对称。 版权所有(C)2009,JPO&INPIT
    • 6. 发明专利
    • Substrate processing apparatus and thin film deposition apparatus
    • 基板加工装置和薄膜沉积装置
    • JP2010059473A
    • 2010-03-18
    • JP2008226033
    • 2008-09-03
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • SATO AKIOSHIBAMOTO MASAHIROYAMANAKA KAZUTODJAYAPRAWIRA DAVID
    • C23C14/32H01L21/027H01L21/302
    • PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a thin film deposition apparatus which are stably used for a long period of time, and have reduced manufacturing cost.
      SOLUTION: The substrate processing apparatus includes a conductive substrate holder 20 for holding a substrate 9, an ion beam source for irradiating the substrate 9 with ion beams, a grounding part 13 for connecting the substrate holder 20 to the ground, and a driving part 18 for bringing the grounding part 13 into contact with or not into contact with the substrate holder 20. The substrate holder 20 is grounded by bringing the grounding part 13 into contact with the substrate holder 20 during the etching or immediately before the etching performed by irradiating the substrate 9 with ion beams from the ion beam source.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供长时间稳定使用并降低制造成本的基板处理装置和薄膜沉积装置。 解决方案:基板处理装置包括用于保持基板9的导电基板保持器20,用于用离子束照射基板9的离子束源,用于将基板保持器20连接到地面的接地部13,以及 驱动部分18,用于使接地部分13与基板保持器20接触或不接触。基板保持器20通过在蚀刻期间或在蚀刻之前或之后使接地部分13与基板保持器20接触而接地 通过用离子束源的离子束照射基板9。 版权所有(C)2010,JPO&INPIT
    • 7. 发明专利
    • Vacuum processing apparatus
    • 真空加工设备
    • JP2012255207A
    • 2012-12-27
    • JP2012110585
    • 2012-05-14
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • YAMANAKA KAZUTOHIRAMATSU SHOGO
    • C23C16/44C23C14/56H01L21/677
    • PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus which can improve the throughput of deposition processing, and can perform a plurality of kinds of processing at the same time.SOLUTION: The vacuum processing apparatus 1 transports a material S to be processed along a transfer route R in a condition that the material is held on a carrier 3, and performs prescribed vacuum processing in a plurality of process chambers disposed along the transfer route R, wherein the material S to be processed held on the carrier 3 is replaced in a plurality of turnabout chambers disposed in each corner part on the transfer route R.
    • 要解决的问题:提供一种可以提高沉积处理的生产能力的真空处理装置,并且可以同时执行多种处理。 解决方案:真空处理装置1在材料被保持在载体3上的条件下沿着传送路径R传送要处理的材料S,并且在沿传送设置的多个处理室中进行规定的真空处理 路线R,其中被保持在载体3上的待处理材料S被更换为设置在传送路径R上的每个拐角部分中的多个转动室。(C)2013,JPO和INPIT