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    • 84. 发明专利
    • JPH0412621B2
    • 1992-03-05
    • JP5570984
    • 1984-03-23
    • HITACHI LTD
    • TSUCHA MASATOSHISUWA MASATERUOONUKI HITOSHITAGUCHI KAZUOIIZUKA TOMIO
    • H01L21/60C22C21/00H01L23/49
    • PURPOSE:To obtain an aluminum alloy wire having high bonding strength and high corrosion-resisting property by a method wherein the second noble element having no solubility for Al and the third element having solubility for Al are contained in Al. CONSTITUTION:In order to improve the corrosion-resisting property of a corrosion-resisting Al alloy wire, the second noble element having no substantial solubility for Al is contained in Al. The second element consists of one or two kinds selected from the group of Au, Ni and Pd. Also, the third element having solubility for Al is added for the purpose of increasing the degree of hardness of a ball without impairing the corrosion-resisting property of the corrosion- resisting Al alloy wire. Said third element is the element which is selected from the group of Cu, Mg, Ti and Zr. As a result, the corrosion-resisting Al alloy wire having the hardness of Hv30 or above in the ball hardness in normal temperature can be obtained. Accordingly, high bonding strength and a high corrosion-resisting property can be obtained.
    • 85. 发明专利
    • JPH0412620B2
    • 1992-03-05
    • JP8336383
    • 1983-05-12
    • HITACHI LTD
    • OONUKI HITOSHISUWA MASATERUKOIZUMI MASAHIROKOBAYASHI MASAMICHI
    • C22C21/00H01L21/60H01L23/49
    • PURPOSE:To enable to increase the connecting strength of the titled ultrafine wire by a method wherein, when the Al pad on a semiconductor element and the external terminal of a lead frame are connected using a fused ball formed at the tip of an Al alloy ultrafine wire, the hardness when the ultrafine wire is formed into a fused ball is increased by 1.5 times of the hardness when pure Al is formed into a fused ball, thereby enabling to eliminate the exfoliation of the interface of a bonding part. CONSTITUTION:In the case of a resin sealed element, a voltage is applied between the tip of an Al alloy wire and an electrode, a fused ball is formed at the tip of a wire by discharging electricity. Then, the Al pad on the element and the lead frame which is the external terminal are connected by an Al alloy ball. According to this constitution, the hardness of the fused ball formed on the Al alloy wire is increased by 1.5 times of the hardness of the fused ball formed on pure Al wire. In order to accomplish the above purpose, 0.2-2% of a kind or a plurality of kinds of Si, Mg, Cr, Ti, P, Ca and the like are added to the Al alloy. Best result is obtained when 2% or thereabout of Mg is added.
    • 90. 发明专利
    • PLASMA CHEMICAL VAPOR DEPOSITION METHOD
    • JPS62103371A
    • 1987-05-13
    • JP24149085
    • 1985-10-30
    • HITACHI LTD
    • NIHEI MASAYASUCHIKAZAKI MITSUOSUWA MASATERUTAMAHASHI KUNIHIROISHIKAWA NORITOSHI
    • C23C16/50C23C16/515
    • PURPOSE:To form a laminar film, composite film and alloy film and to obtain a composite effect having optional characteristics by changing supply electric power impulsively, etc. thereby depositing films having different characteristics. CONSTITUTION:A continuous high-frequency signal is supplied from a high-frequency oscillator 14 to an initial stage high-frequency amplifier 9 and the signal programmed in a setting circuit is compared and amplified with the detection signal from a power detector 7 by a differential amplifier 10 in order to convert the above-mentioned signal to the impulsive low-frequency power or the high-frequency changing with time. The differential signal is supplied to the amplifier 9 which drives a high-frequency power amplifier 8 so as to obtain always the set power. The high-frequency is supplied via a matching circuit 2 to electrodes 4, 5 to generate glow discharge. More specifically, the peak power is changed periodically or with time to change the reaction and cracking of the gaseous raw material by plasma, by which the films having the different characteristics are successively deposited and the laminar film, composite film and alloy film are formed.