专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010090236A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2010090236A
公开(公告)日：2010-04-22
申请号：JP2008260712
申请日：2008-10-07
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： NAKAMURA SHIGEO , OHASHI SEIICHIRO , YOKOTA TADAHIKO
IPC分类号： C08G59/40 , C09J7/02 , C09J163/00 , C09J175/04 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition suitable for forming an insulating layer of a multilayer printed wiring board or the like, wherein when an insulating layer obtained by heat-curing the resin composition is formed, the insulating layer has a low coefficient of thermal expansion, a uniform roughened surface with low roughness can be formed on a surface of the insulating layer, and a conductor layer formed on the roughened surface is excellent in adhesion.
SOLUTION: The resin composition contains (A) an epoxy resin, (B) a cyanate ester resin, (C) an adduct of an imidazole compound to an epoxy resin, and (D) a metal-based curing catalyst.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种适合于形成多层印刷线路板等的绝缘层的树脂组合物，其中当形成通过热固化树脂组合物获得的绝缘层时，绝缘层具有可以在绝缘层的表面上形成低的热膨胀系数，具有低粗糙度的均匀的粗糙化表面，并且在粗糙化表面上形成的导体层的粘合性优异。解决方案：树脂组合物含有（A）环氧树脂，（B）氰酸酯树脂，（C）咪唑化合物与环氧树脂的加合物和（D）金属类固化催化剂。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2014112708A Multilayer printed wiring board manufacturing method 有权
标题翻译：多层印刷线路板制造方法
公开(公告)号：JP2014112708A
公开(公告)日：2014-06-19
申请号：JP2014015602
申请日：2014-01-30
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： NAKAMURA SHIGEO , OHASHI SEIICHIRO , HAYASHI EIICHI , YOKOTA TADAHIKO
IPC分类号： H05K3/46 , H05K3/00
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board manufacturing method which enables continuous production without performing single wafer production when an insulation layer of the multilayer printed wiring board is formed by a prepreg.SOLUTION: A multilayer printed wiring board manufacturing method comprises the following processes of: (1) transporting an adhesive sheet in which a prepreg is formed on a support film from a rolled adhesive sheet where the adhesive sheet is rolled and arranging the adhesive sheet in a manner such that a prepreg side is brought into contact with both surfaces or a single surface of the circuit board; (2) temporarily bonding the adhesive sheet to the circuit board by partially adhering the adhesive sheet to the circuit board by applying heat and pressure to a part of the adhesive sheet from the support film side, and subsequently cutting the adhesive sheet depending on the size of the circuit board by a cutter; (3) applying heat and pressure to the temporarily bonded adhesive sheet under a reduced pressure to laminate the adhesive sheet on the circuit board; (4) thermosetting the prepreg to form an insulation layer; and (5) peeling the support film after the thermosetting process.
摘要翻译：要解决的问题：提供一种多层印刷线路板制造方法，其可以在通过预浸料形成多层印刷线路板的绝缘层时，不进行单晶片制造而连续生产。解决方案：多层印刷线路板制造方法包括：以下处理：（1）从粘合片卷绕的轧制粘合片将支撑膜上形成有预浸料的粘合片输送到粘合片，并以使预浸料坯侧与电路板的两个表面或单个表面; （2）通过从支撑膜侧向粘合片的一部分施加热和压力，将粘合片部分地粘合到电路板上，将粘合片临时粘合到电路板上，随后根据尺寸切割粘合片的电路板; （3）在减压下对临时粘合的粘合片施加热和压力以将粘合片层压在电路板上; （4）将预浸料热固化以形成绝缘层; 和（5）在热固化工序之后剥离支撑膜。

3. 发明专利

JP2013151700A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2013151700A
公开(公告)日：2013-08-08
申请号：JP2013083957
申请日：2013-04-12
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： NAKAMURA SHIGEO , OHASHI SEIICHIRO , YOKOTA TADAHIKO
IPC分类号： C08G59/68 , B32B15/08 , B32B27/38 , C08K3/00 , C08L63/00 , C08L101/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which is used suitably for forming an insulation layer of a multilayer printed circuit board etc. and which allows the insulation layer, that is obtained by thermocuring the resin composition, to have a low thermal expansion rate and a low-roughness and uniform roughened face to be formed on the surface thereof and which allows a conductor layer to be formed on the roughened face to have excellent adhesiveness.SOLUTION: The resin composition contains: (A) an epoxy resin; (B) a cyanate ester resin; (C) an adduct body of an imidazole compound and an epoxy resin; and (D) a metal-based curing catalyst.
摘要翻译：要解决的问题：为了提供适合用于形成多层印刷电路板等的绝缘层的树脂组合物，并且允许通过热固化树脂组合物获得的绝缘层具有低的热膨胀率并且在其表面上形成低粗糙度均匀的粗糙面，并且允许在粗糙面上形成导体层以具有优异的粘合性。溶液：树脂组合物包含：（A）环氧树脂; （B）氰酸酯树脂; （C）咪唑化合物和环氧树脂的加合体; 和（D）金属基固化催化剂。

4. 发明专利

JP2014017503A Multilayer printed wiring board manufacturing method 有权
标题翻译：多层印刷线路板制造方法
公开(公告)号：JP2014017503A
公开(公告)日：2014-01-30
申请号：JP2013182505
申请日：2013-09-03
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： NAKAMURA SHIGEO , OHASHI SEIICHIRO , HAYASHI EIICHI , YOKOTA TADAHIKO
IPC分类号： H05K3/46 , B32B15/08
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board manufacturing method which enables continuous production regardless of the number of boards when forming an insulation layer of a multilayer printed wiring board by a prepreg.SOLUTION: A manufacturing method of a multilayer printed wiring board includes the following processes (1)-(5): (1) a tacking preparation process of feeding an adhesive sheet from a rolled adhesive sheet obtained by winding the adhesive sheet in a rolled fashion in which a prepreg is formed on a support film, and arranging the adhesive sheet in such a way that a prepreg face touches both surfaces or one surface of a circuit board; (2) a tacking process of tacking the adhesive sheet to the circuit board by partially adhering the adhesive sheet to the circuit board by application of heat and pressure on a part of the adhesive sheet from the support film side, and subsequently cutting the adhesive sheet in accordance with the size of the circuit board by a cutter; (3) a laminate process of laminating the adhesive sheet on the circuit board by application of heat and pressure to the tacked adhesive sheet under reduced pressure; (4) a thermal curing process of thermally curing the prepreg to form an insulation layer; and (5) a peeling process of peeling the support film after the thermal curing process.
摘要翻译：要解决的问题：提供一种多层印刷线路板制造方法，其可以通过预浸料形成多层印刷线路板的绝缘层而能够连续生产而不管板数多少。解决方案：多层印刷线路板的制造方法包括以下方法（1） - （5）：（1）一种粘合片的粘合剂的制备方法，该粘合片从通过在支撑膜上形成预浸料的卷绕方式卷绕粘合片而获得的卷绕的粘合片进料，并且以使预浸料面接触电路板的两个表面或一个表面的方式布置粘合片; （2）通过在粘合片的一部分上从支撑膜侧施加热和压部分地将粘合片部分地粘合到电路板上，将粘合片固定到电路板上的粘合工艺，然后切割粘合片根据电路板的尺寸由切刀; （3）通过在减压下对粘合片施加热和压力来将粘合片层叠在电路板上的层叠工序; （4）热固化预浸料以形成绝缘层的热固化方法; 和（5）在热固化过程之后剥离载体膜的剥离过程。

5. 发明专利

JP2010202865A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2010202865A
公开(公告)日：2010-09-16
申请号：JP2010023184
申请日：2010-02-04
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： OHASHI SEIICHIRO , YOKOTA TADAHIKO , NAKAMURA SHIGEO
IPC分类号： C08L63/00 , C08J5/18 , C08J5/24 , C08K3/34 , C08K9/00 , C08L79/00 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having favorable adhesiveness with a conductor layer even after an accelerated environmental testing as a resin forming an insulating layer of a multilayer printed wiring board.
SOLUTION: The resin composition for multilayer printed wiring board contains (A) a cyanate ester resin, (B) an epoxy resin, (C) a thermoplastic resin, (D) talc and (E) silica with a total 35-60 mass% content of components (D) and (E) for 100 mass% of a nonvolatile component in the resin composition, and 5-20 mass% content of (D) talc.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使在作为形成多层印刷线路板的绝缘层的树脂的加速环境试验之后，也可以提供一种与导体层具有良好粘合性的树脂组合物。＆lt; P＆gt;解决方案：多层印刷线路板用树脂组合物含有（A）氰酸酯树脂，（B）环氧树脂，（C）热塑性树脂，（D）滑石和（E）树脂组合物中100质量％的不挥发成分的成分（D）和（E）的60质量％含量，（D）滑石的5-20质量％含量。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009231222A Insulating resin sheet 审中-公开
标题翻译：绝缘树脂片
公开(公告)号：JP2009231222A
公开(公告)日：2009-10-08
申请号：JP2008078232
申请日：2008-03-25
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： HAYASHI EIICHI , OHASHI SEIICHIRO , YASUDA FUMI , MIYAGAWA TOMOKO
IPC分类号： H01B17/56 , B32B27/12 , C08J5/18 , C08J5/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin sheet in which a sheetlike fiber base material included in a prepreg is not exposed on the surface of an insulating layer concerning to the insulating resin sheet formed by the prepreg in order to form the insulating layer of a multilayer printed wire board.
SOLUTION: The insulating resin sheet includes a cured prepreg layer, and a thermosetting resin composition layer formed on both sides of the cured prepreg layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种绝缘树脂片，其中包含在预浸料中的片状纤维基材在与预浸料坯形成的绝缘树脂片相关的绝缘层的表面上不露出，以形成多层印刷线路板的绝缘层。解决方案：绝缘树脂片包括固化的预浸料层，以及形成在固化的预浸料层两侧的热固性树脂组合物层。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2007291368A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2007291368A
公开(公告)日：2007-11-08
申请号：JP2007084230
申请日：2007-03-28
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： OHASHI SEIICHIRO , HAYASHI EIICHI
IPC分类号： C08L79/00 , C08J5/24 , C08L63/00 , C08L71/10 , C08L101/00 , C09J7/02 , C09J163/00 , C09J171/10 , C09J179/04 , C09J201/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition affording an organic insulating layer having a low coefficient of thermal expansion and readily removing smears. SOLUTION: The resin composition comprises (1) a cyanate ester resin, (2) an anthracene type epoxy resin and (3) a thermoplastic resin. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种树脂组合物，其提供具有低热膨胀系数和容易除去涂片的有机绝缘层。解决方案：树脂组合物包含（1）氰酸酯树脂，（2）蒽型环氧树脂和（3）热塑性树脂。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2013173841A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2013173841A
公开(公告)日：2013-09-05
申请号：JP2012038897
申请日：2012-02-24
申请人： Ajinomoto Co Inc , 味の素株式会社 , Kao Corp , 花王株式会社
发明人： OHASHI SEIICHIRO , NARABASHI HIROHISA , KOMATSU MASAKI , YANO AKIHIRO
IPC分类号： C08L63/00 , C08J5/24 , C08K3/36 , C08K7/26 , C09J7/02 , C09J11/04 , C09J11/06 , C09J163/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a resin composition sufficiently low in all of dielectric constant, dielectric loss tangent and coefficient of thermal expansion, particularly, a resin composition having a sufficiently small dielectric constant and a low dielectric loss tangent, and a sufficiently low coefficient of thermal expansion at 150°C or higher.SOLUTION: A resin composition includes: an epoxy resin, a curing agent, hollow silica and fused silica.
摘要翻译：要解决的问题：为了提供足够低的介电常数，介电损耗角正切和热膨胀系数的树脂组合物，特别是具有足够小的介电常数和低介电损耗角正切的树脂组合物和足够低的系数在150℃以上的热膨胀。树脂组合物包括：环氧树脂，固化剂，中空二氧化硅和熔融二氧化硅。

9. 发明专利

JP2010285594A Resin composition 有权
标题翻译：树脂组合物
公开(公告)号：JP2010285594A
公开(公告)日：2010-12-24
申请号：JP2010033901
申请日：2010-02-18
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： OHASHI SEIICHIRO , YAMAMOTO YUKI , NAKAMURA SHIGEO
IPC分类号： C08G59/40 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition that provides a cured product having a low dielectric dissipation factor, and is adhered extremely strongly with a conductor after being subjected to accelerated environmental testing. SOLUTION: The resin composition contains (A) an epoxy resin, (B) a cyanate ester resin, (C) an active ester curing agent, and (D) a curing accelerator. COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2009147323A Method of manufacturing multilayer printed wiring board, and multilayer printed wiring board 有权
标题翻译：制造多层印刷线路板和多层印刷线路板的方法
公开(公告)号：JP2009147323A
公开(公告)日：2009-07-02
申请号：JP2008297870
申请日：2008-11-21
申请人： Ajinomoto Co Inc , Shinko Electric Ind Co Ltd , 味の素株式会社 , 新光電気工業株式会社
发明人： OHASHI SEIICHIRO , HAYASHI EIICHI , NAKAMURA SHIGEO , YAZAWA TAKAAKI , NAKAMURA JUNICHI
IPC分类号： H05K3/42 , H05K3/00 , H05K3/46
CPC分类号： H05K3/02 , H05K1/02 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/0055 , H05K3/42 , H05K2203/0796 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board capable of forming a via of high reliability and sufficiently preventing etch-back and excessive protrusion of glass cloth from the wall surface of a via hole.
SOLUTION: The method of manufacturing the multilayer printed wiring board includes the steps of forming, by laser irradiation, a via hole 5 in an insulating layer 4 formed by a prepreg 3 comprised of a glass cloth 1 impregnated with a thermosetting resin composition 2, subjecting the via hole 5 to a glass etching processing with a glass etching solution, and then subjecting the via hole to a desmear processing with an oxidizing agent solution. This arrangement sufficiently prevents etch-back and excessive protrusion of the glass cloth from the wall surface of the via hole and achieves highly reliable via, particularly, in a small via hole having a top diameter of ≤75 μm.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造多层印刷线路板的方法，该多层印刷线路板能够形成高可靠性的通孔，并且充分防止玻璃布从通孔的壁表面的回蚀和过度的突出。解决方案：制造多层印刷线路板的方法包括以下步骤：通过激光照射形成由浸渍有热固性树脂组合物的玻璃布1制成的预浸料3形成的绝缘层4中的通孔5 2，用玻璃蚀刻溶液对通孔5进行玻璃蚀刻处理，然后用氧化剂溶液对通孔进行去污处理。这种布置充分地防止玻璃布从通孔的壁表面的回蚀和过度的突出，并且实现了高度可靠的通孔，特别是在顶部直径为≤75μm的小通孔中。版权所有（C）2009，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式