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1. 发明专利

JP2014210317A スラリー噴射加工用ノズル、表面加工装置、および表面加工方法审中-公开
标题翻译：浆液喷射喷嘴，处理表面的装置和方法
公开(公告)号：JP2014210317A
公开(公告)日：2014-11-13
申请号：JP2013088016
申请日：2013-04-19
申请人：国立大学法人大阪大学 , Osaka Univ , 東ソー株式会社 , Tosoh Corp
发明人： YAMAUCHI KAZUTO , OKAMURA TOSHIHIKO , TAKATO SHUJI
IPC分类号： B24C5/04 , B24C3/00 , B24C3/32 , B24C5/02
CPC分类号： B24C3/00 , B24C3/32 , B24C5/02 , B24C5/04
摘要：【課題】単位加工領域内におけるガラス基板等の被加工物に対する単位時間当たりの掘り込み量(掘り込み速度)の向上と、単位加工領域の拡大を図り、加工時間を短縮化できるスラリー噴射加工用ノズルの提供。【解決手段】水に砥粒を分散させたスラリーを被加工物の表面に噴射し、被加工物表面を研磨するスラリー噴射加工用ノズルであって、スラリー供給口36から供給されるスラリーを複数のノズル孔部37から噴射するノズルヘッド30を有し、複数のノズル孔部37は、ノズルヘッド30の回転中心Lcから全てのノズル孔部37までの距離を異ならせたことを特徴とする。【選択図】図2
摘要翻译：要解决的问题：提供一种在相对于诸如玻璃基板的工件的单位处理区域中提高每单位时间的挖掘量（挖掘速度）的浆料喷射喷嘴，并且延长单元处理区域以缩短处理时间。解决方案：用于喷射浆料的浆料喷射喷嘴，其中磨料颗粒在水中扩散到工件的表面以抛光工件的表面，包括喷嘴头30，用于从浆料供给口36喷射从多个喷嘴孔多个喷嘴孔部分37分别具有与喷嘴头30的旋转中心Lc到所有喷嘴孔部分37不同的距离。

2. 发明专利

JP2014117754A Polishing abrasive grain and polishing method 审中-公开
标题翻译：抛光磨粒和抛光方法
公开(公告)号：JP2014117754A
公开(公告)日：2014-06-30
申请号：JP2012272201
申请日：2012-12-13
申请人： Osaka Univ , 国立大学法人大阪大学 , Tosoh Corp , 東ソー株式会社
发明人： YAMAUCHI KAZUTO , OKAMURA TOSHIHIKO , TAKATO SHUJI
IPC分类号： B24C11/00 , C03C19/00
摘要： PROBLEM TO BE SOLVED: To shorten a surface processing time of a workpiece, by improving a digging-in speed in a unit processing area in slurry jetting processing.SOLUTION: In a surface processing method, a processing liquid is jetted to a workpiece surface from a nozzle disposed with a predetermined gap to the workpiece surface, a shearing flow of the processing liquid is generated in the vicinity of the workpiece surface, an abrasive grain particulate in the processing liquid chemically bonds by chemical reaction with the workpiece surface, an atom of the workpiece surface is removed by removing the abrasive grain particulate chemically bonded to the workpiece surface by the shearing flow, and the surface of the workpiece is processed by relatively moving the workpiece and the nozzle. An abrasive grain is a silica abrasive grain of 0.4-0.6 in the peak intensity ratio of an isolation OH group and a hydrogen bonding OH group in an abrasive grain surface.
摘要翻译：要解决的问题：通过提高浆料喷射处理中的单位处理区域的挖掘速度，缩短工件的表面处理时间。解决方案：在表面处理方法中，将处理液从以工件表面设有预定间隙的喷嘴，在工件表面附近产生处理液的剪切流，处理液中的磨粒颗粒通过与工件表面的化学反应化学键合，原子通过除去通过剪切流化学结合到工件表面的磨粒颗粒来去除工件表面，并且通过相对移动工件和喷嘴来处理工件的表面。研磨颗粒是在研磨颗粒表面中分离OH基团和氢键OH基团的峰强度比为0.4-0.6的二氧化硅磨料颗粒。

3. 发明专利

JP2009214271A Abrading tool for abrading apparatus, and grinding method 有权
标题翻译：抛光装置的研磨工具和研磨方法
公开(公告)号：JP2009214271A
公开(公告)日：2009-09-24
申请号：JP2008062973
申请日：2008-03-12
申请人： Tosoh Corp , 東ソー株式会社
发明人： UCHIDA MASAHITO , TAKATO SHUJI , ASANO MUTSUMI
IPC分类号： B24D7/00 , B24B7/04
摘要： PROBLEM TO BE SOLVED: To solve such a problem that need of repair and process for a polishing material surface is caused due to too small or too large wear amount of an inner diameter of a polishing material, and a glass substrate cannot be polished to a target shape after the glass substrate is polished by a polishing tool having the disc shape polishing material with an inner diameter portion. SOLUTION: In the polishing tool for the polishing apparatus which fixes the disk-shaped polishing material 15d where the inner diameter hole 15c is formed in the center on one face side of a tool retaining disc 15b, and polishes a surface of the polished member that is brought into contact with the polishing material 15d by rotating the tool retaining disc 15b by the polishing apparatus, an inner/outer diameter ratio that is a ratio of an outer diameter to the inner diameter of the inner diameter hole 15c of the disk-shaped polishing material 15d is set to 10% or more and 20% or less. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题为了解决由于研磨材料的内径的磨损量太小或太大而导致抛光材料表面的修理和加工的问题，并且玻璃基板不能在通过具有内径部分的盘形抛光材料的抛光工具抛光玻璃基板之后，抛光到目标形状。解决方案：在用于固定在工具保持盘15b的一个面上的中心处形成有内径孔15c的盘状抛光材料15d的抛光装置的抛光工具中，并且对抛光构件，其通过由研磨装置旋转工具保持盘15b而与研磨材料15d接触，内径/外径比为外径与内径孔15c的内径之比盘状研磨材料15d设定为10％以上且20％以下。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2014084420A Manganese oxide polishing agent for free abrasive grain polishing, and method for producing the agent 审中-公开
标题翻译：用于免费磨粒抛光的氧化锰抛光剂及其生产方法
公开(公告)号：JP2014084420A
公开(公告)日：2014-05-12
申请号：JP2012235204
申请日：2012-10-24
申请人： Tosoh Corp , 東ソー株式会社
发明人： ABE MASANORI , TAKATO SHUJI , UCHIDA MASATO
IPC分类号： C09K3/14 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive manganese oxide polishing agent for free abrasive grain polishing, which attains a high polishing speed to glass and generates no scratch when glass is polished therewith.SOLUTION: The manganese oxide polishing agent for free abrasive grain polishing is a MnOabrasive grain obtained by firing MnO, has 30% or smaller MnOrate, 1.0-5.0 m/g specific surface area when measured by a BET method after firing, and 0.6-2.5 μm average particle size (D50) of secondary particles but does not contain the abrasive grains each having the grain size equal to or larger than 10 μm. The manganese oxide polishing agent exhibits excellent polishing performance to the glass since the manganese oxide polishing agent attains high polishing speed and generates no scratch when the glass is polished therewith.
摘要翻译：要解决的问题：提供廉价的用于游离磨粒研磨的锰氧化物抛光剂，其对玻璃进行高抛光速度，并且在玻璃抛光时不会产生划痕。解决方案：用于游离磨粒抛光的氧化锰抛光剂是通过焙烧MnO而获得的MnO磨料颗粒具有30％以下的MnOrate，通过烧成后的BET法测定的比表面积为1.0〜5.0m / g，二次粒子的平均粒径（D50）为0.6〜2.5μm，含有各自具有等于或大于10μm的粒度的磨粒。氧化锰抛光剂对玻璃具有优异的抛光性能，因为氧化锰抛光剂达到高抛光速度，并且当玻璃被抛光时不产生划痕。

5. 发明专利

JP2009107064A Method of mechanical polishing, mechanical polishing device, and article to be polished 有权
标题翻译：机械抛光方法，机械抛光装置及抛光物品
公开(公告)号：JP2009107064A
公开(公告)日：2009-05-21
申请号：JP2007281533
申请日：2007-10-30
申请人： Tosoh Corp , 東ソー株式会社
发明人： UCHIDA MASAHITO , TAKATO SHUJI , ASANO MUTSUMI
IPC分类号： B24B7/04
摘要： PROBLEM TO BE SOLVED: To provide a method of polishing, working only a portion to be worked even if a projecting portion not needed to be worked appears on the surface of a glass substrate during the working when the surface of the glass substrate is polished by cutting-in operation. SOLUTION: The glass substrate 1 is held on a rotary table by a backing pad 14 made of a viscoelastic material. When the surface of the glass substrate 1 rotated by a polishing tool 15 having a fixed tool surface is polished by cutting-in operation, a time for which the polishing tool 15 passes the portion of the glass substrate 1 which must be worked is decreased, and a time for which the polishing tool passes the portion of the glass substrate not needed to be worked is increased. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种抛光方法，即使在玻璃基板的表面在玻璃基板的表面工作时，即使在玻璃基板的表面上出现不需要加工的突出部分，也仅加工一部分，通过切入操作进行抛光。解决方案：玻璃基板1通过由粘弹性材料制成的衬垫14保持在转台上。当通过切入操作抛光由具有固定工具表面的抛光工具15旋转的玻璃基板1的表面时，抛光工具15通过玻璃基板1的必须被加工的部分的时间减少，并且增加了抛光工具通过玻璃基板的不需要加工的部分的时间。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2004025412A Surface correction method of polishing surface plate and surface correction material used for the same 审中-公开
公开(公告)号：JP2004025412A
公开(公告)日：2004-01-29
申请号：JP2002189150
申请日：2002-06-28
申请人： Tosoh Corp , Tosoh Quartz Corp , 東ソー・クォーツ株式会社 , 東ソー株式会社
发明人： KURAMOCHI TOSHIHITO , TAKATO SHUJI , YOKOMIZO YUKO , ASANO MUTSUMI
IPC分类号： B24B53/017 , B24D3/00 , B24D7/00 , B24D7/06 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a surface correction method of a polishing surface plate and a surface correction material for it in the case of polishing a polished material with the polishing surface plate using polishing compact mainly consisting of inorganic grains. SOLUTION: The surface correction method of the polishing surface plate and the surface correction material for it are used arranging a member made of a predetermined material on a part or a whole surface with respect to the correction of the correction material used for the surface correction, and adding correction fluid by mutually carrying out abrasive movement of the polishing surface plate and/or the surface correction material. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2013132713A Method and device for separating and removing foreign matter from circulated and reused polishing agent slurry 审中-公开
标题翻译：用于从循环和回收的抛光剂浆料中分离和去除外来物质的方法和装置
公开(公告)号：JP2013132713A
公开(公告)日：2013-07-08
申请号：JP2011284243
申请日：2011-12-26
申请人： Tosoh Corp , 東ソー株式会社
发明人： TAKAHASHI KENICHI , MATSUMURA YUJI , TAKATO SHUJI
IPC分类号： B24B55/12
摘要： PROBLEM TO BE SOLVED: To provide method and device for effectively and continuously removing polishing glass waste increased in repeatedly circulated and reused polishing agent slurry in glass polishing.SOLUTION: The polishing agent slurry after polishing glass is adjusted to pH 5.4-9.5 and the polishing agent slurry is separated into dispersed particles containing glass polishing waste and precipitated particles containing no glass polishing waste, to separate and remove foreign matter from the polishing agent slurry.
摘要翻译：要解决的问题：提供在玻璃抛光中反复循环和重复使用的抛光剂浆料中有效且连续地去除抛光玻璃废料的方法和装置。解决方案：抛光玻璃后抛光剂浆料调节至pH 5.4-9.5，抛光将浆料分离成含有玻璃抛光废料的分散颗粒和不含玻璃抛光废料的沉淀颗粒，以从抛光剂浆料中分离和除去异物。

8. 发明专利

JP2012250318A Zirconia-based abrasive 有权
标题翻译：基于ZIRCONIA的磨料
公开(公告)号：JP2012250318A
公开(公告)日：2012-12-20
申请号：JP2011124572
申请日：2011-06-02
申请人： Tosoh Corp , 東ソー株式会社
发明人： TSUKUMA KOJI , YAMAUCHI SHOICHI , YAMASHITA ISAO , TAKATO SHUJI , ABE MASANORI
IPC分类号： B24B37/00 , C09K3/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a zirconia-based abrasive with an extremely high polishing rate without causing polishing flaws in fine polishing.SOLUTION: Zirconia powder obtained in a wet process synthesis method such as a neutralizing method and a hydrolysis procedure collects primary minute particles to form a secondary agglomerate. The inventors evaluate glass polishing capacity of the wet process synthesis zirconia powder to analyze primary and secondary particle forms of the powder. As a result, it is found that the secondary agglomerate which becomes 300-500 nm by collecting the primary particles of 70-150 nm has an extremely high polishing capacity in the powder having a sphere approximation form in the range of fractal dimensions of 1.00-1.05. Suitable powder can be manufactured with the hydrolysis procedure for a zirconium salt to be used in fine polishing for, e.g., a glass board.
摘要翻译：要解决的问题：提供具有极高抛光速率的氧化锆基研磨剂，而不会导致精细抛光中的抛光缺陷。解决方案：在中和方法和水解方法等湿法合成方法中得到的氧化锆粉末收集初级微粒以形成二次附聚物。本发明人评估了湿法合成氧化锆粉末的玻璃抛光能力，以分析粉末的一次和二次颗粒形式。结果发现，通过收集70〜150nm的一次粒子而成为300〜500nm的二次团聚体，在分形维数为1.00〜1.0的范围内的球状近似形式的粉末中具有极高的研磨能力， 1.05。可以用锆盐的水解方法制造合适的粉末，以用于例如玻璃板的精细抛光。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012236273A Polishing agent for polishing free abrasive grain and method for producing the same 审中-公开
标题翻译：用于抛光免磨砂粒的抛光剂及其生产方法
公开(公告)号：JP2012236273A
公开(公告)日：2012-12-06
申请号：JP2011280389
申请日：2011-12-21
申请人： Tosoh Corp , 東ソー株式会社
发明人： ABE MASANORI , TAKATO SHUJI , UCHIDA MASAHITO
IPC分类号： B24B37/00 , C01G45/02 , C03C19/00 , G11B5/84
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive polishing agent for polishing free abrasive grains having high polishing speed for glass and imparting no damage to the glass caused by polishing.SOLUTION: The polishing agent for polishing free abrasive grains has an average secondary particle size of 1-3 μm, has no particles having the secondary particle diameters of 10 μm or larger, the secondary particle form of the polishing agent being spherical or equiaxial, and comprises MnOabrasive grains formed by firing granulated MnOat 800-1,000°C. The polishing agent for polishing free abrasive grains has high polishing speed for glass and imparts no damage to the glass caused by polishing, thus having excellent polishing performance for glass.
摘要翻译：要解决的问题：为了提供一种廉价的用于抛光玻璃抛光速度高的研磨抛光剂的抛光剂，并且不会抛光对玻璃的损伤。抛光剂抛光剂的平均二次粒径为1-3μm，没有二次粒径为10μm以上的粒子，抛光剂的二次粒子形状为球状或等轴线，并且包括通过烧制造粒Mn形成的磨料颗粒Mn 3 3 SB> O 4 在800-1,000℃。用于抛光磨粒的抛光剂对于玻璃具有高抛光速度，并且不会对抛光引起的玻璃损伤，因此对玻璃具有优异的抛光性能。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2007290078A Grinding method of substrate 有权
标题翻译：基板研磨方法
公开(公告)号：JP2007290078A
公开(公告)日：2007-11-08
申请号：JP2006121112
申请日：2006-04-25
申请人： Tosoh Corp , 東ソー株式会社
发明人： TANIGUCHI TAKASHI , TAKATO SHUJI , ASANO MUTSUMI
IPC分类号： B24B7/24 , B24B1/00 , B24B41/06
摘要： PROBLEM TO BE SOLVED: To provide a method for grinding the surface of a non-circular shaped substrate with excellent flatness. SOLUTION: In the grinding method for the substrate, the grinding wheel is contacted with the surface of the substrate while rotating the substrate 3 and the grinding wheel 2. The non-circular shaped substrate 3 is used as the substrate, a dummy material 4 is disposed on the peripheral edge part of the non-circular shaped substrate, and the dummy material is disposed so that the grinding wheel always maintains a constant contact area with a surface formed by the non-circular shaped substrate and the dummy material. COPYRIGHT: (C)2008,JPO&INPIT

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