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1. 发明专利

JP2010179404A Apparatus for grinding each end face of billet 有权
标题翻译：用于研磨BILLET的每个端面的装置
公开(公告)号：JP2010179404A
公开(公告)日：2010-08-19
申请号：JP2009024828
申请日：2009-02-05
申请人： Manyo:Kk , 株式会社万陽
发明人： SHIOKAWA HIROYASU
IPC分类号： B24B9/00 , B24B21/10
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for grinding each end face of a billet, for grinding each end face of each mass-produced billet in order to provide high-quality forged products. SOLUTION: The apparatus for grinding each end face of a billet continuously conveys a plurality of cut billets on a conveyor 2 having hooks 15. A pair of belt grinders 4 are arranged on both sides across the conveyor in such a way that grinding belts 5 cross the billet-conveying direction of the conveyor at different angles and in different directions and turn. A pressing device 6 for uniformly pressing the grinding belts 5 against the sides of the billets is provided correspondingly to the pair of belt grinders. Each end face of each billet is ground at the same time that the billets are pressed while being conveyed. The interval between the pair of grinding belts is adjustable by a grinding interval adjustment device 35 to match a change in the length of the billet. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于研磨坯料的每个端面的装置，用于研磨每个大量生产的坯料的每个端面，以便提供高品质的锻造产品。解决方案：用于研磨坯料的每个端面的装置在具有钩15的输送机2上连续输送多个切割坯料。一对带式磨床4布置在输送机两侧，使得研磨皮带5以不同的角度和不同的方向穿过输送机的坯料输送方向并转动。相应于一对带式磨床设置有用于将研磨带5均匀地压靠在坯料侧面的挤压装置6。在坯料被输送的同时，每个坯料的每个端面被研磨。一对研磨带之间的间隔可通过研磨间隔调节装置35调整，以匹配坯料长度的变化。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2002514976A 失效
公开(公告)号：JP2002514976A
公开(公告)日：2002-05-21
申请号：JP52147097
申请日：1996-12-05
IPC分类号： B24B21/00 , B24B21/10 , B24B37/20 , B24B53/007 , B24B53/017 , B24B37/04

3. 发明专利

JPH11221758A SEMICONDUCTOR WAFER GRINDING METHOD AND DEVICE 失效
公开(公告)号：JPH11221758A
公开(公告)日：1999-08-17
申请号：JP32239498
申请日：1998-11-12
申请人： LAM RES CORP
发明人： ENGDAHL ERIC H , FERRI EDWARD T JR , KRUSELL WILBUR C , JAIRATH RAHUL , GREEN RANDALL L , PANT ANIL
IPC分类号： B24B37/00 , B24B21/04 , B24B21/10 , B24B37/04 , B24B37/27 , B24B41/00 , H01L21/304 , H01L21/306 , H01L21/3105
摘要： PROBLEM TO BE SOLVED: To execute the chemical mechanical flattening to a plurality of semiconductor wafers efficiently with the same mode by conveying the wafers from a wafer loading station to a main grinding station. SOLUTION: An index table 36 is moved in one direction, and each wafer is conveyed through all circuits in a work station before it is returned to a head loader 34 (in the head loader 34, the completely ground semiconductor wafer is unloaded to be returned to a cassette 16 through a front edge assembly 12). A first processing station and a second processing station along a path of the index table 36 of a rear edge assembly 14 are a main wafer grinder, and is preferably a linear wafer grinder by which the chemical mechanical planarization(CMP) can be performed.

4. 发明专利

JPH11221755A SEMICONDUCTOR WAFER GRINDING METHOD AND DEVICE THEREOF 失效
公开(公告)号：JPH11221755A
公开(公告)日：1999-08-17
申请号：JP32239598
申请日：1998-11-12
申请人： LAM RES CORP
发明人： ENGDAHL ERIC H , FERRI EDWARD T JR , KRUSELL WILBUR C , JAIRATH RAHUL , GREEN RANDALL L , PANT ANIL
IPC分类号： B24B37/00 , B24B21/04 , B24B21/10 , B24B37/04 , B24B37/27 , B24B41/00 , H01L21/304 , H01L21/306 , H01L21/3105
摘要： PROBLEM TO BE SOLVED: To uniformly flatten a surface of a semiconductor wafer by mounting an air pressure control.tension adjustment mechanism for controlling the operation of a grinding member. SOLUTION: A head loader moves a tub 90 upward to humidify a rear face of a wafer, which assists a head assembly 52 to grasp the wafer by utilizing the vacuum or the surface tension of the fluid. A support ring 94 receives the wafer through an air path 58, and moves the humidified wafer upward till the wafer is held by the suction force of the air acting on a plate 54. The head assembly 52 is moved upward to an index table, locked by a head retainer mechanism, and released by a spindle. The index table is rotated to convey the wafer to a first main grinder to start the grinding.

5. 发明专利

JP2794264B2 失效
公开(公告)号：JP2794264B2
公开(公告)日：1998-09-03
申请号：JP4497394
申请日：1994-02-18
申请人： AMITETSUKU KK
发明人： NAKANO YUKYASU
IPC分类号： B24B49/10 , B24B21/06 , B24B21/10 , B24B21/18

6. 实用新型

JP2521382Y2 失效
公开(公告)号：JP2521382Y2
公开(公告)日：1996-12-25
申请号：JP10942190
申请日：1990-10-18
IPC分类号： B24B21/10

7. 发明专利

JP2555448B2 失效
公开(公告)号：JP2555448B2
公开(公告)日：1996-11-20
申请号：JP19327889
申请日：1989-07-26
申请人： KIKU ENJINIARINGU JUGENGAISHA , MARUMOTO KOGYO KK
发明人： KIKUCHI FUMIO
IPC分类号： B24B21/10 , B24B29/00

8. 实用新型

JPS5231517Y2 失效
公开(公告)号：JPS5231517Y2
公开(公告)日：1977-07-18
申请号：JP9416472
申请日：1972-08-10
IPC分类号： B24B21/04 , B24B21/10 , B24B41/00 , B24B41/02

9. 发明专利

JPS5148719B1 失效
公开(公告)号：JPS5148719B1
公开(公告)日：1976-12-22
申请号：JP3155372
申请日：1972-03-29
IPC分类号： B24B7/18 , B24B21/10 , B24B21/04 , A63D5/00

10. 发明专利

JP4949544B2 失效
公开(公告)号：JP4949544B2
公开(公告)日：2012-06-13
申请号：JP21375899
申请日：1999-07-28
IPC分类号： B24B21/08 , B24B21/06 , B24B21/10 , B24B49/02 , B24B49/16

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