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81. 发明专利

JP5372726B2 Circuit board and a method of manufacturing the same 有权
公开(公告)号：JP5372726B2
公开(公告)日：2013-12-18
申请号：JP2009290849
申请日：2009-12-22
申请人：ヴイアイエー・テクノロジーズ・インコーポレイテッド
发明人：宮振越
IPC分类号： H05K3/46
CPC分类号： H05K3/4007 , H01L2924/0002 , H05K3/0035 , H05K3/062 , H05K3/108 , H05K3/243 , H05K3/28 , H05K3/421 , H05K2201/0367 , H05K2201/0376 , H05K2201/09436 , H05K2201/09545 , H05K2203/0361 , H05K2203/0554 , H05K2203/0574 , H05K2203/1152 , H05K2203/308 , Y10T29/49117 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , H01L2924/00
摘要： A circuit substrate includes a base layer, a patterned conductive layer, a dielectric layer, an outer pad and a conductive block. The patterned conductive layer is disposed on the base layer and has an inner pad. The dielectric layer is disposed on the base layer and covers the patterned conductive layer. The outer pad is disposed on the dielectric layer. The conductive layer is passed through the dielectric layer and connected between the outer pad and the inner pad, wherein the outer pad and the conductive block are formed as an integrative unit, and an outer diameter of the outer pad is substantially equal to an outer diameter of the conductive block.

82. 发明专利

JP2013239604A Wiring board 有权
标题翻译：接线板
公开(公告)号：JP2013239604A
公开(公告)日：2013-11-28
申请号：JP2012112016
申请日：2012-05-16
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： NISHIDA TOMOHIRO , MORI SEIJI , WAKAZONO MAKOTO
IPC分类号： H05K3/28
CPC分类号： H05K3/28 , H01L21/563 , H05K1/11 , H05K3/3436 , H05K3/3452 , H05K2201/09881 , H05K2201/10977 , H05K2203/025 , H05K2203/0783
摘要： PROBLEM TO BE SOLVED: To obtain a wiring board capable of improving flowability of an underfill material filled in a gap between an electronic component and the wiring board.SOLUTION: A wiring board according to the present invention has a laminate on which one or more insulation layers and conductor layers are laminated. The wiring board comprises: plural connection terminals isolated from each other on the laminate; a filling member filled between the plural connection terminals, and contacting at least one part of each side face of the plural connection terminals; and a solder resist layer laminated on the laminate and having an opening for exposing the plural connection terminals. Surface roughness of the filling member is rougher than that of an upper face of the solder resist layer.
摘要翻译：要解决的问题：获得能够改善填充在电子部件和布线板之间的间隙中的底部填充材料的流动性的布线板。解决方案：根据本发明的布线板具有层压体，其上具有一个或多个绝缘体层和导体层被层压。布线板包括：在层压板上彼此隔离的多个连接端子; 填充部件，填充在所述多个连接端子之间，并且与所述多个连接端子的每个侧面的至少一部分接触; 以及层叠在所述层叠体上并具有用于使所述多个连接端子露出的开口的阻焊层。填充构件的表面粗糙度比阻焊层的上表面更粗糙。

83. 发明专利

JP5352470B2 Fever fabric and a method of manufacturing the same 有权
公开(公告)号：JP5352470B2
公开(公告)日：2013-11-27
申请号：JP2009542651
申请日：2007-12-20
申请人：コロングロテック,インコーポレイテッド
发明人：ミパク，スン , スチョ，カン , ヒチュン，キュン
IPC分类号： B32B5/02 , B32B7/02 , B32B27/12 , B32B27/18
CPC分类号： H05B3/342 , A41D31/0038 , D06N3/183 , D06N7/0092 , D06N2209/065 , D06N2209/105 , F28F21/00 , F28F2013/006 , F41H1/02 , F41H3/02 , F41H5/0471 , H05B2203/011 , H05B2203/013 , H05B2203/016 , H05B2203/017 , H05K1/038 , H05K1/095 , H05K3/1208 , H05K3/28 , H05K2201/09727 , Y10T442/2475 , Y10T442/2861
摘要： Disclosed herein is a heating fabric. The heating fabric according to the present invention comprises: a base layer composed of a synthetic, regenerated or natural fiber; a conductive layer formed on the base layer to be capable of being freely formed by a pre-designed electric pattern; a heating layer wholly or partially in contact with an upper surface, a lower surface, or the same surface thereof as a line or a surface; and an insulating layer formed on the conductive layer and the heating layer.

84. 发明专利

JP2013539197A Edge detection 有权
公开(公告)号：JP2013539197A
公开(公告)日：2013-10-17
申请号：JP2013512938
申请日：2011-06-03
申请人：プラスティックロジックリミテッド
发明人：リーデルデイビッド , リールステファン , コルテガ−カガラリナ
IPC分类号： H05K3/00 , G02F1/13
CPC分类号： H05K3/0011 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/5446 , H01L2223/5448 , H01L2924/0002 , H05K1/0269 , H05K1/189 , H05K3/0052 , H05K3/06 , H05K3/28 , H05K3/323 , H05K2201/0108 , H05K2201/09145 , H05K2201/09781 , H05K2201/09918 , H05K2201/10681 , H05K2203/0126 , H05K2203/0228 , H05K2203/1147 , H05K2203/166 , Y10T29/49155 , Y10T29/49789 , H01L2924/00
摘要：１つ以上の大きな基板から複数の小さな基板を、該小さな基板において所定の変動範囲内で様々なサイズが存在し得るようにできる縮小化プロセスによって形成することと、前記縮小化プロセスに先立って、前記１つ以上の大きな基板に１つ以上の検出マークを設けることと、を含んでおり、前記１つ以上の検出マークの大きさおよび位置が、前記縮小化プロセスの後に各々の小さな基板が前記１つ以上の検出マークのうちの少なくとも１つの検出マークの一部分を含むように選択され、該一部分が、前記小さな基板が前記変動範囲内のいかなる実際のサイズを有しても、前記小さな基板の１つ以上のエッジの少なくとも一部に一致する１つ以上のエッジを有する技法。
【選択図】図４

85. 发明专利

JP5222475B2 Inkjet curable resin composition, and a cured product and a printed wiring board using the same 有权
公开(公告)号：JP5222475B2
公开(公告)日：2013-06-26
申请号：JP2006552959
申请日：2006-01-12
申请人：太陽ホールディングス株式会社
发明人：滋宇敷 , 征智日馬 , 昇平槇田
IPC分类号： C08F220/02 , C08F222/40 , C08F226/06 , C09D11/00 , H05K3/28
CPC分类号： H05K3/285 , C08F226/02 , C08F236/20 , C09D11/101 , C09D11/30 , H05K3/28 , H05K2203/013

86. 发明专利

JP5188915B2 Wiring formation method 有权
公开(公告)号：JP5188915B2
公开(公告)日：2013-04-24
申请号：JP2008252775
申请日：2008-09-30
申请人：富士フイルム株式会社
发明人：斉逸井上
IPC分类号： H05K3/28 , H05K1/09 , H05K3/10 , H05K3/22 , H05K9/00
CPC分类号： H05K3/246 , H05K1/0256 , H05K1/036 , H05K3/0032 , H05K3/1208 , H05K3/125 , H05K3/28 , H05K2201/0116 , H05K2201/015 , H05K2201/0195 , H05K2201/0347 , H05K2201/0761 , H05K2201/0769 , H05K2201/09036 , H05K2201/09881 , H05K2203/013 , H05K2203/1147 , H05K2203/1173 , Y10T29/49155

87. 发明专利

JP5175779B2 A method of manufacturing a printed circuit board 有权
公开(公告)号：JP5175779B2
公开(公告)日：2013-04-03
申请号：JP2009068353
申请日：2009-03-19
申请人：日東電工株式会社
发明人：敬史竹村
IPC分类号： H05K3/28 , H05K3/00 , H05K3/18
CPC分类号： H05K3/108 , H05K1/056 , H05K3/007 , H05K3/0082 , H05K3/28 , H05K3/44 , H05K2201/0108 , H05K2201/0919 , H05K2203/0156 , H05K2203/0597

88. 发明专利

JP5173160B2 Multilayer wiring substrate and a method of manufacturing the same 有权
公开(公告)号：JP5173160B2
公开(公告)日：2013-03-27
申请号：JP2006194753
申请日：2006-07-14
申请人：新光電気工業株式会社
发明人：昌宏春原
IPC分类号： H01L23/12 , H05K3/46
CPC分类号： H05K3/467 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/5383 , H01L23/5384 , H01L2924/0002 , H05K3/28 , H05K3/4602 , H05K2201/0175 , H05K2201/0179 , H05K2201/0195 , H05K2201/09518 , H05K2203/1338 , H01L2924/00

89. 发明专利

JP5169696B2 Sealing device and a sealing structure 有权
公开(公告)号：JP5169696B2
公开(公告)日：2013-03-27
申请号：JP2008253566
申请日：2008-09-30
申请人： Nok株式会社
发明人：紘明金田 , 武司山田
IPC分类号： F16J15/10 , H01R12/59 , H01R13/74
CPC分类号： F16J15/064 , H01R13/6599 , H05K1/0215 , H05K1/0218 , H05K1/0393 , H05K3/28 , H05K3/325 , H05K9/0018 , H05K2201/0314 , H05K2201/0715 , H05K2201/0989 , H05K2203/1147

90. 发明专利

JP5151158B2 Package, and a semiconductor device using the package 有权
公开(公告)号：JP5151158B2
公开(公告)日：2013-02-27
申请号：JP2007013159
申请日：2007-01-23
申请人：富士通セミコンダクター株式会社
发明人：義浩久保田 , 史郎要田 , 和人辻
IPC分类号： H01L23/12
CPC分类号： H05K3/0052 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05624 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2224/73265 , H01L2224/85444 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20753 , H05K3/242 , H05K3/28 , H05K3/284 , H05K2201/0909 , H01L2924/00014 , H01L2924/0665 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.

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