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1. 发明专利

JP2010040584A Electronic circuit device 审中-公开
标题翻译：电子电路设备
公开(公告)号：JP2010040584A
公开(公告)日：2010-02-18
申请号：JP2008198647
申请日：2008-07-31
申请人： Aisin Aw Co Ltd , Toyota Motor Corp , アイシン・エィ・ダブリュ株式会社 , トヨタ自動車株式会社
发明人： MURAKAMI NAOTAKA , TAKAHASHI RYOHEI , MATSUBARA MASATO
IPC分类号： H01L23/36 , H01L23/29
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve a heat radiation performance while securing reliability. SOLUTION: The first heat dissipation plate 26 of a relative small linear expansion coefficient is bonded with the back surface of a circuit board 22, the second heat dissipation plate 28 of a relatively large linear expansion coefficient comprising the same lead frame 23 as a lead terminal 24 is surface-bonded at the end part evading the center part of the first heat dissipation plate 26, and the distal end part 28b is exposed from a package side face to the outside. Thus, the linear expansion coefficient of the first heat dissipation plate 26 bonded with the circuit board 22 is brought closer to the linear expansion coefficient of the circuit board 22, the influence of heat stress between the circuit board 22 and the first heat dissipation plate 26 is reduced, and the generated heat of electronic components 21a, 21b and 21c is radiated from the heat dissipation plate 28 of the same material as the lead terminal 24 through the circuit board 22 and the first heat dissipation plate 26. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在确保可靠性的同时提高散热性能。解决方案：相对小的线性膨胀系数的第一散热板26与电路板22的后表面接合，第二散热板28具有相对较大的线性膨胀系数，包括与引线端子24在端部处被表面粘结，避开第一散热板26的中心部分，并且远端部分28b从封装侧面露出到外部。因此，与电路板22接合的第一散热板26的线膨胀系数更接近于电路板22的线膨胀系数，电路板22和第一散热板26之间的热应力的影响电子部件21a，21b，21c的发热通过电路板22和第一散热板26从与引线端子24相同材料的散热板28辐射。版权所有：（C）2010，JPO＆INPIT

2. 发明专利

JP2011018856A Electronic circuit device 有权
标题翻译：电子电路设备
公开(公告)号：JP2011018856A
公开(公告)日：2011-01-27
申请号：JP2009164063
申请日：2009-07-10
申请人： Aisin Aw Co Ltd , アイシン・エィ・ダブリュ株式会社
发明人： TAKAHASHI RYOHEI , MURAKAMI NAOTAKA , TOMINAGA KEIICHI
IPC分类号： H01L23/12 , H01L21/56 , H05K1/02 , H05K1/14 , H05K3/28
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/49838 , H01L23/4985 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/0102 , H01L2924/181 , H01L2924/19104 , H01L2924/19107 , H05K1/189 , H05K3/0058 , H05K3/386 , H05K2201/09781 , H05K2203/1316 , Y10T29/49117 , Y10T29/49146 , Y10T29/49158 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To suppress deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and to suppress deterioration in the flexible printed circuit board caused by deformation of the adhesive layer.SOLUTION: An electronic circuit device 20 includes: a circuit board 22; the flexible printed circuit board 23; sealing resin portions 25a and 25b formed by molding so as to seal the circuit board 22 and a portion of the flexible printed circuit board 23; and a heat dissipating plate 24 adhered to the flexible printed circuit board 23. The flexible printed circuit board 23 includes: a base film 230; a second cover film 234u not adhered to the heat dissipating plate 24; and a second wiring conductor 232u covered with both films, a dummy wiring material 30 that does not function as wiring is disposed outside a border between the flexible printed circuit board 23 and an outer peripheral portion of the sealing resin portion 25a, and between the base film 230 and second cover film 234u.
摘要翻译：要解决的问题：抑制在形成树脂密封部分期间柔性印刷电路板的粘合剂层的变形，并且抑制由于粘合剂层的变形引起的柔性印刷电路板的劣化。解决方案：电子电路装置 20包括：电路板22; 柔性印刷电路板23; 通过模制形成的密封树脂部分25a和25b以密封电路板22和柔性印刷电路板23的一部分; 以及粘附到柔性印刷电路板23上的散热板24.柔性印刷电路板23包括：底膜230; 没有粘附到散热板24的第二覆盖膜234u; 和由两个膜覆盖的第二布线导体232u，在柔性印刷电路板23与密封树脂部分25a的外周部分之间的边界之外，在基底之间设置不用作布线的虚拟布线材料30 薄膜230和第二覆盖薄膜234u。

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