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    • 1. 发明专利
    • Automatic transmission assembling structure
    • 自动变速器组装结构
    • JP2010054016A
    • 2010-03-11
    • JP2008222060
    • 2008-08-29
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • KIYAMA KENMURAKAMI NAOTAKAMATSUBARA MASATO
    • F16H61/00F16H57/023
    • PROBLEM TO BE SOLVED: To improve the assembling efficiency of an automatic transmission.
      SOLUTION: A plurality of approximately cylindrical solenoid valves 25 are incorporated into a valve body 20 with a play around the axial center. Terminal guides 28 which are protruded in the same direction as that of terminals 27a of connector portions integrally formed on the solenoid valves 25 are aligned to be supported by inclined faces 36b of guide supports 36 of a unit base 30 (Fig.(a)) and then the unit base 30 is slid to the side of the valve body 20, whereby terminal guides 28 are guided along the inclined faces 36b to the side of guide holes 36a to correct the attitudes of the solenoid valves 25 (Fig.(b)-(d)). Thus, the terminals 27a and terminals 35a of the connector portions of the unit base 30 are positioned to just oppose each other and then fitted to each other in a lump, and so the connector portions are smoothly connected to each other to improve the assembling efficiency of the automatic transmission.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提高自动变速器的组装效率。 解决方案:多个大致圆筒形的电磁阀25以围绕轴向中心的间隙结合到阀体20中。 与电磁阀25一体形成的连接部的端子27a的方向相同的方向突出的端子引导件28由单元基座30(图(a))的引导支撑件36的倾斜面36b对齐, 然后单元基座30滑动到阀体20的侧面,由此端子引导件28沿着倾斜面36b被引导到引导孔36a的侧面,以校正电磁阀25(图(b))的姿态, - (D))。 因此,单元基座30的连接器部分的端子27a和端子35a被定位成刚好彼此相对,并且彼此一体地装配,因此连接器部分彼此平滑地连接以提高组装效率 的自动变速器。 版权所有(C)2010,JPO&INPIT
    • 3. 发明专利
    • Abnormality determination device of linear solenoid valve for vehicle
    • 用于车辆的线性电磁阀的异常确定装置
    • JP2009156396A
    • 2009-07-16
    • JP2007337057
    • 2007-12-27
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • KAWAMURA TATSUYAMATSUBARA MASATOYOSHIOKA YUHEINODA KAZUYUKI
    • F16H61/12F16H59/26F16H59/72F16H61/02F16H61/68F16H61/684F16H61/686
    • PROBLEM TO BE SOLVED: To provide an abnormality determination device of a linear solenoid valve for a vehicle which can exactly and easily detect an abnormality of a linear solenoid valve which controls the oil pressure of a hydraulic friction engagement device of a vehicle.
      SOLUTION: The abnormality determination device includes: a speed change control means 108 which outputs a standby pressure command signal lower than a first fill-command signal for forming a temporary oil-pressure rise waveform while following the first fill-command signal; a pressure sensor SE for detecting the output oil pressure of the linear solenoid valve SL; and an abnormality determination means 116 which determines the occurrence of an abnormality when a lowering estimation value E indicating the degree of the lowering of the output oil pressure detected by the pressure sensor SE is lower than a preset abnormality determination value J. By this, since the abnormality determination is performed by utilizing difference of the variation of the output oil pressure from the linear solenoid valve SL at an abnormal time and that at a normal time, the abnormality when the linear solenoid valve SL is firmly seized after the start of the speed change control can exactly and easily be detected when a rise in the output oil pressure of the linear solenoid valve SL is started.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题:提供一种用于车辆的线性电磁阀的异常判定装置,其能够容易地检测对车辆的液压摩擦接合装置的油压进行控制的线性电磁阀的异常。 解决方案:异常判定装置包括:变速控制装置108,其输出比第一填充命令信号低的待机压力指令信号,用于形成临时油压上升波形,同时跟随第一填充命令信号; 用于检测线性电磁阀SL的输出油压的压力传感器SE; 以及异常判定单元116,其在表示由压力传感器SE检测出的输出油压的下降程度的下降估计值E低于预先设定的异常判定值J时,判定异常的发生。由此,由于 异常判定是通过利用异常时的线性电磁阀SL的输出油压的变化的差异,而在正常时刻,线速电磁阀SL在速度开始后被牢固地卡住的异常 当线性电磁阀SL的输出油压的上升开始时,可​​以容易地检测变更控制。 版权所有(C)2009,JPO&INPIT
    • 4. 发明专利
    • Hydraulic control device for transmission
    • 液压控制装置传动
    • JP2010230070A
    • 2010-10-14
    • JP2009077210
    • 2009-03-26
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • YOSHIOKA YUHEINODA KAZUYUKIIWATA AKIHITOKAWAMURA TATSUYAMATSUBARA MASATO
    • F16H57/04
    • F16H57/0404F16H61/0006
    • PROBLEM TO BE SOLVED: To make a hydraulic control device for a transmission compact, and to allow an electronic control unit of the hydraulic control device to be favorably cooled.
      SOLUTION: The hydraulic control device 20 includes a valve body 21, an oil pan 60 disposed below the valve body 21, an ECU 41 for transmission, which is installed in the oil pan 60 side of the valve body 21, performing drive control of a solenoid valve 30, a strainer 70 containing an oil chamber defining part 77 defining the working fluid communication chamber 77c capable of heat-exchanging the ECU 41 for transmission and the working fluid between a screen 72 to filter the working fluid flowed from the oil pan 60 through a working fluid inlet port 74o and the valve body 21 and the oil pan 60, and having a working fluid outlet 78o communicating with the working fluid communication chamber 77c and the oil pan 60, and a pair of fins 80 facilitating the flow of the working fluid in the vicinity of the working fluid outlet 78o in the oil pan 60.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了制造用于变速器的液压控制装置,并且允许液压控制装置的电子控制单元被有利地冷却。 解决方案:液压控制装置20包括阀体21,设置在阀体21下方的油底壳60,安装在阀体21的油底壳60侧的变速器用ECU41,进行驱动 控制电磁阀30,过滤器70包含限定部分77的油室限定部分77,所述油室限定工作流体连通室77c,其能够使用于传热的ECU 41进行热交换,并且屏幕72之间的工作流体过滤从 油底壳60通过工作流体入口74o和阀体21和油底壳60,并具有与工作流体连通室77c和油底壳60连通的工作流体出口78o,以及一对翅片80, 工作流体在油盘60中工作流体出口78o附近的流动。版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • Electronic circuit device
    • 电子电路设备
    • JP2010219091A
    • 2010-09-30
    • JP2009060725
    • 2009-03-13
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • MURAKAMI NAOTAKAYAMATO OSAMUYAMADA AKIHIROMATSUBARA MASATO
    • H01L23/12H01L23/36
    • H01L2224/73204H01L2924/181H01L2924/19107H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide an electronic circuit device for appropriately securing heat radiation properties of a circuit board by a simple structure. SOLUTION: The electronic circuit device 20 includes: a circuit board 22 on which electronic components 21 have been packaged; a flexible wiring board 23 that is adhered to a non-packaging surface, namely a surface at a side opposite to the packaging surface of the circuit board 22 and can electrically connects the circuit board 22 and external equipment 100; and a heat radiation plate 24 adhered to a surface at a side opposite to the adhesion surface with the circuit board 22 of the flexible wiring board 23. In the electronic circuit device 20, an opening 23o is formed on the flexible wiring board 23 so that it opposes the non-packaging surface of the circuit board 22. An adhesive layer 30 made of a heat radiation adhesive for mutually adhering the non-packaging surface of the circuit board 22 and the heat radiation plate 24 is formed at a region demarcated by the opening 23o, the non-packaging surface of the circuit board 22, and the heat radiation plate 24. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种通过简单的结构适当地确保电路板的散热特性的电子电路装置。 电子电路装置20包括:已经封装有电子部件21的电路板22; 柔性布线板23,其粘附到非封装表面,即与电路板22的封装表面相对的一侧的表面,并且可以电连接电路板22和外部设备100; 以及与柔性布线板23的电路板22粘接在与粘合面相反一侧的表面的散热板24.在电子电路装置20中,在柔性布线板23上形成开口23o,使得 它与电路板22的非封装表面相对。由用于相互粘合电路板22的非封装表面和散热板24的散热粘合剂制成的粘合剂层30形成在由 开口23o,电路板22的非封装表面和散热板24.版权所有(C)2010,JPO&INPIT
    • 6. 发明专利
    • Hydraulic control device and transmission device
    • 液压控制装置和变速装置
    • JP2010133552A
    • 2010-06-17
    • JP2009070872
    • 2009-03-23
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • IWATA AKIHITOYOSHIOKA YUHEINODA KAZUYUKIMATSUBARA MASATO
    • F16H61/00F16H59/54F16H59/68
    • PROBLEM TO BE SOLVED: To improve electric connectivity with a compact composition.
      SOLUTION: A valve body 20 is mounted with a switch base mounted with a linear solenoid 25, an ON-OFF solenoid 35, and a hydraulic switch 52 and a unit base mounted with an ECU 42 so that a connecter 27 of the linear solenoid 25, a connecter 37 of the ON-OFF solenoid 35, a terminal of the hydraulic switch 52, and a terminal of the ECU 42 can be placed on approximately the same flat surface. The connecters 27, 37 and the terminal of the hydraulic switch 52 are electrically connected to the terminal of the ECU 42 by a printed circuit board 60. That prevents irregularity in heights of the terminals and the connecters and eliminates the necessity for complicating the shape of the printed circuit board 60 while reducing a useless space in the vertical direction, which makes it possible to mount the linear solenoid 25, the ON-OFF solenoid 35, the switch base, and the unit base to the valve body 20 by setting them in the minimum height.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:通过紧凑的组合物改善电连接性。 解决方案:阀体20安装有安装有线性螺线管25,开关螺线管35和液压开关52的开关底座以及安装有ECU42的单元基座,使得连接器27 线性螺线管25,开关螺线管35的连接器37,液压开关52的端子和ECU42的端子可以放置在大致相同的平坦表面上。 连接器27,37和液压开关52的端子通过印刷电路板60电连接到ECU42的端子。这防止端子和连接器的高度的不规则性,并且不需要使形状复杂化 印刷电路板60同时减少垂直方向上的无用空间,这使得可以将线性螺线管25,开关电磁铁35,开关基座和单元基座安装到阀体20上,方法是将它们设置在 最小高度。 版权所有(C)2010,JPO&INPIT
    • 8. 发明专利
    • Electronic circuit device
    • 电子电路设备
    • JP2010040584A
    • 2010-02-18
    • JP2008198647
    • 2008-07-31
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • MURAKAMI NAOTAKATAKAHASHI RYOHEIMATSUBARA MASATO
    • H01L23/36H01L23/29
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To improve a heat radiation performance while securing reliability. SOLUTION: The first heat dissipation plate 26 of a relative small linear expansion coefficient is bonded with the back surface of a circuit board 22, the second heat dissipation plate 28 of a relatively large linear expansion coefficient comprising the same lead frame 23 as a lead terminal 24 is surface-bonded at the end part evading the center part of the first heat dissipation plate 26, and the distal end part 28b is exposed from a package side face to the outside. Thus, the linear expansion coefficient of the first heat dissipation plate 26 bonded with the circuit board 22 is brought closer to the linear expansion coefficient of the circuit board 22, the influence of heat stress between the circuit board 22 and the first heat dissipation plate 26 is reduced, and the generated heat of electronic components 21a, 21b and 21c is radiated from the heat dissipation plate 28 of the same material as the lead terminal 24 through the circuit board 22 and the first heat dissipation plate 26. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:在确保可靠性的同时提高散热性能。 解决方案:相对小的线性膨胀系数的第一散热板26与电路板22的后表面接合,第二散热板28具有相对较大的线性膨胀系数,包括与 引线端子24在端部处被表面粘结,避开第一散热板26的中心部分,并且远端部分28b从封装侧面露出到外部。 因此,与电路板22接合的第一散热板26的线膨胀系数更接近于电路板22的线膨胀系数,电路板22和第一散热板26之间的热应力的影响 电子部件21a,21b,21c的发热通过电路板22和第一散热板26从与引线端子24相同材料的散热板28辐射。版权所有: (C)2010,JPO&INPIT
    • 9. 发明专利
    • Electronic component module
    • 电子元件模块
    • JP2010040569A
    • 2010-02-18
    • JP2008198411
    • 2008-07-31
    • Aisin Aw Co LtdToyota Motor Corpアイシン・エィ・ダブリュ株式会社トヨタ自動車株式会社
    • TOMINAGA KEIICHIMURAKAMI NAOTAKAMATSUBARA MASATO
    • H01L23/40H01L23/34H01L25/04H01L25/18
    • H01L2224/48227H01L2924/19106H01L2924/19107
    • PROBLEM TO BE SOLVED: To suppress a rise in temperature of an electronic component mounted on a substrate.
      SOLUTION: A heat-generating electronic component 22a is mounted on the upper surface of the circuit substrate 30, a low-heat-generating electronic component 22b on the lower surface of the circuit substrate 30 is disposed at a position different from a position matched with the heat-generating electronic component 22a, and test points 32 for testing the heat-generating electronic component 22a and low-heat-generating electronic component 22b are formed in a concentrated manner in regions RAL and RBL including the position matched with the heat-generating electronic component 22a on the lower surface of the circuit substrate 30. Consequently, heat generated by the heat-generating electronic component 22a is efficiently dissipated from a heat sink 40 via TP wiring 34, the test points 32, and a silicon adhesive 48, thereby suppressing rises in the temperature of the heat-generating electronic component 22a and low-heat-generating electronic component 22b.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:抑制安装在基板上的电子部件的温度上升。 解决方案:发电电子部件22a安装在电路基板30的上表面上,电路基板30的下表面上的低发热电子部件22b设置在与 与发热电子部件22a匹配的位置,在发热电子部件22a和低发热电子部件22b的测试点32集中地形成在包括与发热电子部件22a的位置配合的区域RAL, 因此,由发热电子部件22a产生的热量经由TP布线34,测试点32和硅胶等从散热器40有效地散发 从而抑制发热电子部件22a和低发热电子部件22b的温度上升。 版权所有(C)2010,JPO&INPIT