专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007005709A Low-heat-resistance wiring board for led lighting device, and led lighting device 审中-公开
标题翻译： LED照明装置的低耐热接线板和LED照明装置
公开(公告)号：JP2007005709A
公开(公告)日：2007-01-11
申请号：JP2005186743
申请日：2005-06-27
申请人： Asahi Glass Co Ltd , 旭硝子株式会社
发明人： IRISAWA NAOSHI , MATSUMOTO HIDETOSHI , KAWAGUCHI MASANORI
IPC分类号： H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a low-heat-resistance wiring board for an LED lighting device which has superior heat dissipation characteristics and reliability.
SOLUTION: The low-heat-resistance wiring board for the LED lighting device has an insulating layer 2, and desired wiring patterns 3a and 3b laminated on a composite material substrate 1 made of a composite material obtained by dispersing a specified amount of silicon carbide particles in aluminum alloy. An LED element 5 is fixed on a sold pattern 3a across a conductive adhesive layer 4, electrically connected to the solid pattern 3a, and thermally connected to the composite material substrate 1. An upper electrode of the LED element 5 is connected to a land wiring pattern 3b by a metal thin wire 6. The low-heat-resistance wiring board for the LED lighting device is large in heat conductivity and small in difference in thermal expansion from the LED element and wiring patterns, so an LED lighting device having high reliability is obtained and LED elements can be mounted to high density.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的散热特性和可靠性的用于LED照明装置的低耐热线路板。解决方案：用于LED照明装置的低耐热线路板具有绝缘层2，并且层叠在复合材料基板1上的期望的布线图案3a和3b，复合材料基板1由通过分散特定量的铝合金中的碳化硅颗粒。将LED元件5固定在销售图案3a上，跨导电粘合剂层4电连接到固体图案3a，并且热连接到复合材料基板1上.LED元件5的上电极连接到焊盘布线图案3b通过金属细线6.用于LED照明装置的低耐热性线路板的导热性大，与LED元件和布线图案的热膨胀差小，因此具有高可靠性的LED照明装置并且可以将LED元件安装到高密度。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2003069106A Piezoelectric/electrostrictive actuator and its manufacturing method 审中-公开
标题翻译：压电/电致动器及其制造方法
公开(公告)号：JP2003069106A
公开(公告)日：2003-03-07
申请号：JP2001256300
申请日：2001-08-27
申请人： Asahi Glass Co Ltd , 旭硝子株式会社
发明人： NEGISHI SUKEYOSHI , WATANABE KAZUNARI , AOKI YUMIKO , IRISAWA NAOSHI , MANABE TSUNEO
IPC分类号： B41J2/16 , B41J2/14 , H01L41/09 , H01L41/187 , H01L41/22 , H01L41/314 , H01L41/337 , H02N2/00
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric/electrostrictive actuator using a piezoelectric/electrostrictive film that is excellent in accuracy of dimension and accuracy of worked shape. SOLUTION: This piezoelectric/electrostrictive actuator 10 is manufactured by forming a lower electrode 20 on the upper surface of a substrate 50 (B) and the piezoelectric/electrostrictive film 30 on the upper surface of the substrate 50 by applying or transferring piezoelectric/electrostrictive paste to the whole upper surface of the substrate 50 so as to cover the electrode 20 (C). Then a photoresist 100 is adhered to the upper surface of the film 30 (D) and exposed to light by photolithography by masking the photoresist 100 with a light shielding mask having a prescribed pattern. After the photoresist 100 is exposed, the unnecessary portion of the photoresist 100 is removed (E) and the unnecessary portion of the piezoelectric/electrostrictive film 30 is removed by sand blasting by using an abrasive (F). Finally, the remaining photoresist is removed (G) and an upper electrode 40 is formed on the remaining piezoelectric/ electrostrictive film 30 (H).
摘要翻译：要解决的问题：提供一种压电/电致伸缩膜的压电/电致伸缩致动器，该压电/电致伸缩膜具有优异的加工形状尺寸和精度。解决方案：该压电/电致伸缩致动器10通过在基板50（B）的上表面上形成下电极20和在基板50的上表面上的压电/电致伸缩膜30，通过施加或转移压电/电致伸缩膏到基板50的整个上表面以覆盖电极20（C）。然后，通过用具有规定图案的遮光掩模掩模光致抗蚀剂100，将光致抗蚀剂100粘附到膜30（D）的上表面并通过光刻曝光。在曝光光致抗蚀剂100之后，除去光致抗蚀剂100的不需要部分（E），通过使用研磨剂（F）通过喷砂除去压电/电致伸缩膜30的不需要部分。最后，除去剩余的光致抗蚀剂（G），在剩余的压电/电致伸缩膜30（H）上形成上电极40。

3. 发明专利

JP2001048667A JOINING METHOD FOR CERAMIC PARTS 失效
公开(公告)号：JP2001048667A
公开(公告)日：2001-02-20
申请号：JP22900199
申请日：1999-08-13
申请人： ASAHI GLASS CO LTD
发明人： KAMISUKE YOICHI , ENOMOTO AKIHIRO , IRISAWA NAOSHI
IPC分类号： C04B35/10 , C04B35/185 , C04B35/48 , C04B35/573 , C04B35/581 , C04B35/584 , C04B37/00 , C04B37/02 , C23C16/42
摘要： PROBLEM TO BE SOLVED: To obtain high strength capable of enduring under a high temp. environment with a simple operation even in the case of a complex form by forming an SiC fixing coating layer on the surface of plural ceramic parts, which are arranged so that the desired parts to be jointed are put close to each other by a chemical vapor growth method. SOLUTION: An SiC(CVD-SiC) fixing coating layer 23 is formed on the surface of a combined body 20 of ceramic parts, which are arranged in such a manner that the parts are brought into contact to each other by a chemical vapor growth method. Thereby, a high hardness shell of high hardness SiC coating is formed on the whole outer surface of the combined body 20 and the combined body 20 present at the inside of the shell is completely fixed by the outer shell and a combined body 30 having high strength as a whole is formed. It is preferable to arrange the ceramic parts so that a gap (d) is formed between the ceramic parts and to fill the gap with the CVD-SiC. Thereby, the gap (d) between the ceramic parts is completely filled with the high hardness CVD-SiC and the joining strength between the joined parts is more improved.

4. 发明专利

JPH0244084A ALUMINUM NITRIDE SUBSTRATE AND PRODUCTION THEREOF 失效
公开(公告)号：JPH0244084A
公开(公告)日：1990-02-14
申请号：JP19207588
申请日：1988-08-02
申请人： ASAHI GLASS CO LTD
发明人： IRISAWA NAOSHI , WATANABE KAZUNARI , NAKAHARA KATSUMASA
IPC分类号： C04B35/581 , C04B35/58 , C04B41/87 , H05K1/03
摘要： PURPOSE:To improve the surface smoothness and alkali resistance of an aluminum nitride substrate as well as the adhesion to the metallized layer of a circuit board by forming an Al2O3 layer on the surface of the substrate and specular- finishing the surface of the layer. CONSTITUTION:An Al2O3 layer of about 3-50mum thickness is formed on the surface of an aluminum nitride substrate and the surface of the layer is specular- finished to

5. 发明专利

JPH01128485A OXIDATION SUPERCONDUCTOR WIRING BASE MATERIAL 失效
公开(公告)号：JPH01128485A
公开(公告)日：1989-05-22
申请号：JP28434187
申请日：1987-11-12
申请人： ASAHI GLASS CO LTD
发明人： IRISAWA NAOSHI
IPC分类号： H01L39/06 , H05K1/03
摘要： PURPOSE:To enable mechanical strength of an insulation substrate to be high, smoothing properties to be superb, high density wiring of a superconductor to be realized, and to obtain a superconductive characteristics with improved reliability by wiring an oxidation superconductor on a substrate including MgO and Al2O3. CONSTITUTION:A desirable range of a substrate material is 95-99weight% MgO, 1-5weight% Al2O3, and the total weight% MgO and 99.5weight% or more Al2O3. As a superconductor to be wired, any superconductor which does not deteriorate due to reaction with substrate and an oxidation superconductor with a large adhesion strength can be used. Ba-Y-Cu-O superconductor is desirable since it has a better conformity with an insulated substrate and has a higher critical temperature. After mixing materials to obtain a desired composition, a forming assistant is added as needed, and a desired shape is formed, an insulation substrate can be obtained by sintering. For example, screen printing method is used to perform wiring on this insulation substrate using an oxidation superconductor.

6. 发明专利

JPH0195587A SUPERCONDUCTOR WIRING BOARD 失效
公开(公告)号：JPH0195587A
公开(公告)日：1989-04-13
申请号：JP25251287
申请日：1987-10-08
申请人： ASAHI GLASS CO LTD
发明人： IRISAWA NAOSHI , ABE HIROSHI
IPC分类号： H05K1/09 , H01L39/06
摘要： PURPOSE:To prevent a change in quality of a superconductor by a method wherein a metal layer is installed between a ceramic substrate and the superconductor. CONSTITUTION:A metal layer is installed between a ceramic substrate and a superconductor. When an oxide-based superconductor is used, it must be baked in an oxidizing atmosphere at a temperature of 900 deg.C or higher; accordingly, a metal which is stable in the high-temperature oxidizing atmosphere, e.g. Ag or Au, is preferable because its acid-resistance is high and its conductivity is excellent. By this setup, the superconductor is bonded firmly to substrate; the superconductor is not disconnected; the superconductor does not into direct contact with the substrate; accordingly, it is possible to prevent a change in chemical quality of the superconductor.

7. 发明专利

JP2007012876A Laminated material for circuit board and manufacturing method thereof 审中-公开
标题翻译：电路板层压材料及其制造方法
公开(公告)号：JP2007012876A
公开(公告)日：2007-01-18
申请号：JP2005191901
申请日：2005-06-30
申请人： Asahi Glass Co Ltd , 旭硝子株式会社
发明人： IRISAWA NAOSHI , ISHIDA MIZUHO , NIIYAMA SATOSHI
IPC分类号： H05K1/05 , B32B15/08 , B32B27/00 , C08K3/00 , C08L83/00 , H01L23/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a laminated material for circuit board and a method of manufacturing the same assuring that heat resistance property is good, dielectric loss under higher temperature is not increased, reduction of insulating resistance is small, and normal and stable operation is guaranteed for a long period of time even under severe environment under large change of temperature. SOLUTION: The laminated material 1 for circuit board comprises an insulating material layer 3, a metal layer 4 adjacent to one side of the insulating material layer 3, and a base material layer 2 formed of aluminum including silicon carbide powder existing in the other side of the insulating material layer. In this laminated material 1 for circuit board, the insulating material layer 3 is formed of a hardening methyl-phenyl-silicone resin and a hardened composition including a fire-resistant filler. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了提供一种用于电路板的叠层材料及其制造方法，其确保耐热性能良好，较高温度下的介电损耗不会增加，绝缘电阻的降低很小，正常和即使在温度变化较大的环境下，也能保证长时间的稳定运行。解决方案：电路板层压材料1包括绝缘材料层3，与绝缘材料层3的一侧相邻的金属层4和由铝形成的基材层2，其中包含存在于绝缘材料层的另一侧。在这种电路板层叠材料1中，绝缘材料层3由硬化甲基 - 苯基 - 硅氧烷树脂和包含耐火填料的硬化组合物形成。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005067926A Joining composition, joining material and joined body 审中-公开
标题翻译：加工组合物，加工材料和加工体
公开(公告)号：JP2005067926A
公开(公告)日：2005-03-17
申请号：JP2003297405
申请日：2003-08-21
申请人： Asahi Glass Co Ltd , 旭硝子株式会社
发明人： IRISAWA NAOSHI , CHIBA JIRO
IPC分类号： C03C29/00 , C03C8/24 , C09J1/00
CPC分类号： C03C3/068 , C03C3/066
摘要： PROBLEM TO BE SOLVED: To obtain a joining composition having the small volume expansion of a fired body when being fired and a joining material.
SOLUTION: The joining composition contains, by mass percentage, ≥85% in total of SiO
2 -B
2 O
3 -ZnO based glass powder and powder of MgO or a Mg compound to be converted into MgO by being heated at 600°C and the surface area of MgO or the Mg compound powder is 0.4-8 m
2 per 100 g of the composition. The Mg compound is MgCO
3 and/or Mg(OH)
2 . The joining material contains 1-6 pts.mass binder and 0.05-2 pts.mass releasing agent per 100 pts.mass joining composition. A joined body is formed by joining metals to each other through a fired body obtained by firing the joining composition or the joining material.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：获得烧制时的烧制体体积膨胀小的接合组合物和接合材料。＆lt; P＆gt;解决方案：接合组合物以质量％计含有SiO 2总量≥85％的SiO 2 -BSn 2 通过在600℃下加热而转化为MgO的MgO或Mg化合物粉末，MgO或Mg化合物粉末的表面积为0.4-8m 2 / SP / 100g 的组成。 Mg化合物是MgCO 3 SB 3和/或Mg（OH）2 SB 2。接合材料含有1-6个聚苯乙烯粘合剂和每100个聚碳酸酯接合组合物的0.05-2重量份释放剂。通过烧结接合组合物或接合材料获得的烧制体将金属彼此接合而形成接合体。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JPH06221764A DEVICE FOR HEAT TREATMENT AND ITS HEAT-TREATED OBJECT 失效
公开(公告)号：JPH06221764A
公开(公告)日：1994-08-12
申请号：JP3124593
申请日：1993-01-27
申请人： ASAHI GLASS CO LTD
发明人： IRISAWA NAOSHI
IPC分类号： F27B5/06 , F27B5/10
摘要： PURPOSE:To obtain a device for heat treatment which is capable of degreasing a ceramic of AlN simultaneously with its firing. CONSTITUTION:A device for heat treatment for moldings of AlN, of which either the heater 2 or the heat-insulating material 3 is of carbon, is provided with a muffle 1 of which at least the inner side consists of a material other than carbon (AlN, BN, Si3N4, W, Mo, etc.) and which is positioned on the inner side of both the heater 2 and the heat-insulating material 3 and fixed inside the furnace. The muffle 1 is provided with an intake pipe 7 for nitrogen and a gas-discharge pipe 8 for removing the gas produced at the time of the degreasing from the furnace to the outside.

10. 发明专利

JPH0196060A PRODUCTION OF OXIDE SUPERCONDUCTING MATERIAL 失效
公开(公告)号：JPH0196060A
公开(公告)日：1989-04-14
申请号：JP25374587
申请日：1987-10-09
申请人： ASAHI GLASS CO LTD
发明人： IRISAWA NAOSHI
IPC分类号： H01L39/24 , B28B1/00 , C01G1/00 , C04B35/00 , C04B35/45 , H01B12/02 , H01B13/00
摘要： PURPOSE:To stably and easily obtain an oxide superconductive material having a high critical temp. by using acrylic resin as a binder for molding an oxide superconductive material. CONSTITUTION:A mixture of powder of an oxide superconductive material or powder convertible into an oxide superconductive material by heating with acrylic resin is used. The acrylic resin is preferably added by 0.5-30g per 100g powder as starting material. A polymer of acrylic acid or a deriv. thereof may be used as the acrylic resin and polyacrylic ester or polymethacrylic ester is preferably used.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式