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    • 1. 发明专利
    • MULTIPLE-CHIP TYPE SEMICONDUCTOR DEVICE
    • JPH1098140A
    • 1998-04-14
    • JP25120296
    • 1996-09-24
    • HITACHI LTD
    • FUKUMAKI TAKASHISAKURAI IZUMIISHIKAWA NORITOSHIKODAMA HIRONORIINOUE KOICHI
    • H01L23/36H01L23/373
    • PROBLEM TO BE SOLVED: To improve the heat radiation effect and electric continuity by inserting an elastic multiple structure for absorbing the height dispersion between semiconductor chips which are different in height and heat radiating member and connecting the chips to the radiating member by a pressing force to contact them to one flat plate en bloc, without arranging their heights. SOLUTION: Semiconductor chips 1a, 1b, 1c, different in height are disposed on an Mo, W or Cu-C composite strain buffer board 2 having a thermal expansion coefficient equal to that of the semiconductor and mounted on a common collector electrode 3. On the semiconductor chips an Mo, W, or Cu-C composite strain buffer board 4, having a thermal expansion coefficient equal to that of the semiconductor, is disposed and covered with an elastic multiple structure 5 for absorbing steps. It is a double structure made of Cu pipes, such that the small-aperture pipe is inserted in the large-aperture one, made flat, with a center hollow space 6 formed in its contral part and connected to a common emitter electrode 7 thereon, allowing simultaneous connections to one common electrode.