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1. 发明专利

JP2009231222A Insulating resin sheet 审中-公开
标题翻译：绝缘树脂片
公开(公告)号：JP2009231222A
公开(公告)日：2009-10-08
申请号：JP2008078232
申请日：2008-03-25
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： HAYASHI EIICHI , OHASHI SEIICHIRO , YASUDA FUMI , MIYAGAWA TOMOKO
IPC分类号： H01B17/56 , B32B27/12 , C08J5/18 , C08J5/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin sheet in which a sheetlike fiber base material included in a prepreg is not exposed on the surface of an insulating layer concerning to the insulating resin sheet formed by the prepreg in order to form the insulating layer of a multilayer printed wire board.
SOLUTION: The insulating resin sheet includes a cured prepreg layer, and a thermosetting resin composition layer formed on both sides of the cured prepreg layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种绝缘树脂片，其中包含在预浸料中的片状纤维基材在与预浸料坯形成的绝缘树脂片相关的绝缘层的表面上不露出，以形成多层印刷线路板的绝缘层。解决方案：绝缘树脂片包括固化的预浸料层，以及形成在固化的预浸料层两侧的热固性树脂组合物层。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010143177A Manufacturing method of metal clad laminated sheet 有权
标题翻译：金属层压板的制造方法
公开(公告)号：JP2010143177A
公开(公告)日：2010-07-01
申请号：JP2008325254
申请日：2008-12-22
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： YASUDA FUMI , HAYASHI EIICHI , NARABASHI HIROHISA , NAKAMURA SHIGEO
IPC分类号： B29C43/18 , B29C43/20 , B29C43/56 , B32B15/08 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal clad laminated sheet having a smooth metal film layer with no wrinkles which is usable for fine wiring. SOLUTION: Two sheets of pre-preg having a metal film layer on a substrate layer and a pre-preg layer on the metal film layer are folded in such a way that pre-preg layer surfaces are placed oppositely or directly placed oppositely, then one sheet of the other pre-preg is inserted into a space of the two pre-preg layers to be foled, and the resultant is heated under pressure to give the desired metal clad laminated sheet. When a releasing layer between the substrate layer and the metal film layer is formed, exfolation of the pre-preg layer from the substrate layer can easily be conducted. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有光滑金属膜层的金属包覆层压片的制造方法，没有可用于精细布线的皱纹。解决方案：在基材层上具有金属膜层的两片预浸料和金属膜层上的预浸层被折叠，使得预浸层表面相对放置或直接放置在相反的位置，然后将一片预浸料插入两块预浸料层的空间中，并将其加压加压，得到所需的金属包覆层压片。当形成衬底层和金属膜层之间的释放层时，可以容易地进行预浸层从衬底层的剥离。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2014089960A Method for manufacturing multilayer printed wiring board 有权
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2014089960A
公开(公告)日：2014-05-15
申请号：JP2013231010
申请日：2013-11-07
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： HAYASHI EIICHI , MIYAGAWA TOMOKO , YASUDA FUMI , OHASHI SEIICHIRO , NAGASHIMA HIROAKI
IPC分类号： H01B17/60 , B32B27/04 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin sheet which is composed of a prepreg to form an insulating layer of a multilayer printed wiring board and does not expose a sheet-shaped fiber substrate contained in the prepreg from the surface of the insulating layer.SOLUTION: An insulating resin sheet includes: a cured prepreg layer obtained by compressing and thermosetting a prepreg where a thermosetting resin composition is impregnated in a sheet-shaped fiber substrate; and thermosetting resin composition layers formed on both surfaces of the cured prepreg layer.
摘要翻译：要解决的问题：提供一种绝缘树脂片，其由预浸料组成，以形成多层印刷线路板的绝缘层，并且不将包含在预浸料中的片状纤维基材从绝缘层的表面露出。解决方案：绝缘树脂片包括：通过将热固性树脂组合物浸渍在片状纤维基材中的预浸料坯压缩和热固而获得的固化预浸料层; 以及形成在固化的预浸料层的两个表面上的热固性树脂组合物层。

4. 发明专利

JP2010194807A Sheet with metallic film and resin sheet with metallic film 审中-公开
标题翻译：带金属膜的薄片和带金属薄膜的树脂片
公开(公告)号：JP2010194807A
公开(公告)日：2010-09-09
申请号：JP2009040987
申请日：2009-02-24
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： YASUDA FUMI , NARABASHI HIROHISA , HAYASHI EIICHI
IPC分类号： B32B15/08 , B32B15/092 , H05K3/14 , H05K3/20 , H05K3/28 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a sheet with a metallic film and a resin sheet with a metallic film preventing the surface of a releasing layer from being scratched during conveyance. SOLUTION: In the sheet with metallic film, the releasing layer containing an antistatic agent is formed on a support layer and a metallic film layer is formed on the releasing layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有金属膜的片材和具有金属膜的树脂片，防止了在输送过程中剥离层的表面被划伤。解决方案：在具有金属膜的片材中，在支撑层上形成含有抗静电剂的释放层，并且在释放层上形成金属膜层。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009231240A Method of manufacturing multilayer printed wiring board 有权
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2009231240A
公开(公告)日：2009-10-08
申请号：JP2008078625
申请日：2008-03-25
申请人： Ajinomoto Co Inc , 味の素株式会社
发明人： HAYASHI EIICHI , MIYAGAWA TOMOKO , YASUDA FUMI , OHASHI SEIICHIRO , NAGASHIMA HIROAKI
IPC分类号： H01B17/56 , B32B5/28 , C08J5/24 , H01B19/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin sheet wherein a sheet-shaped fiber base material included in a prepreg is not exposed on the surface of an insulating layer as the insulating resin sheet formed by the prepreg for forming an insulating layer of a multilayer printed wiring board. SOLUTION: The insulating layer has a curing prepreg layer wherein the prepreg impregnating a thermosetting resin composition to the sheet-shaped fiber base material is compressed and heat-cured, and a thermosetting resin composition layer formed on both sides of the curing prepreg layer. The multilayer printed wiring board has an insulating layer formed by the insulating resin sheet. COPYRIGHT: (C)2010,JPO&INPIT

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