专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014082455A Flexible board and board connection structure 有权
标题翻译：柔性板和板连接结构
公开(公告)号：JP2014082455A
公开(公告)日：2014-05-08
申请号：JP2013158235
申请日：2013-07-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAO MIZUKI , OHATA NOBUO , YASUI NOBUYUKI , ARIGA HIROSHI
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/118 , H01P3/003 , H01P3/081 , H01P5/028 , H05K1/0245 , H05K1/0251 , H05K1/0253 , H05K3/363 , H05K2201/09181 , H05K2201/09481 , H05K2201/09609 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： PROBLEM TO BE SOLVED: To obtain a flexible board capable of achieving a low reflection connection with a printed wiring board, and to obtain a board connection structure using the same.SOLUTION: The flexible board comprises a terminal part for obtaining electrical connection with a printed wiring board. The terminal part has: a first signal pad 1 formed on a first conductor layer 51 and electrically isolated from a ground layer 2; a pair of first ground pads 3 formed on the first conductor layer 51 so as to sandwich the first signal pad 1 therebetween and connected to the ground layer 2; a second signal pad 5 formed on a second conductor layer 52 and connected to a signal line 4; a pair of second ground pads 6 formed on the second conductor layer 52 so as to sandwich the second signal pad 5 therebetween and electrically isolated from the signal line 4; a third signal pad 7 formed on a third conductor layer 53; and a pair of third ground pads 8 formed on the third conductor layer 53 so as to sandwich the third signal pad 7 therebetween. The second signal pad 5 is wider than the third signal pad 7.
摘要翻译：要解决的问题：获得能够实现与印刷线路板的低反射连接的柔性板，并获得使用其的板连接结构。解决方案：柔性板包括用于获得与打印的电连接的端子部分接线板端子部具有：形成在第一导体层51上并与接地层2电绝缘的第一信号焊盘1; 一对第一接地焊盘3，形成在第一导体层51上，以将第一信号垫1夹在其间并连接到接地层2; 形成在第二导体层52上并连接到信号线4的第二信号焊盘5; 形成在第二导体层52上的一对第二接地焊盘6，以将第二信号焊盘5夹在其间并与信号线4电绝缘; 形成在第三导体层53上的第三信号焊盘7; 以及形成在第三导体层53上以将第三信号垫7夹在其间的一对第三接地焊盘8。第二信号垫5比第三信号垫7宽。

2. 发明专利

JP2006253569A Flexible wiring board and semiconductor device using the same 审中-公开
标题翻译：柔性布线板及使用其的半导体器件
公开(公告)号：JP2006253569A
公开(公告)日：2006-09-21
申请号：JP2005070959
申请日：2005-03-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , ARIGA HIROSHI , KONDO TERUHIRO , SUGIDACHI ATSUSHI
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board wherein soldering connection can be applied to its wires in a way of preventing their adjacent wires from being short-circuited even when pitches of a wiring pattern are minute, thereby downsizing a semiconductor device.
SOLUTION: The flexible wiring board 1 soldered to electric components or a wiring board is provided, wherein soldering connection terminals 21 of the flexible wiring board 1 are formed on one side of its insulation film 3; and conductor members 22 are provided on a side (a second side of the insulation film) opposite to the side of the insulation film 3 (a first side of the insulation film), on which the connection terminals 21 are provided along the connection terminals 21 in a way opposite to the connection terminals 21 such that the insulation film 3 is sandwiched between the conductor members 3 and the connection terminals 21.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供柔性布线板，其中即使在布线图案的间距很小的情况下，也可以以防止其相邻布线短路的方式将焊接连接施加于其布线，从而使半导体设备。解决方案：提供焊接到电气部件或布线板的柔性布线板1，其中柔性布线板1的焊接连接端子21形成在其绝缘膜3的一侧上; 并且导体构件22设置在与绝缘膜3的一侧（绝缘膜的第一侧）相对的一侧（绝缘膜的第二侧）上，连接端子21沿着连接端子21设置以连接端子21相对的方式使得绝缘膜3夹在导体构件3和连接端子21之间。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006216839A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2006216839A
公开(公告)日：2006-08-17
申请号：JP2005029112
申请日：2005-02-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ARIGA HIROSHI
IPC分类号： H01S5/022
CPC分类号： H01S5/02276 , H01L2224/48091 , H01L2224/48227 , H01L2924/19107 , H01S5/02212 , H01S5/02248 , H01S5/0427 , H01S5/06226 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an optical module having a low consumption power wherein the degradation of its signal reflecting characteristic (the increase of its reflecting quantity) can be so suppressed even though making small the value of its matching resistance provided for its impedance matching that it requires no special component and it is excellent in its high-frequency characteristic suitable to its miniaturization. SOLUTION: A matching resistance 11 formed out of a thin-film resistance and a capacitor 12 (inter-digital type capacitor) so formed as to combine with each other conductor patterns in the form of comb teeth are disposed on a sub-mount 7 for mounting thereon a laser diode 8 (LD element) in the optical module. Further, the value of the matching resistance 11 is so set to a value smaller than the one obtained by subtracting the differential resistance value of the LD element 8 from the characteristic impedance of a signal source of the optical module as to improve its signal reflecting characteristic by adjusting the capacity of the capacitor. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种具有低功率消耗功率的光模块，其信号反射特性的劣化（其反射量的增加）可被如此抑制，即使将其匹配电阻的值设定为其阻抗匹配不需要特殊部件，其高频特性优于其小型化。解决方案：由薄膜电阻形成的匹配电阻11和形成为以梳齿形状彼此结合的导体图案形成的电容器12（数字型间电容器）安装件7用于在光学模块中安装激光二极管8（LD元件）。此外，匹配电阻11的值被设定为小于通过从光学模块的信号源的特性阻抗中减去LD元件8的差分电阻值而获得的值，以提高其信号反射特性通过调整电容器的容量。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005252783A Optical transmitter 审中-公开
标题翻译：光学发射器
公开(公告)号：JP2005252783A
公开(公告)日：2005-09-15
申请号：JP2004062089
申请日：2004-03-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMADA KAZUYOSHI , ARIGA HIROSHI
IPC分类号： H01S5/068 , H04B10/07 , H04B10/2507 , H04B10/40 , H04B10/50 , H04B10/516 , H04B10/58 , H04B10/60 , H04B10/04 , H04B10/02 , H04B10/06 , H04B10/14 , H04B10/18 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To secure a predetermined eye mask margin in an optical transmitter without depending on a transmission speed. SOLUTION: The optical transmitter includes a semiconductor laser drive circuit 1, and a semiconductor laser 4 for generating and outputting modulated laser light based on the modulation current of the semiconductor laser drive circuit 1. In the above optical transmitter, a phase difference adjustment circuit 2 is provided in the pre-stage of the semiconductor laser drive circuit 1, so as to reduce a phase difference produced between data signals. The phase difference adjustment circuit 2 includes an impedance control line 5, a resistor element 7 having a parasitic inductance component (or an inductor having a parasitic resistance component), and a DC cutoff capacitor 8. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了确保光发射机中的预定眼罩余量而不依赖于传输速度。解决方案：光发射机包括半导体激光器驱动电路1和半导体激光器4，用于基于半导体激光器驱动电路1的调制电流产生和输出调制激光。在上述光发射机中，相位差调整电路2设置在半导体激光器驱动电路1的前级，以便减少数据信号之间产生的相位差。相位差调节电路2包括阻抗控制线5，具有寄生电感分量（或具有寄生电阻分量的电感器）的电阻元件7和直流截止电容器8.（C）2005年， JPO＆NCIPI

5. 发明专利

JP2005191088A Package for semiconductor and semiconductor device 有权
标题翻译：半导体和半导体器件封装
公开(公告)号：JP2005191088A
公开(公告)日：2005-07-14
申请号：JP2003427766
申请日：2003-12-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SAKAI KIYOHIDE , ARIGA HIROSHI
IPC分类号： H01L23/02 , H01L23/04 , H01S5/022
CPC分类号： H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a package for a semiconductor using a conductive case at a low case, having a constitution within a range of the diameter of a reliable practical signal pin and the diameter of a through-hole, facilitating a connection with an external substrate, having excellent high-frequency transmission characteristics, and enabling a high-speed operation of 10 G bit/sec or more.
SOLUTION: The package for the semiconductor has a signal conductor composed of a field-through section having a characteristic impedance lower than one to be matched, a free running section A being electrically connected to the field-through section respectively from the inside and the outside of the package and having the characteristic impedance higher than the field-through section, and a high impedance section 52d.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种使用导电壳体的半导体的封装，其具有在可靠的实际信号引脚的直径范围内的结构和通孔的直径，便于与外部基板的连接，具有优异的高频传输特性，并且能够进行10G比特/秒以上的高速操作。解决方案：用于半导体的封装具有信号导体，该信号导体由具有低于1的特性阻抗的通过部分组成，自由运行部分A分别从内部电连接到通过部分和封装的外部，并且具有高于通过部分的特性阻抗，以及高阻抗部分52d。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2012255934A Optical wavelength converter 有权
标题翻译：光波长转换器
公开(公告)号：JP2012255934A
公开(公告)日：2012-12-27
申请号：JP2011129212
申请日：2011-06-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ARIGA HIROSHI , OHATA NOBUO
IPC分类号： G02F1/365 , G02F1/025 , G02F2/02
摘要： PROBLEM TO BE SOLVED: To obtain an optical wavelength converter capable of always achieving control for keeping an optimal working point with a simple configuration.SOLUTION: An optical wavelength converter comprises: a front-end semiconductor optical amplifier 5 for amplifying signal light; an optical demultiplexer 8a for splitting probe light into two; an optical multiplexer 6a for combining the signal light from the front-end semiconductor optical amplifier 5 with the probe light from the optical demultiplexer 8a; a semiconductor optical amplifier (SOA) 7 for amplifying the signal light and the probe light that are combined by the optical multiplexer 6a; a semiconductor optical amplifier (SOA) 9 for amplifying the probe light that is split by the optical demultiplexer 8a; an optical multiplexer 6b for combining light that is output from the SOAs 7 and 9, and outputting the combined light as wavelength converted light; an optical demultiplexer 8b for splitting the wavelength converted light into two; a photodiode 10 for outputting a current corresponding to average power of the wavelength converted light that is split by the optical demultiplexer 8b; and a front-end SOA control circuit 12 for controlling a bias current of the front-end semiconductor optical amplifier 5 so as to maximize a value of a current that is output from the photodiode 10.
摘要翻译：要解决的问题：获得能够始终实现以简单配置保持最佳工作点的控制的光学波长转换器。光波长转换器包括：用于放大信号光的前端半导体光放大器5; 用于将探测光分成两个的光解复用器8a; 用于将来自前端半导体光放大器5的信号光与来自光解复用器8a的探测光组合的光复用器6a; 用于放大由光复用器6a组合的信号光和探测光的半导体光放大器（SOA）7; 用于放大由光解复用器8a分离的探测光的半导体光放大器（SOA）9; 光复用器6b，用于组合从SOA 7和9输出的光，并输出组合的光作为波长转换的光; 用于将波长转换的光分成两个的光解复用器8b; 用于输出与由光解复用器8b分离的波长转换光的平均功率相对应的电流的光电二极管10; 以及前端SOA控制电路12，用于控制前端半导体光放大器5的偏置电流，以便最大化从光电二极管10输出的电流的值。（C）2013， JPO＆INPIT

7. 发明专利

JP2012108238A Optical modulation device 审中-公开
标题翻译：光学调制装置
公开(公告)号：JP2012108238A
公开(公告)日：2012-06-07
申请号：JP2010255794
申请日：2010-11-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UESUGI TOSHITSUGU , ARIGA HIROSHI
IPC分类号： G02F1/01 , G02F1/015 , G02F1/03
CPC分类号： G02F1/2255 , G02F2001/212
摘要： PROBLEM TO BE SOLVED: To obtain an optical modulation device with which the reflection of input electrical signals can be reduced over the broad band range.SOLUTION: An optical modulation device has an optical modulator 4 with an anode electrode 5, a conformity resistance 8, a first wire 3 connected to the anode electrode 5 and transmitting input electrical signals to the optical modulator 4 to the anode electrode 5, a first conductor pad 2 with capacitance connected to the first wire 3, a second wire 6 connecting the anode electrode 5 and the conformity resistance 8 and a second conductor pad 7 with capacitance connected to the second wire 6.
摘要翻译：要解决的问题：获得能够在宽带范围内减少输入电信号的反射的光调制装置。解决方案：光调制装置具有光电调制器4，其具有阳极电极5，一致性电阻8，连接到阳极电极5的第一布线3，并将输入电信号传输到光调制器4至阳极电极5 具有连接到第一导线3的电容的第一导体焊盘2，连接阳极电极5和一致性电阻8的第二导线6和具有连接到第二导线6的电容的第二导体焊盘7.版权所有： C）2012，JPO＆INPIT

8. 发明专利

JP2011181792A Light reception element carrier, and light reception module using the same 审中-公开
标题翻译：光接收元件载体和使用其的光接收模块
公开(公告)号：JP2011181792A
公开(公告)日：2011-09-15
申请号：JP2010046129
申请日：2010-03-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HORIGUCHI YUICHIRO , SUGIHARA KOHEI , SHIMAKURA YASUHISA , ARIGA HIROSHI
IPC分类号： H01L31/02
摘要： PROBLEM TO BE SOLVED: To provide a light reception element carrier connecting a three-dimensionally arranged elements or the like, and having a high-frequency transmission path excelling in high-frequency characteristics, in a light reception element carrier. SOLUTION: This light reception element carrier includes: a multilayered substrate formed into a block-like shape by laminating sheet-like dielectric materials; a light reception element 1 arranged on an element mounting surface 4a; a transmission path 6a formed on the element mounting surface 4a, having a part extending parallel to layers of the multilayered substrate, and connected to the light reception element 1; a GND pattern 7a formed in a region on the element mounting surface 4a excluding the transmission path 6a; a transmission path 6b formed on a boundary surface between layers of the multilayered substrates and connected to the transmission path 6a on the element mounting surface 4a; a plurality of GND patterns 7b formed on boundary surfaces on and under the boundary surface formed with the transmission path 6b and connected to the GND pattern 7a on the element mounting surface 4a; and through-holes 8 arranged adjacently to the transmission path 6a and connecting the respective GND patterns 7b to one another. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：在光接收元件载体中提供连接三维排列的元件等的光接收元件载体，并且具有优异的高频特性的高频传输路径。该光接收元件载体包括：通过层叠片状电介质材料而形成为块状的多层基板; 布置在元件安装表面4a上的光接收元件1; 形成在元件安装表面4a上的传输路径6a，其具有与多层基板的层平行延伸的部分并连接到光接收元件1; 形成在除了传输路径6a之外的元件安装表面4a上的区域中的GND图案7a; 形成在多层基板的层之间的边界表面上并连接到元件安装表面4a上的传输路径6a的传输路径6b; 形成在形成有传输路径6b并且连接到元件安装表面4a上的GND图案7a的边界表面上和下方的边界面上的多个GND图案7b; 以及与传输路径6a相邻布置并将相应的GND图案7b彼此连接的通孔8。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2009130263A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2009130263A
公开(公告)日：2009-06-11
申请号：JP2007306011
申请日：2007-11-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ARIGA HIROSHI
IPC分类号： H01S5/022
CPC分类号： H05K1/0243 , H01L2224/45144 , H01L2224/48091 , H01S5/02212 , H01S5/0427 , H01S5/06226 , H01S5/0683 , H05K1/116 , H05K1/147 , H05K1/189 , H05K3/3447 , H05K2201/0969 , H05K2201/09718 , H05K2201/10121 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an optical module that matches impedance of a signal pin with that of a signal line, even if an impedance matching circuit is not disposed therein. SOLUTION: In a region where a stem 4 and flexible substrate 16 face from the connecting portion of the signal pin 1 and signal line 19, a hollow portion 35 is formed, by allowing a ground conductor 18 positioned opposite to the signal line 19 to be removed. The size of the hollow portion 35 is determined so that the impedance of the signal pin 1 is matched with that of the signal line 19. COPYRIGHT: (C)2009,JPO&INPIT

10. 发明专利

JP2004303752A Semiconductor device and optical transceiver 审中-公开
公开(公告)号：JP2004303752A
公开(公告)日：2004-10-28
申请号：JP2003091258
申请日：2003-03-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMADA KAZUYOSHI , ARIGA HIROSHI
IPC分类号： H05K9/00
摘要： PROBLEM TO BE SOLVED: To obtain a shield structure of electromagnetic wave noise for restricting an electromagnetic interference between semiconductor components mounted on the same substrate surface.
SOLUTION: On the outer layer of a substrate touching a casing, an outer layer conductor pattern for isolating different semiconductor circuits, respectively, on the substrate surface is formed. The outer layer conductor pattern is connected with an inner layer conductor pattern through a plurality of vias, and the signal line of the semiconductor circuit is passed through a gap formed at a part of the outer layer conductor pattern. Consequently, an electromagnetic interference between semiconductor components mounted on the same substrate surface is restricted.
COPYRIGHT: (C)2005,JPO&NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式