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    • 2. 发明专利
    • Fluid control valve
    • 流体控制阀
    • JP2007107606A
    • 2007-04-26
    • JP2005298865
    • 2005-10-13
    • Ckd Corpシーケーディ株式会社
    • NABEI TATSUMINITTA SHINICHI
    • F16K17/04F16K7/17F16K17/06F16K31/145
    • PROBLEM TO BE SOLVED: To resolve inconveniences such as residues of bubbles or liquid accumulation without causing complication of a composition.
      SOLUTION: The fluid control valve 10 is provided with: a valve element 30 having a second diaphragm member 32 and a shaft part (a boss part 32c of the second diaphragm member 32 and a rod part33); and a body 11 operably housing the valve element 30. In the fluid control valve 10, a second fluid chamber R2 is formed along the shaft part, a pressure acting chamber R4 is formed in one side of the second diaphragm member 32, sandwiching it, and a third fluid chamber R3 is formed in the other side so as to surround the shaft part. A communication groove 27 connecting the second fluid chamber R2 and the third fluid chamber R3 is provided in a side of the shaft part opposite to an opening 24a of a discharge passage 24.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:解决诸如气泡残留或液体积聚的不便,而不会导致组合物的复杂化。 流体控制阀10设置有具有第二隔膜构件32和轴部(第二隔膜构件32的凸台部32c和杆部33)的阀体30; 以及可操作地容纳阀元件30的主体11.在流体控制阀10中,沿着轴部形成有第二流体室R2,压力作用室R4形成在第二隔膜构件32的一侧,夹在其中, 并且第三流体室R3形成在另一侧以围绕轴部。 连接第二流体室R2和第三流体室R3的连通槽27设置在与排出通道24的开口24a相对的轴部的一侧。(C)2007,JPO&INPIT
    • 7. 发明专利
    • CONTROLLING SYSTEM FOR VACUUM PRESSURE
    • JP2002095954A
    • 2002-04-02
    • JP2000289753
    • 2000-09-25
    • CKD CORP
    • MATSUOKA YUJINITTA SHINICHIISHIHARA TETSUYAITO MINORU
    • B05C9/12B01J3/00H01L21/027H01L21/316
    • PROBLEM TO BE SOLVED: To provide a controlling system for vacuum pressure, in which a liquid material film formed on a wafer is dried and solidified without performing temperature control and also uniformity of thickness of the liquid material film can be secured. SOLUTION: In the controlling system 1 for vacuum pressure, when a wafer 16 applied with a liquid material film 17 is disposed in the inside of a vacuum vessel 11, the opening degree of a vacuum proportional stop valve 14 positioned on a pipeline 13 connecting both the vacuum vessel 11 and a vacuum pump 12 is controlled on the basis of output of a vacuum pressure sensor 15 measuring vacuum pressure of the inside of the vacuum vessel 11. Thereby, the vacuum pressure in the inside of the vacuum vessel 11 is reached to a target vacuum pressure from the atmospheric pressure at the change velocity of the target vacuum pressure. At this time, the target vacuum pressure is established to a value within the range from the atmospheric pressure to the saturated vapor pressure of an organic solvent contained in the liquid material film 17 formed on the wafer 16.