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51. 发明专利

JP2017529815A 大電力ケーブル用電界制御デバイス、および電界制御デバイスの製造方法有权
公开(公告)号：JP2017529815A
公开(公告)日：2017-10-05
申请号：JP2016567092
申请日：2014-08-22
申请人：アーベーベーシュヴァイツアクツィエンゲゼルシャフト , アーベーベーシュヴァイツアクツィエンゲゼルシャフト
发明人：フレードリクフェルテ， , フレードリクフェルテ， , マルクスサルツァー， , マルクスサルツァー， , サントッシュビーブィエムピー， , サントッシュビーブィエムピー， , フセインゴルバーニ， , フセインゴルバーニ，
IPC分类号： H02G15/064 , H01B9/02 , H01B13/00 , H01B17/58 , H01B17/64 , H02G1/14
CPC分类号： H02G15/068 , H01B7/18 , H01B7/28 , H01B19/04 , H02G1/14 , H02G1/145
摘要：本発明は、高電圧ケーブル(16)用電界制御デバイス(10、10a)に関する。電界制御デバイス(10、10a)は、ストレスコーン(12)と電界緩和アダプタ(13)とを備え、ストレスコーン(12)と電界緩和アダプタ(13)は、加硫によって化学的に結合される。また、本発明は、電力ケーブルおよび電界制御デバイス(10、10a)を備える電気設備、および電界制御デバイス(10、10a)を製作する方法に関する。【選択図】図5

52. 发明专利

JP2013509316A Electromagnetic interference protection body for the composite material 有权
公开(公告)号：JP2013509316A
公开(公告)日：2013-03-14
申请号：JP2012535929
申请日：2010-10-19
申请人：ヘクセルコンポジット、リミテッド
发明人：フィセット、エミリー , エリス、ジョン , マッケンジー、ポール
IPC分类号： B32B15/08 , B32B7/06 , B64C1/00 , B64D45/02 , H01B17/64
CPC分类号： B64D45/02 , B32B5/28 , B32B15/02 , B32B15/04 , B32B15/12 , B32B27/04 , B32B27/12 , B32B27/34 , B32B27/36 , B32B2605/18 , Y10T428/1438
摘要：硬化性の柔軟な電磁障害耐性積層体であって、積層体は、導電性金属材料の層及び熱硬化性樹脂を含み、積層体の第１の外面が、樹脂と接触する剥離可能な裏張りシートを備え、積層体の第２の外面が樹脂を備え、第２の外面が、第１の外面よりも、取り除かれる裏張りシートとの強い粘着力を有する、積層体。

53. 发明专利

JP3899830B2 Cable connection for the cold shrink tube and a rubber composition to be used to it 有权
标题翻译：空值
公开(公告)号：JP3899830B2
公开(公告)日：2007-03-28
申请号：JP2001056148
申请日：2001-03-01
申请人：日立電線株式会社
发明人：直文千綿 , 孝則山崎 , 有木部 , 清渡辺 , 和則鈴木
IPC分类号： B32B1/08 , H02G15/18 , B29C61/06 , B29K19/00 , B29L23/00 , B32B7/02 , B32B25/14 , C08K3/04 , C08K3/06 , C08K3/34 , C08K5/107 , C08K5/14 , C08L23/16 , C08L91/00 , H01B1/24 , H01B3/28 , H01B17/56 , H01B17/58 , H01B17/64 , H02G1/14 , H02G15/08

54. 发明专利

JP2006511915A Insulating parts and a manufacturing method thereof of the high-voltage device 有权
公开(公告)号：JP2006511915A
公开(公告)日：2006-04-06
申请号：JP2004564159
申请日：2003-11-21
申请人：シーメンスアクチエンゲゼルシヤフトSiemens Aktiengesellschaft
发明人：ツィールケ、エバーハルト
IPC分类号： H01B17/64 , H01H9/00 , H01H33/70
CPC分类号： H01H9/00 , H01B17/58 , H01H33/7069 , Y10T428/31504 , Y10T428/31544
摘要：本発明は、高電圧装置、特に高電圧用遮断器の、導電率を処理で変化させた少なくとも１つの構成成分（３）を含む絶縁部品（１）並びにその製造方法に関する。この処理は、例えば化学的又は機械的処理或いはα線、β線又はγ線等の高エネルギー放射線の照射により行う。本発明の絶縁部品（１）は、少なくとも一部が処理した構成成分（３）と処理しない構成成分（４）とからなっており、この結果絶縁部品（１）は大きな絶縁並びに機械的強度を示す。

55. 发明专利

JP3501366B2 Method of manufacturing an electronic device using vias filled conductive adhesives and it 有权
公开(公告)号：JP3501366B2
公开(公告)日：2004-03-02
申请号：JP2001044645
申请日：2001-02-21
申请人：インターナショナル・ビジネス・マシーンズ・コーポレーション
发明人：コンスタンティノス・パパトマス , サンパス・プルショサマン , ジェフリー・ドナルド・ジェローム , スン・クォン・カン
IPC分类号： C09J9/02 , C09J163/00 , C09J171/10 , C09J191/00 , C09J201/00 , H01B1/00 , H01B1/22 , H01B13/00 , H01B17/64
CPC分类号： H05K1/095 , C08K3/10 , C08L2666/54 , C09J163/00 , H01B1/22 , H05K3/4069 , H05K2201/0218 , H05K2203/0425
摘要： Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of thermosetting resins together with a flux resin selected for viscosity and low shrinkage, for screen printability, for electrical and for mechanical properties over a broad range of specification conditions. The vehicle or resin system includes thermosetting cyclo-aliphatic epoxy, thermosetting phenoxy polymer and thermosetting mono-functional limonene oxide. The low temperature melting coating system for the particles includes In, Sn, and alloys such as In-Sn, Sn-Pb, Bi-Sn-In and InAg. The micrometer diameter range particles includes Cu, Ni, Co, Ag, Pd, Pt, polymer and ceramic.

56. 发明专利

JP2002075099A RESIN BLOCK INSULATION SYSTEM 失效
公开(公告)号：JP2002075099A
公开(公告)日：2002-03-15
申请号：JP2000265842
申请日：2000-09-01
申请人： HITACHI LTD
发明人： TAKEUCHI RYOZO , KUSUKAWA JUNPEI , OHATA KOJI
IPC分类号： H01B17/64 , H01B17/66
摘要： PROBLEM TO BE SOLVED: To provide a memory system for an electric apparatus, which is easy to be dismantled, and materials of which can be separated and reused. SOLUTION: A high voltage portion is tightly covered with insulation blocks 1 like floored with tiles; and gaps between the blocks are sealed with a silicone viscous element, to prevent moisture from intruding and to improve the withstand voltage of the electric apparatus.

57. 发明专利

JP2001316183A DISCHARGE RESISTANT COMPOUND MATERIAL AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001316183A
公开(公告)日：2001-11-13
申请号：JP2001052473
申请日：2001-02-27
申请人： TOYOTA CENTRAL RES & DEV
发明人： YAMADA KATSUNORI , KAMIYA NOBUO , KATO TAKAYUKI
IPC分类号： C04B35/584 , C04B35/00 , C04B35/111 , C04B35/44 , C04B35/48 , C04B35/495 , H01B17/64
摘要： PROBLEM TO BE SOLVED: To provide a discharge resistant and high mechanical strength compound material and a manufacturing method of the same which is less prone to spark discharge caused by applied high voltage by making whole material homogeneous and realizing controlled prescribed electric resistance, on the other hand by utilizing electrifying effect such as corona discharge or frictional electrification, liquid or solid particle can be transmitted. SOLUTION: The compound material 1 consists of many insulation cells 11, and conductive grains 12. Between adjoining insulation cells 11, the conductive grain 12 disperses like three dimensional network structure and forms conductive paths. Let the grain diameter or size of insulation cell is R, and the grain diameter or size of the conductive grain is r. The relation between two symbols is realized as shown by the inequality;: r/R

58. 发明专利

JP2001291425A VIA FILLING CONDUCTIVE ADHESIVE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME 失效
公开(公告)号：JP2001291425A
公开(公告)日：2001-10-19
申请号：JP2001044645
申请日：2001-02-21
申请人： IBM
发明人： GELORME JEFFREY D , GANG SUN K , PAPATHOMAS KONSTANTINOS , PURUSHOTHAMAN SAMPATH
IPC分类号： C09J9/02 , C09J163/00 , C09J171/10 , C09J191/00 , C09J201/00 , H01B1/00 , H01B1/22 , H01B13/00 , H01B17/64
摘要： PROBLEM TO BE SOLVED: To provide a conductive adhesive having a wide property selective range by using micrometer size range particles of random size coated with a low-melting-point metal. SOLUTION: The coated particles are suspended in a vehicle consisting of a mixture of a thermosetting resin and a fusing agent resin selected for electrical and mechanical property in terms of viscosity, low contraction, screen printing ability and wide range specifications. The vehicle or resin system includes thermosetting alicyclic epoxy, thermosetting phenoxy polymer and thermosetting single-functional limonene oxide. A low-melting-point coating system for the particles contains In, Sn and In-Sn, Sn-Pb, Bi-Sn-In or InAg alloy. The micrometer size range particles contain Cu, Ni, Co, Ag, Pd, Pt, a polymer and a ceramic.

59. 发明专利

JP2001160434A ELECTRIC CONNECTOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001160434A
公开(公告)日：2001-06-12
申请号：JP34235099
申请日：1999-12-01
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R11/01 , H01B17/64 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an electric connector and its manufacturing method in which the damage to electric/electronic parts and circuit board is restrained and prevented, and the positioning is easily made so that the connecting reliability can be improved. SOLUTION: A molding frame 5 is disposed via a holder 6 between a circuit board 1 and an IC package 3 consisting of LGA, and an insulating elastomer layer 8 is built in the molding frame 5, and a plurality of conductive wires 9 are arranged and embedded in a row in the thickness direction of the elastomer layer 8, and respective conductive wires 9 are formed in nearly crank-arm shape. Then, the first contacts 10 to join to one end part of respective conductive wire 9 are plurally installed side by side respectively and the second contacts 13 to join to another end part of respective conductive wire 9 are plurally installed side by side respectively, and the material of conductive bonding agent 15 of each second contact 13 is decided as either soldering conductive resin that is prepared by adding a curing agent into a resin.

60. 发明专利

JP2001156411A MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001156411A
公开(公告)日：2001-06-08
申请号：JP33988399
申请日：1999-11-30
申请人： KYOCERA CORP
发明人： KIMURA TETSUYA , ONIZUKA KATSUHIKO
IPC分类号： H05K3/46 , H01B17/64 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board that achieves fine wiring and reduces the resistance of a conductor, and stably manufacture a metal foil and a glass ceramic forming body by simultaneous burning. SOLUTION: A green sheet where a porous wiring circuit layer made of a highly pure metal conductor with the content of a metal constituent being equal to or more than 99.5 wt.% is formed on the surface of the green sheet that is made of a glass ceramic composition, the lamination object is heated to a temperature equal to or lower than the melting point of the highly pure metal conductor, and the green sheet is sintered accompanying shrinkage in the x-y axial direction of the wiring circuit layer.

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