专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP4934856B2 Signal transmission substrate 有权
公开(公告)号：JP4934856B2
公开(公告)日：2012-05-23
申请号：JP2007251156
申请日：2007-09-27
申请人：エルピーダメモリ株式会社 , 日本電気株式会社 , 株式会社日立超エル・エス・アイ・システムズ
发明人：隆中野 , 浩次松尾 , 洋二西尾 , 百合香青木
IPC分类号： H01P3/02 , H04L25/02 , H05K1/02
CPC分类号： H01P3/088 , H05K1/0245 , H05K1/0251 , H05K1/0298 , H05K2201/09236 , H05K2201/09627
摘要： A first signal wiring includes parts located in a first layer and parts located in a second layer. The parts located in the first layer are connected, at predetermined positions, to the parts located in the second layer. A second signal wiring includes parts that are located in the first layer and the total length of which is equal to that of the parts of the first signal wiring that are located in the first layer. The second signal wiring also includes parts that are located in the second layer and the total length of which is equal to that of the parts of the first signal wiring that are located in the second layer. The connecting positions of the second signal wiring at which the parts located in the first layer are connected to the parts located in the second layer are different from those of the first signal wiring.

2. 发明专利

JPWO2008133010A1 フィルタ回路素子及び電子回路装置审中-公开
公开(公告)号：JPWO2008133010A1
公开(公告)日：2010-07-22
申请号：JP2009511763
申请日：2008-04-09
申请人：日本電気株式会社 , エルピーダメモリ株式会社
发明人：中野　隆 , 隆中野 , 雅治今里 , 雅治今里 , 西尾　洋二 , 洋二西尾
IPC分类号： H01P1/205 , H01P1/203 , H01P1/213 , H01P3/08 , H05K3/46
CPC分类号： H01P1/20336 , H01P1/20363 , H05K1/0216 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K3/429 , H05K2201/09309 , H05K2201/09618 , H05K2201/09627
摘要：多層基板に複数のビアを隣接させて配置し、複数のビアの一方の外側の第1のビアは多層基板に設けられた第1の引き出し線とで電気的に接続され、他方の外側の第2のビアは多層基板に設けられた第2の引き出し線と電気的に接続され、複数のビアは多層基板の第1の固定電位層(例えばグランド層)と接続され、第1及び第2の引き出し線と固定電位層との間に、多層基板の内層として、複数のビアとクリアランスを介して、第1の固定電位層と同電位の、少なくとも1層の第2の固定電位層を設ける。これにより、多層基板上に余分な製造工程の追加無く、面積占有率の低いBPFを形成する。

3. 发明专利

JP3637903B2 Manufacturing method of a semiconductor circuit 有权
公开(公告)号：JP3637903B2
公开(公告)日：2005-04-13
申请号：JP2002170840
申请日：2002-06-12
申请人：日本電気株式会社
发明人：隆中野 , 弘和遠矢
IPC分类号： H01L23/12 , H01L21/822 , H01L23/495 , H01L23/522 , H01L23/64 , H01L27/04
CPC分类号： H01L23/5222 , H01L23/49589 , H01L23/642 , H01L24/49 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

4. 发明专利

JP5338627B2 Equivalent circuit creating apparatus of the circuit board, the equivalent circuit creation method, and its program 有权
公开(公告)号：JP5338627B2
公开(公告)日：2013-11-13
申请号：JP2009257544
申请日：2009-11-10
申请人：日本電気株式会社
发明人：隆中野
IPC分类号： G06F17/50 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To solve a problem wherein partitioning work takes time when the wiring density or a via density of a circuit board is high when partitioning circuit arrangement at the discretion of an operator, when performing the partitioning and calculating an equivalent circuit of the circuit board. SOLUTION: This equivalent circuit board creation device includes an equivalent circuit creation means 14 creating the equivalent circuit of the circuit board based on circuit arrangement information related to the circuit arrangement including circuit wiring lines, vias, solids, and slits constituting the circuit board. The equivalent circuit creation means 14 comprises: a via low density detection part 21 detecting an area having a low via density in the circuit arrangement information; a partitioning processing part 23 partitioning the circuit arrangement into a plurality of sections in the detected area having the low via density; a partial equivalent circuit creation processing part 16 creating an equivalent circuit of each circuit arrangement partitioned into the plurality of sections; and an equivalent circuit composition part 17 connecting and composing the plurality of created partial equivalent circuits in partitioned parts. COPYRIGHT: (C)2011,JPO&INPIT

5. 发明专利

JP4935071B2 Semiconductor circuit to which the line element and the line element 有权
公开(公告)号：JP4935071B2
公开(公告)日：2012-05-23
申请号：JP2005505001
申请日：2004-02-13
申请人：日本電気株式会社
发明人：隆中野 , 弘和遠矢
IPC分类号： H01L27/04 , H01L21/822 , H01L23/522 , H01L23/528
CPC分类号： H01L23/5222 , H01L23/5286 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A semiconductor circuit in which low impedance characteristics required for a decoupling circuit are ensured up to a band of several hundreds of MHz or above in the situation where digital circuits are rushing into GHz age, and a semiconductor circuit exhibiting low impedance characteristics even in a band of several hundreds of MHz or above. A line element comprising a power supply line and a ground line or a ground plane arranged oppositely through a dielectric, characterized in that a dielectric covering the line element is provided.

6. 发明专利

JP4678381B2 Power supply device 有权
公开(公告)号：JP4678381B2
公开(公告)日：2011-04-27
申请号：JP2007066671
申请日：2007-03-15
申请人：日本電気株式会社
发明人：隆中野
IPC分类号： H05K1/02

7. 发明专利

JP3906809B2 Line elements and semiconductor circuit 有权
公开(公告)号：JP3906809B2
公开(公告)日：2007-04-18
申请号：JP2003021220
申请日：2003-01-29
申请人：日本電気株式会社
发明人：隆中野 , 弘和遠矢
IPC分类号： H01L21/3205 , H01L21/822 , H01L23/52 , H01L23/522 , H01L23/64 , H01L27/04
CPC分类号： H01L23/5222 , H01L23/642 , H01L2924/0002 , H01L2924/3011 , H01L2924/00

8. 发明专利

JPWO2004073066A1 線路素子および線路素子を適用した半導体回路有权
公开(公告)号：JPWO2004073066A1
公开(公告)日：2006-06-01
申请号：JP2005505001
申请日：2004-02-13
申请人：日本電気株式会社
发明人：中野　隆 , 隆中野 , 遠矢　弘和 , 弘和遠矢
IPC分类号： H01L21/822 , H01L23/522 , H01L23/528 , H01L27/04
CPC分类号： H01L23/5222 , H01L23/5286 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要：デジタル回路がGHz時代に突入している状況の中、デカップリング回路に必要な低インピーダンス特性を数百MHzあるいはこれを超す帯域まで確保すること、また、数百MHz以上の帯域においても低インピーダンス特性を有する半導体回路を提供すること。電源配線と、グランド配線またはグランド面とが、誘電体を介して対向配置された線路素子であって、前記線路素子を覆う誘電体の覆いを設けたことを特徴とする。

9. 发明专利

JP3591633B2 Solid-state image sensing device 有权
公开(公告)号：JP3591633B2
公开(公告)日：2004-11-24
申请号：JP2000039937
申请日：2000-02-17
申请人：日本電気株式会社
发明人：隆中野
IPC分类号： H01L21/339 , H01L21/8236 , H01L27/088 , H01L29/762 , H04N5/335 , H04N5/369 , H04N5/374 , H04N5/3745 , H04N5/378

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式