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1. 发明专利

JP4785486B2 Method and apparatus for manufacturing a electronic device 有权
公开(公告)号：JP4785486B2
公开(公告)日：2011-10-05
申请号：JP2005290641
申请日：2005-10-04
申请人：セイコーインスツル株式会社
发明人：信治杉田 , 均竹内
IPC分类号： H01L21/60 , H01L21/50 , H05K3/34
CPC分类号： H01L24/81 , H01L24/75 , H01L24/97 , H01L2224/81191 , H01L2224/81805 , H01L2924/01322 , H01L2924/14 , H01L2924/351 , H01L2924/00

2. 发明专利

JP5078245B2 Dynamic quantity sensor 有权
公开(公告)号：JP5078245B2
公开(公告)日：2012-11-21
申请号：JP2005264607
申请日：2005-09-13
申请人：セイコーインスツル株式会社
发明人：武内山 , 光男鎗田 , 明江川 , 均竹内
IPC分类号： H01L29/84 , G01P15/08 , G01P15/125 , G01P15/18
摘要： PROBLEM TO BE SOLVED: To improve the shield effect of a detection unit. SOLUTION: An acceleration sensor consists of the detection unit, a silicon shielding substrate, and a base substrate. The detection unit is provided with a weight and a detection unit for detecting the posture change of the weight. The silicon shielding substrate comprises a recess which can fully include the detection unit. The silicon shielding substrate is provided with a signal-processing circuit which detects the posture change of the weight on the basis of the change of the constant of the detection unit, and furthermore, changes the detected posture change of the weight into the amount of dynamics. The base substrate is provided with a shield so as to close the opening of the recess of the silicon shielding substrate. The silicon shielding substrate and the base substrate are jointed via joint material. Further, the detection unit is electrically connected with the signal-processing circuit via the joint material. The detection unit with low tolerance to external noises can be shielded by the silicon shielding substrate and shielding unit. COPYRIGHT: (C)2007,JPO&INPIT

4. 发明专利

JP5305787B2 The method of manufacturing the electronic component package 有权
公开(公告)号：JP5305787B2
公开(公告)日：2013-10-02
申请号：JP2008218427
申请日：2008-08-27
申请人：セイコーインスツル株式会社
发明人：敬彦中村 , 恵二佐藤 , 均竹内 , 潔荒武 , 理志沼田
IPC分类号： H01L23/04
CPC分类号： H03H9/1021 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49165
摘要： An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

5. 发明专利

JP5642436B2 電子デバイス、電子機器及び電子デバイスの製造方法有权
标题翻译：用于制造电子设备，电子设备和电子设备的方法
公开(公告)号：JP5642436B2
公开(公告)日：2014-12-17
申请号：JP2010151096
申请日：2010-07-01
申请人：セイコーインスツル株式会社
发明人：中村　敬彦 , 敬彦中村 , 均竹内 , 均竹内 , 佐藤　恵二 , 恵二佐藤 , 潔荒武 , 潔荒武 , 理志沼田 , 理志沼田
IPC分类号： H01L23/04 , H01L41/047 , H01L41/053 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/23 , H01L41/29
CPC分类号： H01L24/97 , H01L2224/16225 , H01L2924/16152

6. 发明专利

JP5026295B2 Piezoelectric vibrator 有权
公开(公告)号：JP5026295B2
公开(公告)日：2012-09-12
申请号：JP2008018558
申请日：2008-01-30
申请人：セイコーインスツル株式会社
发明人：敬彦中村 , 恵二佐藤 , 保雄川田 , 理志沼田 , 均竹内
IPC分类号： H03H9/02 , H03H9/10

7. 发明专利

JP4743764B2 A method of manufacturing a semiconductor package 有权
标题翻译：空值
公开(公告)号：JP4743764B2
公开(公告)日：2011-08-10
申请号：JP2006022302
申请日：2006-01-31
申请人：セイコーインスツル株式会社
发明人：茂雄斉藤 , 均竹内
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31
CPC分类号： H01L24/97 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/838 , H01L2224/85 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/30105 , H01L2924/3025 , H01L2224/81 , H01L2224/83 , H01L2924/01022 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a small-sized semiconductor package that allows dissipating the heat generated in a semiconductor device further efficiently to the exterior without being affected even when soldering is implemented. SOLUTION: The semiconductor package 1 is provided with outer connection terminals 4 that are electrically connected to a semiconductor element 2 through electric connection sections 3; insulating layers 5 that coat in a thin film form the peripheries of the semiconductor element 2 and electrical connection sections 3 and also cover in a thin film form the peripheries of the outer connection terminals 4 at least near the electrical connection sections 3 to encapsulate the semiconductor element 2 in the interior; and a metal layer 6 provided to define a predetermined outer shape, while covering the peripheries of the insulating layers 5 to bury the insulating layers 5 in the interior, wherein the metal layer 6 is of a high melting-point metal material having a melting point higher than a low melting-point metal. A method of fabricating the semiconductor package 1 is also offered. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种小尺寸的半导体封装，其能够即使在实现焊接时也能够将半导体器件中产生的热量进一步有效地散发到外部而不受影响。解决方案：半导体封装1设置有通过电连接部分3电连接到半导体元件2的外连接端子4; 以薄膜形成的绝缘层5至少形成半导体元件2和电连接部分3的周边，并且还至少在电连接部分3附近以薄膜形式形成外部连接端子4的周边以将半导体元素2在内部; 以及设置成限定预定外形的金属层6，同时覆盖绝缘层5的周边以将绝缘层5埋在内部，其中金属层6是具有熔点的高熔点金属材料高于低熔点金属。还提供了制造半导体封装1的方法。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP4124681B2 A method of manufacturing a semiconductor device 有权
标题翻译：空值
公开(公告)号：JP4124681B2
公开(公告)日：2008-07-23
申请号：JP2003074340
申请日：2003-03-18
申请人：セイコーインスツル株式会社
发明人：恵二佐藤 , 朋之吉野 , 努松平 , 恵一郎林 , 均竹内
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/81 , H01L2224/13 , H01L2924/00012

10. 发明专利

JP5318685B2 Electronic components and a method of manufacturing the same 有权
公开(公告)号：JP5318685B2
公开(公告)日：2013-10-16
申请号：JP2009166481
申请日：2009-07-15
申请人：セイコーインスツル株式会社
发明人：恵二佐藤 , 均竹内 , 敬彦中村 , 潔荒武 , 理志沼田
IPC分类号： H01L23/04 , H01L23/08 , H01L23/12 , H01L23/14 , H01L23/15 , H03H3/02 , H03H9/02
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/16152 , H01L2924/181 , H01L2924/00014 , H01L2924/00012

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