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    • 61. 发明专利
    • Production of diamond thin film
    • 生产金刚石薄膜
    • JPS60195091A
    • 1985-10-03
    • JP4976884
    • 1984-03-15
    • Namiki Precision Jewel Co Ltd
    • WAKANA KAZUO
    • C30B25/04C30B25/02
    • C30B25/02C30B29/04
    • PURPOSE:To form a thin diamond film having excellent adhesivity to the substrate and high abrasion resistance and hardness, by using a diamond free from crystal defect as the substrate, and introducing a hydrocarbon into a plasma to effect the thermal decomposition of the hydrocarbon. CONSTITUTION:A diamond free from crystal defect (the shadow of the strain caused by the crystal defects such as lattice defects cannot be discerned by naked eyes through a polarizer such as a polaroid film or nicol prism) is used as a substrate. A mixture of hydrocarbon and hydrogen gas is introduced into a plasma to effect the thermal decomposition of the hydrocarbon and the epitaxial growth of a thin diamond film on the substrate. A thin diamond film having high abrasion resistance and hardness, excellent adhesivity to the substrate, and absolutely free of cracks and peeling can be produced by this process.
    • 目的:通过使用不含晶体缺陷的金刚石作为基材,通过使用将烃引入等离子体中以形成烃的热分解,形成对基材具有优异的粘合性和高耐磨性和硬度的薄金刚石膜。 构成:使用没有晶体缺陷的金刚石(由晶状体缺陷引起的应变的阴影不能通过诸如偏光镜的偏光镜或尼古棱棱镜被肉眼辨别)用作基板。 将烃和氢气的混合物引入等离子体中以实现烃的热分解和在衬底上的薄金刚石膜的外延生长。 通过该方法可以制造具有高耐磨性和硬度,对基材的粘合性优异且绝对没有裂纹和剥离的薄金刚石薄膜。
    • 62. 发明专利
    • SELECTIVE EPITAXIAL GROWTH METHOD
    • JPS6016420A
    • 1985-01-28
    • JP12523683
    • 1983-07-08
    • MITSUBISHI ELECTRIC CORP
    • HINE SHIROU
    • H01L21/205C30B25/04H01L21/20H01L21/311
    • PURPOSE:To eliminate generation of crystal defect at the periphery of semiconductor layer and obtain flat grown layer by providing an aperture through anisotropic dry etching and realizing epitaxial growth under a reduced pressure of at least 100Torr or less with the remaining film used as the mask, at the time of boring an aperture to an insulating film deposited on the surface of semiconductor substrate and forming a semiconductor layer by the epitaxial growth on the exposed substrate surface. CONSTITUTION:An SiO2 insulating film 2 is deposited on the surface of a semiconductor substrate 1, the area other than the specified region is covered with a resist film 3 by the photo-engraving method, and an aperture 6 is formed on the film 2 by the parallel flat plate type anisotropic dry etching apparatus with the mixed gas of CF4 and H2 used as the etchant. Then, the film 3 unwanted is removed and a semiconductor layer 7 is formed by the epitaxial growth method on the substrate 1 exposed to the aperture 6 under the reduced pressure condition. In this case, a mixed gas of H2 carrier gas and SiH2Cl2 is used, pressure is set to 100Torr or less and temperature is set to 900-1,100 deg.C for the epitaxial growth.