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1. 发明专利

JP2008284684A Method and apparatus for polishing edge of substrate using polishing arm 审中-公开
标题翻译：使用抛光ARM抛光底板的方法和装置
公开(公告)号：JP2008284684A
公开(公告)日：2008-11-27
申请号：JP2008132102
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： GARRY C ETTINGER , BUTTERFIELD PAUL D , MANENS ANTOINE P
IPC分类号： B24B21/10 , B24B9/00 , B24B21/06
CPC分类号： B24B21/004 , B24B9/065 , B24B27/0038
摘要： PROBLEM TO BE SOLVED: To provide a system adapted for polishing an edge of a substrate. SOLUTION: An apparatus adapted for polishing the edge of the substrate include (1) a polishing tape having a polishing surface and a second surface, (2) a longitudinal axis, and a polishing arm 201 adapted for contacting the polishing surface of the polishing tape with the edge of the substrate. The polishing arm 201 includes (i) a polishing head 204 adapted to contact with the second surface of the polishing tape, (ii) a rocker arm 304 connected to the polishing head 204 and adapted to rotate the polishing head 204 around the longitudinal axis of the polishing arm 201, and (iii) a load arm 314 extended adjacently along the rocker arm 304 and adapted to transfer the polishing head 204 in the direction orthogonal to the longitudinal axis of the polishing arm 201. Numerous other embodiments are provided. Further a method thereof is also provided. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供适于抛光衬底边缘的系统。解决方案：适于抛光衬底的边缘的设备包括（1）具有研磨表面和第二表面的抛光带，（2）纵向轴线，以及抛光臂201，其适于接触抛光表面的抛光表面抛光带与基板的边缘。抛光臂201包括（i）适于与抛光带的第二表面接触的抛光头204，（ii）连接到抛光头204的摇臂304，其适于使抛光头204绕纵向轴线旋转抛光臂201和（iii）沿着摇臂304相邻延伸并适于沿与抛光臂201的纵向轴线正交的方向传送抛光头204的负载臂314。提供了许多其它实施例。此外，还提供了其方法。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008306179A Method and apparatus for removing film and foil from edge on both sides of substrate by using backing pad 审中-公开
标题翻译：通过使用背垫将基片两面边缘的薄膜和薄膜去除的方法和装置
公开(公告)号：JP2008306179A
公开(公告)日：2008-12-18
申请号：JP2008132103
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： KOLLATA EASHWER , CHANG SHOU-SUNG , ZHANG ZHENHUA , BUTTERFIELD PAUL D , KO SEN-HOU , MANENS ANTOINE P , GARRY C ETTINGER , MARTINES RICARDO
IPC分类号： H01L21/304 , B24B9/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： PROBLEM TO BE SOLVED: To provide a method of polishing an edge of a substrate, wherein among films formed on both sides, the films existing on the edges of the substrate, which may adversely affect the device manufacturing, are removed across the both sides of the substrate.
SOLUTION: An apparatus for polishing the edges of the substrate includes a polishing head adapted to hold a backing pad 400 having a selected surface contour 401 and comprised of a plurality of polishing strips 404. The polishing strip is adapted to push the backing pad to the edge of the substrate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光基板的边缘的方法，其中在两侧形成的膜中，存在于可能不利地影响器件制造的衬底的边缘上的膜被去除基材两面。解决方案：用于抛光衬底的边缘的装置包括抛光头，该抛光头适于保持具有选定表面轮廓401并由多个抛光条404组成的衬垫400.抛光条适于推动背衬衬垫到衬底的边缘。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008284682A Method and device of using bevel polishing head having efficient tape routing layout 审中-公开
标题翻译：使用具有高效胶带路由布局的水平抛光头的方法和设备
公开(公告)号：JP2008284682A
公开(公告)日：2008-11-27
申请号：JP2008132069
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： KOLLATA EASHWER , CHANG SHOU-SUNG , ZHANG ZHENHUA , BUTTERFIELD PAUL D , KO SEN-HOU , MANENS ANTOINE P , GARRY C ETTINGER , MARTINES RICARDO
IPC分类号： B24B21/00 , B24B9/00 , B24B27/033 , H01L21/304
CPC分类号： B24B9/065 , B24B21/004
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for preventing the breakaway of a polishing tape during a polishing process, especially when the polishing tape receives the minimum tension, and for cleaning and polishing an edge portion of an improved substrate. SOLUTION: A polishing head 400 suitable for contacting with the edge portion of the substrate is included. The polishing head 400 includes a pair of front guide rollers 406, two pairs of back clamp rollers 408, and a controller suitable for actuating polishing of the edge portion of the substrate. A large number of other aspects are provided. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在抛光过程中防止抛光带分离的装置和方法，特别是当抛光带承受最小张力时，以及用于清洁和抛光改进的基板的边缘部分。解决方案：包括适合于与衬底的边缘部分接触的抛光头400。抛光头400包括一对前引导辊406，两对后夹紧辊408和适于致动衬底边缘部分的抛光的控制器。提供了大量其他方面。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2005005661A Conductive polishing article for the electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光导电抛光法
公开(公告)号：JP2005005661A
公开(公告)日：2005-01-06
申请号：JP2003205790
申请日：2003-08-04
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： BUTTERFIELD PAUL D , CHEN LIANG-YUH , HU YONGQI , MANENS ANTOINE P , MAVLIEV RASHID , TSAI STAN D , LIU FENG Q , WADENSWEILER RALPH
IPC分类号： B23H5/08 , B23H5/10 , B24B37/04 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/007 , B24B53/017 , B24D13/14 , C25F7/00 , H01L21/304 , H01L21/321
CPC分类号： H01L21/32125 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017
摘要： PROBLEM TO BE SOLVED: To provide a means of making an electrolytic solution flow without stagnating with a uniform current distribution for an electrochemical polishing device for flattening a conductive material, specially, a copper wire on a substrate surface. SOLUTION: A ball assembly comprises an electrically insulating housing 1530 having an electrolytic solution inflow hole at its lower end, a conductive roller 1506 (ball) composed of a conductive cover 1524 made of a soft conductive material and a core part 1522 made of a soft conductive core material, and a contact means 1534. The ball assembly is buried in a pad assembly 1540 and electrically connected to a power unit 1536, and further an electrolytic solution flow passage from an electrolytic solution source 1544 is connected. Consequently, while an electrolytic solution is supplied, a current is supplied through the ball assembly to polish the substrate 114. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种使电解液流动而不会滞留在用于使导电材料平坦化的电化学抛光装置的均匀电流分布的方法，特别是在基板表面上的铜线。解决方案：球组件包括在其下端具有电解液流入孔的电绝缘壳体1530，由导电材料制成的导电盖1524和芯部1522构成的导电辊1506（球）的软导电芯材料和接触装置1534.球组件被埋在垫组件1540中并电连接到动力单元1536，并且还连接有来自电解液源1544的电解液流动通道。因此，当提供电解液时，通过球组件提供电流以抛光衬底114.版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2009004765A Method and apparatus for using rolling backing pad for substrate polishing 审中-公开
标题翻译：用于衬底抛光的滚动支撑垫的方法和装置
公开(公告)号：JP2009004765A
公开(公告)日：2009-01-08
申请号：JP2008132080
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： KOLLATA EASHWER , CHANG SHOU-SUNG , ZHANG ZHENHUA , BUTTERFIELD PAUL D , KO SEN-HOU , MANENS ANTOINE P , GARRY C ETTINGER , MARTINES RICARDO
IPC分类号： H01L21/304
CPC分类号： B24B9/065 , B24B21/002
摘要： PROBLEM TO BE SOLVED: To provide an improved method and apparatus to polish an edge of a substrate, since there is a possibility that polishing tape may damage the notch of a rotating substrate.
SOLUTION: This apparatus to polish the substrate edge includes a polishing head including a backing pad 400, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge, and such a system is provided. This system comprises a substrate support that is suited so that the substrate may be rotated; the polishing head including the backing pad, wherein the width of the backing pad that contacts the substrate edge is larger than the width of the notch in the substrate edge, and a controller which is suited so that the rotation of the substrate and the polishing head may be operated.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供改进的方法和装置来抛光衬底的边缘，因为抛光带有可能损坏旋转衬底的凹口的可能性。抛光衬底边缘的该装置包括抛光头，该抛光头包括背衬垫400，其中与衬底边缘接触的衬垫的宽度大于衬底边缘中的凹口的宽度，系统。该系统包括适于使得基底可以旋转的基底支撑件; 所述抛光头包括所述背衬垫，其中所述衬垫的接触所述衬底边缘的宽度大于所述衬底边缘中的所述凹口的宽度;以及控制器，其适于使得所述衬底和所述抛光头的旋转可以操作。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008306180A Method and apparatus for controlling polishing profile of film on slope and edge of substrate 审中-公开
标题翻译：用于控制衬底坡度和边缘的电影抛光轮廓的方法和装置
公开(公告)号：JP2008306180A
公开(公告)日：2008-12-18
申请号：JP2008132105
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： ZHANG ZHENHUA , BUTTERFIELD PAUL D , CHANG SHOU-SUNG , KOLLATA EASHWER , KO SEN-HOU
IPC分类号： H01L21/304 , B24B9/00 , B24B37/04
CPC分类号： B24B37/042 , B24B9/065
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for polishing an unnecessary film partially or completely, the unnecessary film being deposited on an edge of a substrate; and to provide a method for polishing the same.
SOLUTION: A polishing apparatus polishes the film 116 on the edge of the substrate 104. In the polishing apparatus, a backing plate 316 is provided with a profile so that a polishing material can be pressed based on a profile of the film formed on the edge of the substrate, wherein the profile of the backing plate 316 consists of a flat region 402 and a curved region 404; and the flat and curved region 402 and 404 is coupled with a cut-off joint 406.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供部分地或完全地抛光不需要的膜的装置，不需要的膜沉积在基板的边缘上; 并提供其抛光方法。抛光装置抛光衬底104的边缘上的膜116.在抛光装置中，背板316设置有轮廓，使得可以基于形成的膜的轮廓来压制抛光材料在基板的边缘上，其中背板316的轮廓由平坦区域402和弯曲区域404组成; 并且平坦且弯曲的区域402和404与截止接头406相连。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008288599A Method and apparatus for polishing notch of substrate using polishing pad 审中-公开
标题翻译：使用抛光垫抛光底板的方法和装置
公开(公告)号：JP2008288599A
公开(公告)日：2008-11-27
申请号：JP2008132077
申请日：2008-05-20
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： GARRY C ETTINGER , BUTTERFIELD PAUL D , MANENS ANTOINE P , ZHANG ZHENHUA , KOLLATA EASHWER , CHANG SHOU-SUNG
IPC分类号： H01L21/304 , B24B9/00 , B24B21/16
CPC分类号： B24B21/002 , B24B1/002 , B24B9/065
摘要： PROBLEM TO BE SOLVED: To provide an effective method and apparatus to clean or polish all portions of a notch in the edge of a substrate. SOLUTION: A polishing head is provided that is adapted to apply a polishing tape 318 against the notch 116 of the substrate. The polishing head includes a cavity adapted to be filled with a pressure-controlling medium, and a tip region having a shape that matches a shape of the notch. The polishing pad 316 is adapted to contact the polishing tape 318 and press the polishing tape 318 against the notch 116. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种有效的方法和设备来清洁或抛光衬底边缘中的缺口的所有部分。解决方案：提供了一种抛光头，其适于将抛光带318施加在衬底的凹口116上。抛光头包括适于填充有压力控制介质的空腔和具有与凹口形状匹配的形状的尖端区域。抛光垫316适于接触抛光带318并将抛光带318压靠在凹口116上。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2004134734A Method and apparatus for polishing substrate 审中-公开
标题翻译：抛光底材的方法和装置
公开(公告)号：JP2004134734A
公开(公告)日：2004-04-30
申请号：JP2003139462
申请日：2003-05-16
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： WANG YAN , LIU FENG Q , HU YONGQI , DUBOUST ALAIN , CHEN LIANG-YUH , BUTTERFIELD PAUL D , WADENSWEILER RALPH M
IPC分类号： C25F7/00 , B23H5/08 , B23H5/10 , B24B37/04 , H01L21/304
CPC分类号： B24B37/24 , B23H5/08 , B23H5/10 , B24B37/042
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for flattening the surface of a substrate.
SOLUTION: The method and the apparatus for polishing the surface of a substrate are provided. In an aspect, the apparatus for polishing the substrate has a pad assembly having a conductive pad biased by a power supply, a backing, and conductive layers. In another embodiment, the apparatus for polishing the substrate has the pad assembly disposed in a deep dish. The deep dish has two electrodes connected with both the electrodes of the power supply. The respective electrodes are extended partially to the respective apertures formed in the pad assembly. The apparatus may be a portion of an electrochemical polishing station, and arbitrarily, the station may be a portion of the system including a chemical mechanical polishing station.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种使基材表面平坦化的方法和装置。解决方案：提供了用于抛光衬底表面的方法和设备。在一方面，用于抛光衬底的装置具有垫组件，其具有由电源，背衬和导电层偏压的导电衬垫。在另一个实施例中，用于抛光衬底的装置具有设置在深盘中的衬垫组件。深盘具有与电源的两个电极连接的两个电极。相应的电极部分地延伸到形成在焊盘组件中的各个孔。该设备可以是电化学抛光站的一部分，并且任意地，该站可以是包括化学机械抛光站的系统的一部分。版权所有（C）2004，JPO

9. 发明专利

JP2001232547A CHEMICAL MECHANICAL POLISHING SYSTEM 失效
公开(公告)号：JP2001232547A
公开(公告)日：2001-08-28
申请号：JP2000383969
申请日：2000-12-18
申请人： APPLIED MATERIALS INC
发明人： SOMMER PHILIP R , BUTTERFIELD PAUL D , BIRANG MANOOCHER
IPC分类号： B24B53/00 , B24B21/04 , B24B21/18 , B24B37/26 , B24B37/30 , B24B53/007 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for conditioning a polishing pad. SOLUTION: This chemical mechanical polishing system is a semiconductor wafer treatment system, in particular, to say in more detail, a polishing medium reconditioning system. In one embodiment, the polishing medium reconditioning system is provided with at least a first conditioning roller and a second conditioning roller in contact with a work surface of a polishing medium while it rotates in the opposing direction. In the other embodiment, it includes a conditioning plate arranged on a carrier including a polishing head, a conditioning roller or a disc crossing a surface of the polishing medium, and a conditioning disc conditioning the polishing medium while it is held in the polishing head. Instead the polishing medium can be conditioned using a device performing conditioning apart from the treatment system.

10. 发明专利

JP2001298007A CHEMICAL MECHANICAL PLANARIZATION SYSTEM 失效
公开(公告)号：JP2001298007A
公开(公告)日：2001-10-26
申请号：JP2000376148
申请日：2000-12-11
申请人： APPLIED MATERIALS INC
发明人： SOMMER PHILIP R , BUTTERFIELD PAUL D , OEN JOSHUA T , MENG CHING-LING
IPC分类号： B23Q3/18 , B23Q7/14 , B24B41/06 , B65G49/07 , H01L21/304 , H01L21/677 , H01L21/68 , H01L21/683 , H01L21/687 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a chemical mechanical wafer planarization system which can be improved easily in throughput. SOLUTION: A processing system and method for processing a workpiece are generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module includes a polishing surface and at least one polishing head disposed above the polishing surface. The substrate transfer shuttle is movable between at least a first position and a second position where the second position is disposed adjacent to the polishing head. At least one nest is disposed therein to receive and align the substrate. The nest also facilitates the transfer of the workpiece to the processing head.

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