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    • 10. 发明专利
    • Group iii nitride semiconductor and substrate for growing group iii nitride semiconductor
    • 用于生长III族氮化物半导体的III族氮化物半导体和衬底
    • JP2012131705A
    • 2012-07-12
    • JP2012052557
    • 2012-03-09
    • Dowa Electronics Materials Co LtdDowaエレクトロニクス株式会社
    • TOBA RYUICHI
    • C30B29/38C30B25/04
    • PROBLEM TO BE SOLVED: To provide a group III nitride semiconductor where the dislocation density of the group III nitride semiconductor is further reduced and at the same time the time required for chemical lift-off is greatly shortened when a self-supporting substrate and a semiconductor element are produced.SOLUTION: The group III nitride semiconductor includes a pattern mask with a striped opening on an AlN template substrate where an AlN single crystal layer or a group III nitride single crystal layer including Al is formed at a thickness of 0.005 μm or more and 10 μm or less on the substrate, an AlN template substrate which is a nitrided sapphire substrate or an AlN single crystal substrate, a metal nitride layer formed in the opening and a group III nitride semiconductor layer being formed on the metal nitride layer, wherein the group III nitride semiconductor layer is a continuous film by ELO growth (epitaxial lateral overgrowth) where the metal nitride layer is a nucleus.
    • 要解决的问题:为了提供III族氮化物半导体,其中III族氮化物半导体的位错密度进一步降低,同时当自支撑衬底 并制造半导体元件。 解决方案:III族氮化物半导体包括在AlN模板衬底上具有条纹开口的图案掩模,其中AlN单晶层或包含Al的III族氮化物单晶层以0.005μm或更大的厚度形成, 10μm以下的AlN模板衬底,作为氮化蓝宝石衬底或AlN单晶衬底的AlN模板衬底,形成在开口中的金属氮化物层和形成在金属氮化物层上的III族氮化物半导体层,其中, III族氮化物半导体层是金属氮化物层为核的ELO生长(外延侧向生长)的连续膜。 版权所有(C)2012,JPO&INPIT