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1. 发明专利

JP2010219092A Electronic circuit device 审中-公开
标题翻译：电子电路设备
公开(公告)号：JP2010219092A
公开(公告)日：2010-09-30
申请号：JP2009060726
申请日：2009-03-13
申请人： Aisin Aw Co Ltd , Toyota Motor Corp , アイシン・エィ・ダブリュ株式会社 , トヨタ自動車株式会社
发明人： TOMINAGA KEIICHI , YAMATO OSAMU , YAMADA AKIHIRO , MATSUBARA MASATO
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To more efficiently suppress peeling between a sealing resin part and an object to be sealed resulting from degate processing.
SOLUTION: An electronic circuit device 20 including a circuit board 22 on which an electronic component 21 is mounted, includes a flexible wiring board 23 bonded to the circuit board 22 to make electric connections between the circuit board 22 and external equipment, a heat dissipation plate 24 bonded to at least the flexible wiring board 23, sealing resin parts 25a and 25b made of resin formed so as to seal parts of the circuit board 22 and flexible wiring board 23 and a part of the heat dissipation plate 24, and peeling acceleration parts 30a and 30b provided in the flexible wiring board 23 and heat dissipation plate 24 so as to be opposite unnecessary resin 25e or 25b cured in a molding die 10 during molding of the sealing resin parts 25a and 25b to accelerate peeling between the flexible wiring board 23 and heat dissipation plate 24, and the unnecessary resin 25d or 25e.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了更有效地抑制密封树脂部分和由去角加工产生的待密封物体之间的剥离。解决方案：包括其上安装电子部件21的电路板22的电子电路装置20包括接合到电路板22的柔性布线板23，以在电路板22和外部设备之间进行电连接，至少与柔性布线板23接合的散热板24，密封由树脂制成的树脂部分25a和25b，以密封电路板22和挠性布线板23的一部分和散热板24的一部分，以及设置在柔性布线板23和散热板24上的剥离加速部分30a和30b与密封树脂部分25a和25b成型期间在成形模具10中固化的不必要的树脂25e或25b相对，从而加速柔性布线板23和散热板24以及不需要的树脂25d或25e。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010219091A Electronic circuit device 审中-公开
标题翻译：电子电路设备
公开(公告)号：JP2010219091A
公开(公告)日：2010-09-30
申请号：JP2009060725
申请日：2009-03-13
申请人： Aisin Aw Co Ltd , Toyota Motor Corp , アイシン・エィ・ダブリュ株式会社 , トヨタ自動車株式会社
发明人： MURAKAMI NAOTAKA , YAMATO OSAMU , YAMADA AKIHIRO , MATSUBARA MASATO
IPC分类号： H01L23/12 , H01L23/36
CPC分类号： H01L2224/73204 , H01L2924/181 , H01L2924/19107 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit device for appropriately securing heat radiation properties of a circuit board by a simple structure. SOLUTION: The electronic circuit device 20 includes: a circuit board 22 on which electronic components 21 have been packaged; a flexible wiring board 23 that is adhered to a non-packaging surface, namely a surface at a side opposite to the packaging surface of the circuit board 22 and can electrically connects the circuit board 22 and external equipment 100; and a heat radiation plate 24 adhered to a surface at a side opposite to the adhesion surface with the circuit board 22 of the flexible wiring board 23. In the electronic circuit device 20, an opening 23o is formed on the flexible wiring board 23 so that it opposes the non-packaging surface of the circuit board 22. An adhesive layer 30 made of a heat radiation adhesive for mutually adhering the non-packaging surface of the circuit board 22 and the heat radiation plate 24 is formed at a region demarcated by the opening 23o, the non-packaging surface of the circuit board 22, and the heat radiation plate 24. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过简单的结构适当地确保电路板的散热特性的电子电路装置。电子电路装置20包括：已经封装有电子部件21的电路板22; 柔性布线板23，其粘附到非封装表面，即与电路板22的封装表面相对的一侧的表面，并且可以电连接电路板22和外部设备100; 以及与柔性布线板23的电路板22粘接在与粘合面相反一侧的表面的散热板24.在电子电路装置20中，在柔性布线板23上形成开口23o，使得它与电路板22的非封装表面相对。由用于相互粘合电路板22的非封装表面和散热板24的散热粘合剂制成的粘合剂层30形成在由开口23o，电路板22的非封装表面和散热板24.版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009231351A Sealing structure of electronic component 审中-公开
标题翻译：电子元件密封结构
公开(公告)号：JP2009231351A
公开(公告)日：2009-10-08
申请号：JP2008071749
申请日：2008-03-19
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： YAMATO OSAMU
IPC分类号： H01L23/29 , H01L23/24 , H01L23/31 , H01L23/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To further improve reliability of electronic components loaded on a substrate. SOLUTION: Resin sealing of electronic components 26a to 26c loaded on the substrate 20 is actualized by supplying heat radiating grease into a cover 30, covering two components 26b, 26c of the electronic components 26a to 26c with the cover 30, attaching a silicon sheet not to allow the resin to be deposited on the upper surface of the cover 30, arranging these elements to a molding die, hardening the resin supplied, taking them out of the molding die, and peeling the silicon sheet. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：进一步提高负载在基板上的电子部件的可靠性。解决方案：通过向盖30提供散热润滑脂，通过盖30覆盖电子部件26a至26c的两个部件26b，26c，实现装载在基板20上的电子部件26a至26c的树脂密封，硅片不允许树脂沉积在盖30的上表面上，将这些元件设置在成型模具上，使所供给的树脂硬化，将其从模具中取出并剥离硅片。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2004200282A Method of mounting electronic component 审中-公开
标题翻译：安装电子元件的方法
公开(公告)号：JP2004200282A
公开(公告)日：2004-07-15
申请号：JP2002364948
申请日：2002-12-17
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： INAGAKI SHUICHI , YAMATO OSAMU
IPC分类号： B05D3/02 , B05D3/10 , B05D7/00 , H01L21/60 , H05K3/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic component by which residues can be removed sufficiently and a component mounting substrate can be cleaned sufficiently, and then, the cost of an electronic component mounting device can be lowered.
SOLUTION: This method of mounting electronic component includes an applying step of applying a coating agent to the surfaces of the substrate 11 of the component mounting substrate and an electronic component 12, a heating step of soldering the component 12 to the substrate 11 by heating the component mounting substrate after the substrate 11 is coated with the coating agent, and a cleaning step of cleaning the component mounting substrate with a cleaning agent selected correspondingly to the coating agent. Since the cleaning agent is selected correspondingly to the coating agent, residues adhering to the surface of the component mounting substrate can be removed sufficiently as the component mounting substrate is cleaned with the cleaning agent. Consequently, the component mounting substrate can be cleaned sufficiently.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种安装电子部件的方法，通过该方法可以充分去除残留物并且可以充分地清洁部件安装基板，然后可以降低电子部件安装装置的成本。解决方案：这种安装电子部件的方法包括将涂布剂涂布到部件安装基板的基板11的表面和电子部件12上的涂布步骤，将部件12焊接到基板11的加热工序通过在基板11涂覆有涂层剂之后加热部件安装基板，以及清洁步骤，用相应于涂覆剂选择的清洁剂清洁部件安装基板。由于与涂布剂相应地选择清洁剂，所以当用清洁剂清洁部件安装基板时，可以充分去除附着在部件安装基板的表面上的残留物。因此，可以充分地清洁部件安装基板。版权所有（C）2004，JPO＆NCIPI

5. 发明专利

JP2013094824A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013094824A
公开(公告)日：2013-05-20
申请号：JP2011240560
申请日：2011-11-01
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YASUI SEIJI , YAMATO OSAMU , MAEDA TAKAYUKI
IPC分类号： B23K1/00 , B23K1/14 , B23K101/40 , H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： B23K1/0016 , H01L23/36 , H01L23/492 , H01L24/37 , H01L24/40 , H01L25/072 , H01L2224/29101 , H01L2224/32245 , H01L2224/33181 , H01L2224/37011 , H01L2224/40095 , H01L2224/40101 , H01L2224/40139 , H01L2224/40151 , H01L2224/73263 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/014 , H01L2924/00 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of improving the inclination of a connecting terminal bonded to a substrate or the like through brazing filler metal.SOLUTION: The semiconductor device 1 includes the connecting terminal 140. The terminal includes two leg portions 142 being bonded respectively to a bonding object that is a substrate or one semiconductor element disposed on the substrate through the brazing filler metal; and a connecting portion 141 connected to the two leg portions 142 and extended between the two leg portions while separating from the substrate or the one semiconductor element.
摘要翻译：解决的问题：提供一种能够通过钎焊料改善与基板等接合的连接端子的倾斜度的半导体装置。解决方案：半导体器件1包括连接端子140.端子包括两个腿部142，其分别通过钎料焊接到作为衬底的接合对象或设置在衬底上的一个半导体元件; 以及连接部分141，连接到两个腿部142并且在与基底或一个半导体元件分离的同时在两个腿部之间延伸。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2010069489A Method of laser-welding copper member 审中-公开
标题翻译：激光焊接方法
公开(公告)号：JP2010069489A
公开(公告)日：2010-04-02
申请号：JP2008236843
申请日：2008-09-16
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： YAMATO OSAMU
IPC分类号： B23K26/32 , B23K26/20 , B23K103/12 , B23K103/16
摘要： PROBLEM TO BE SOLVED: To provide a method of laser-welding copper members, by which a first copper member and a second copper member are welded with high quality and easily by an YAG laser beam without generating spatters. SOLUTION: The back of the first copper member 20 on the surface side of which an electrolytic nickel plating film 24 is exposed is brought into contact with the surface of the second copper member 21 on the surface side of which a low melting-point metal film 27 is exposed to irradiate the electrolytic nickel plating film 24 on surface side of the first copper member 20 with the YAG laser beam 30 without melting the electrolytic nickel plating film 24 under an irradiation condition that a melting portion 32 from the copper base material 23 of the first copper member 20 at least to a predetermined depth from the surface side of the copper base material 25 of the second copper member 21 is molten. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种激光焊接铜构件的方法，通过该方法，通过YAG激光束以高质量和容易地焊接第一铜构件和第二铜构件而不产生飞溅。解决方案：电解镀镍膜24的表面侧的第一铜构件20的背面与第二铜构件21的表面侧的表面侧接触，暴露点金属膜27，在YAG激光束30的第一铜构件20的表面侧照射电解镀镍膜24，而不会在电解镍镀膜24的熔融部32从铜基从第二铜构件21的铜基材25的表面侧至少至规定深度的第一铜构件20的材料23熔融。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2013098466A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013098466A
公开(公告)日：2013-05-20
申请号：JP2011242206
申请日：2011-11-04
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YASUI SEIJI , YAMATO OSAMU , MAEDA TAKAYUKI
IPC分类号： H01L23/28
CPC分类号： H01L24/40 , H01L23/24 , H01L23/3107 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a structure which properly prevents a resin from moving along a flexible circuit board and protruding to the exterior of the substrate.SOLUTION: A semiconductor device 1 includes: a metal substrate; a semiconductor element disposed on the metal substrate; a flexible circuit board having one end disposed on the metal substrate and electrically connecting with the semiconductor element, the flexible circuit board extending beyond an edge part of the metal substrate to the exterior of the metal substrate; a resin wall part 70 disposed at least in the edge part of the metal substrate beyond which the flexible circuit board extends, out of an outer peripheral part of the metal substrate, the resin wall part 70 provided on the flexible circuit board at the edge part; and a resin sealing part 72 provided at the inner side of the resin wall part 70 so as to cover the metal substrate.
摘要翻译：要解决的问题：提供一种适当地防止树脂沿着柔性电路板移动并突出到基板的外部的结构。解决方案：半导体器件1包括：金属基板; 设置在所述金属基板上的半导体元件; 柔性电路板，其一端设置在所述金属基板上并与所述半导体元件电连接，所述柔性电路板延伸超过所述金属基板的边缘部分到所述金属基板的外部; 至少设置在金属基板的边缘部分的树脂壁部70，该金属基板的边缘部分，柔性电路板从金属基板的外周部分延伸出设置在柔性电路板上的树脂壁部70的边缘部分 ; 以及设置在树脂壁部70的内侧以覆盖金属基板的树脂密封部72。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012033815A Heat exchanger plate 审中-公开
标题翻译：热交换器板
公开(公告)号：JP2012033815A
公开(公告)日：2012-02-16
申请号：JP2010173678
申请日：2010-08-02
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TSURUOKA JUNJI , YAMATO OSAMU , YASUI SEIJI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger plate including projections and recesses and capable of preventing generation of a void in positions where the projections and the recesses are formed with respect to a flow of solder generated when solder is filled in a gap between a semiconductor unit and a mounting face of the heat exchanger plate.SOLUTION: A heat exchanger plate 1 includes: a mounting face 3 on which a semiconductor unit is mounted; projections 5 formed on the mounting face 3 to secure clearances for solder joining between the semiconductor unit and the mounting face 3; and recesses 6 formed in the mounting face 3 around the projections 5 to form the projections 5. Adjacent non-formation regions 7 located adjacent to the projections 5 and having no recesses 6 formed therein are provided at least in part of the entire circumferences of the projections 5 on the mounting face 3. An inclined face 8 is formed in the recess 6 at least in part of its boundary with the adjacent non-formation region 7. The inclined face 8 has an inclination having a recess depth that gradually decreases from the bottom of the recess 6 toward the adjacent non-formation region 7.
摘要翻译：要解决的问题：提供一种包括突起和凹陷的热交换器板，并且能够相对于在焊料填充时产生的焊料的流动而防止在形成有突起和凹部的位置处产生空隙半导体单元与热交换器板的安装面之间的间隙。解决方案：热交换器板1包括：安装面3，半导体单元安装在该安装面3上; 形成在安装面3上的突起5，以确保半导体单元和安装面3之间的焊料间隙; 以及形成在安装面3周围的凸起5的凹部6，以形成凸起5.邻近的非形成区域7设置在与凸部5相邻的位置，并且在其中形成有凹部6的至少一部分突起5在安装面3上。倾斜面8至少部分地与相邻的非成形区域7的边界形成在凹槽6中。倾斜面8具有从该凹部6的凹部深度逐渐减小的倾斜凹槽6的底部朝向相邻的非成形区域7。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2012019099A Electronic component bonding device and bonding method 有权
标题翻译：电子元件接合器件和接合方法
公开(公告)号：JP2012019099A
公开(公告)日：2012-01-26
申请号：JP2010156003
申请日：2010-07-08
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： YAMATO OSAMU , KUROYANAGI MASANORI , TAGUCHI MAKOTO
IPC分类号： H01L23/40
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a technology for bonding an electronic component, which quickly controls the temperature of a base material thereby realizing appropriate control a temperature of a thermosetting adhesive.SOLUTION: The electronic component bonding device comprises a first heating unit provided with a heat conductive support member for supporting a metallic plate base material in contact with a second surface of the base material opposite to a first surface thereof, for heating the base material through the support member to bond the base material and an electronic component with a thermosetting adhesive sandwiched between the first surface of the base material and the electronic component, a second heating unit for directly heating the second surface of the base material with radiant heat, and a control unit for controlling a temperature change by using the second heating unit so as to satisfy heating conditions for making a temperature of the adhesive to become a target temperature by heat application of the first heating unit and the second heating unit.
摘要翻译：要解决的问题：提供一种电子部件的接合技术，其能够快速地控制基材的温度，从而实现对热固性粘合剂的温度的适当控制。解决方案：电子部件接合装置包括第一加热单元，该第一加热单元设置有用于支撑与基体材料的与其第一表面相对的第二表面接触的金属板基材的导热支撑构件，用于加热基座材料通过支撑构件将基材材料和电子部件与夹在基材的第一表面和电子部件之间的热固性粘合剂，第二加热单元，用于以辐射热直接加热基材的第二表面，以及控制单元，其通过使用所述第二加热单元来控制温度变化，以便满足通过所述第一加热单元和所述第二加热单元的热施加使所述粘合剂的温度成为目标温度的加热条件。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2006202981A Electronic device and its manufacturing method 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2006202981A
公开(公告)日：2006-08-03
申请号：JP2005013049
申请日：2005-01-20
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TAKIMOTO MAKOTO , AOIKE KOJI , YAMATO OSAMU , YOSHIKAWA KOUTETSU
IPC分类号： H05K3/28 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an electronic device and its manufacturing method, which reduce resin consumption, manufacturing processes of the electronic device, and cost of the electronic device.
SOLUTION: The electronic device comprises a circuit wiring board 11, and electronic parts 12 and 13 attached to the mounting area set as a predetermined part of circuit wiring board 11. The circuit wiring board 11 is provided with base material, a conductive layer, an insulating layer, and a circuit pattern. In the position close to the mounting area, a dam 14 is formed so as to project upward by using the same material as either an insulating layer or a wiring pattern. In this case, resin moves from the clearance between the electronic part 12 and the circuit wiring board 11 through the upper part of the circuit wiring board 11, and reaches the edge of the dam 14. The resin migration beyond the dam is prevented by the dam 14 so that it should not spread beyond the dam 14.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供减少树脂消耗，电子设备的制造过程和电子设备的成本的电子设备及其制造方法。解决方案：电子设备包括电路布线板11和安装在作为电路布线板11的预定部分的安装区域上的电子部件12和13.电路布线板11设置有基材，导电层，绝缘层和电路图案。在靠近安装区域的位置，通过使用与绝缘层或布线图案相同的材料，形成坝14以向上突出。在这种情况下，树脂通过电路布线板11的上部从电子部件12和电路布线板11之间的间隙移动，到达坝体14的边缘。通过大坝14，不应该蔓延到大坝14之外。版权所有（C）2006年，JPO＆NCIPI

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