基本信息:
- 专利标题： Signal transmission substrate
- 申请号：JP2007251156 申请日：2007-09-27
- 公开(公告)号：JP4934856B2 公开(公告)日：2012-05-23
- 发明人： 隆 中野 , 浩次 松尾 , 洋二 西尾 , 百合香 青木
- 申请人： エルピーダメモリ株式会社 , 日本電気株式会社 , 株式会社日立超エル・エス・アイ・システムズ
- 专利权人： エルピーダメモリ株式会社,日本電気株式会社,株式会社日立超エル・エス・アイ・システムズ
- 当前专利权人： エルピーダメモリ株式会社,日本電気株式会社,株式会社日立超エル・エス・アイ・システムズ
- 优先权： JP2007251156 2007-09-27
- 主分类号： H01P3/02
- IPC分类号： H01P3/02 ; H04L25/02 ; H05K1/02
摘要：
A first signal wiring includes parts located in a first layer and parts located in a second layer. The parts located in the first layer are connected, at predetermined positions, to the parts located in the second layer. A second signal wiring includes parts that are located in the first layer and the total length of which is equal to that of the parts of the first signal wiring that are located in the first layer. The second signal wiring also includes parts that are located in the second layer and the total length of which is equal to that of the parts of the first signal wiring that are located in the second layer. The connecting positions of the second signal wiring at which the parts located in the first layer are connected to the parts located in the second layer are different from those of the first signal wiring.
公开/授权文献:
- JP2009081378A Signal transmission substrate 公开/授权日：2009-04-16
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01P | 波导；谐振器、传输线或其他波导型器件 |
| ------H01P3/00 | 波导；波导型传输线 |
| --------H01P3/02 | .带有两个纵向导体的 |