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1. 发明专利

JP2000113951A ELECTRIC CONNECTOR AND ITS MANUFACTURE 失效
公开(公告)号：JP2000113951A
公开(公告)日：2000-04-21
申请号：JP28627498
申请日：1998-10-08
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R11/01 , H01L23/32 , H01R33/76 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an electric connector capable of realizing good connection with low pressing force and to provide its manufacturing method. SOLUTION: This electric connector connecting the terminals 2 of a LGA surface mounted semiconductor package 1 and the terminals 4 of a circuit board 3 is provided with a bottomed angular tubular resin case 5, multiple layout holes 7 bored and molded at a fixed pitch on the bottom section of the resin case 5, insulating elastic contact blocks 8 inserted and fitted to the layout holes 7, and wires 9 buried in surface/back face thickness direction of the elastic contact blocks 8. Each wire 9 is bent into a crank shape in the surface/back face thickness direction of each elastic contact block 8, and both upper and lower end sections of the wire 9 are exposed from the surface and back face of the elastic contact block 8 respectively. Pressing force is applied to only multiple elastic contact blocks 8, thus the surface mount semiconductor package 1 and the circuit board 3 can be connected simply and rellably by slight pressure.

2. 发明专利

JPH11312566A CONNECTING SOCKET FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH11312566A
公开(公告)日：1999-11-09
申请号：JP11948898
申请日：1998-04-28
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a connecting socket which can be expected to reduce the number of part items, simplify and facilitate assembly operations, eliminate the possibility of malfunctioning and breaking of a semiconductor package due to heat, simplify the design of a board, and enhance high frequency characteristic. SOLUTION: A connecting socket has a contact member 8 which connects an electrode terminal 2 of a circuit board 1 to an electrode terminal 7 of a semiconductor package 5, a socket member 19 positioning and storing the semiconductor package 5, and a compressing member 25 which presses the contact member 8 against the electrode terminal 7 of the semiconductor package 5, the contact member 8 comprising a positioning plate 9 mounted on the circuit board 1 and an anisotropic conductive sheet 10 forming a part of the positioning plate 9. The anisotropic conducting sheet 10 is formed of a plurality of conducting wires 15 embedded therein, while penetrating the sheet 10 and bending and the conducting wires 15 connecting the electrode terminals 2, 7 to an insulating elastic sheet 14. The compression member 25 comprises a compressive projecting part 26 making contact with the semiconductor package 5 and a heat radiating part 27 which radiates heat generated from the semiconductor package 5.

3. 发明专利

JPH0967418A THERMOSETTING RESIN COMPOSITION, COMPOSITE MOLDED PRODUCT USING THE SAME AND COVER MEMBER FOR PUSH BUTTON 失效
公开(公告)号：JPH0967418A
公开(公告)日：1997-03-11
申请号：JP22347295
申请日：1995-08-31
申请人： SHINETSU POLYMER CO
发明人： NAKANO SADAO , IWAMA SUSUMU , KIYOZAWA MIKIO
IPC分类号： B32B25/08 , C08F283/01 , C08L61/20 , C08L61/28 , C08L63/00 , C08L67/06
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition comprising an unsaturated polyester resin, a vinylic monomer, an epoxy resin, a melamine resin, a radically reactive curing agent and an acidic catalyst in a specific ratio, and giving a cured resin product small in the contraction coefficient and excellent in transparency, coloration and mechanical strengths. SOLUTION: A thermosetting resin composition comprises (A) 100 pts.wt. of an unsaturated polyester resin such as an unsaturated isophthalate ester resin, (B) 20-50 pts.wt. of a vinylic monomer such as styrene, (C) 5-30 pts.wt. of an epoxy resin such as neopentylglycol diglycidyl ether, (E) 0.1-2 pts.wt. of a radically reactive curing agent such as a ketone peroxide, and (F) 0.1-2 pts.wt. of an acidic catalyst such as an aromatic sulfonic acid. A thermally cured resin layer obtained by curing the thermosetting resin composition is joined to a silicone rubber layer to obtain a composite molded product.

4. 发明专利

JP2020091337A 視野角制御シート、視野角制御方法、表示装置及びその製造方法审中-公开
公开(公告)号：JP2020091337A
公开(公告)日：2020-06-11
申请号：JP2018226799
申请日：2018-12-03
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU , TAKIZAWA NAOYA
IPC分类号： G02B5/00 , G02F1/1335
摘要：【課題】高精細な表示画面に取り付けることにより干渉縞の視認を抑制することが可能となる視野角制御シートを提供する。【解決手段】0.15mm以下の画素ピッチを有する表示装置の表示画面に取り付ける視野角制御シート(10)であって、光透過帯(2)と遮光帯(3)とが交互に繰り返して配置されているルーバー層(1)を備え、前記遮光帯のピッチが、前記画素ピッチの1.25倍以上である、視野角制御シート。前記表示画面に対する平面視で、前記遮光帯のピッチの方向と、前記画素ピッチの方向とがなす角が20°以下であることが好ましい。【選択図】図1

5. 发明专利

JPH10112516A IC PACKAGE 失效
公开(公告)号：JPH10112516A
公开(公告)日：1998-04-28
申请号：JP26584196
申请日：1996-10-07
申请人： SHINETSU POLYMER CO
发明人： YAMAZAKI KOICHI , IWAMA SUSUMU
IPC分类号： H01L21/60 , H01L23/12 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To fabricate even large and complicated shape products, without dispersion by fixing/adhering semiconductor elements to a flexible tape substrate through a sheet-like elastomer having little flatness dispersion. SOLUTION: After forming a flexible tape substrate 3, a partially precipitated sheet-like elastomer 4 having little flatness dispersion is adhered to semiconductor elements 2, instead of the metal mask printing of the elastomer. The elastomer 4 pref. has adhesive layers on both sides of a partially precipitated and hardened sheet or one or each side of this sheet is made of an unvulcanized material. After fixing the elements 2 to the substrate 3, it is preferable to be vulcanized to adhere and package, thus forming an IC package having a complicated structure such as frame shape or large shape.

6. 发明专利

JPH1022033A MANUFACTURE OF PRESSURE TYPE CONNECTOR 失效
公开(公告)号：JPH1022033A
公开(公告)日：1998-01-23
申请号：JP17629696
申请日：1996-07-05
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R43/00
摘要： PROBLEM TO BE SOLVED: To manufacture a pressure type connector with small contact resistance in connection efficiently by winding an insulated wire body on a drum type nonexpansion base helically, by laying several sheets of obtained sheet obliquely and by cutting them into a fixed width. SOLUTION: Adhesive or an adhesive layer 5 is coated and formed on a nonexpansion base 4 which is consisted of polyethylene terephthalate wound on a drum 6. Then, an insulated wire body 3 which is consisted of an insulated coating conductive wire is moved relatively to an axial direction to wind helically, while this drum 6 is being rotated. An obtained wound body 7 is separated from the drum 6 for expansion. Several sheets of one-layer sheet 8 which is obtained in this process are layered so that the wire body 3 can be parallel each other to make a small block. Then, several small blocks are layered in an oblique direction to a layered surface. This layered block is cut in parallel and in a fixed width across the wire body to obtain a pressure type connector.

7. 发明专利

JP2002008810A ELECTRICAL CONNECTOR 失效
公开(公告)号：JP2002008810A
公开(公告)日：2002-01-11
申请号：JP2000183566
申请日：2000-06-19
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： G01R31/26 , G01R1/073 , H01R13/24 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide an electrical connector capable of suppressing and preventing worsening of a crosstalk characteristic and suppressing a connection load to a low value. SOLUTION: In this electrical connector, a plurality of connection pieces 4 are supported on an insulating hold plate 1, and a plurality of slit holes 2 are drilled and formed by arranging them at a predetermined interval on the hold plate 1. Moreover, each connection piece 4 consists of an insulating elastic body 5 formed to have a substantially half oval cross section and supported by passing through each slit hole 2 and a plurality of groups 6 of metallic thin wires arranged at a predetermined interval in the longitudinal direction of the elastic body 5, wound on substantially curved surface of the elastic body 5, and having a U-shape. Both of up and down end parts of the elastic body 5 protrude from both of a surface and a rear surface of the hold plate 1, respectively, and both of up and down end parts of each group 6 of metallic thin wires are exposed from both of the surface and rear surface of the hold plate 1, respectively. Since a plurality of groups 6 of metallic thin wires are arranged in parallel and are wound to correspond to a plurality of electrodes 31, 21 of a semiconductor package 30 and a circuit printed wiring board 20 for inspection, an unnecessary metallic thin wire 7 does not exist between the semiconductor package 30 and the circuit printed wiring board 20 for inspection.

8. 发明专利

JP2001351708A ELECTRICAL CONNECTOR 失效
公开(公告)号：JP2001351708A
公开(公告)日：2001-12-21
申请号：JP2000170811
申请日：2000-06-07
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R11/01 , H01L23/32 , H01R33/76 , H01R12/16
摘要： PROBLEM TO BE SOLVED: To provide an electric connector capable of providing a relatively large amount of compression with a small load, while inhibiting or preventing deterioration of high frequency transmission characteristic and limiting a decrease in the range of permissible amounts of compression. SOLUTION: A group 4 of elastically deformable connecting elements are aligned and supported, while they are passed through a retaining plate 1, with the upper and lower ends of the group 4 protruding respectively from the front and back faces of the retaining plate 1. The connecting elements 5 of the group 4 are isolated from one another, each connecting element 5 comprising an insulating columnar elastic body 6 passing through the retaining plate 1, and a plurality of axially extending metallic filaments 7 approximately spirally built into the elastic body 6, with the upper and lower ends of each filament 7 protruding respectively from the upper and lower end faces of the body 6. Because both ends of each element 5 protrude from the plate 1, compression load concentrates on each element 5 of compression time, whereby a large amount of compression can be obtained readily high a small load.

9. 发明专利

JP2001160434A ELECTRIC CONNECTOR AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001160434A
公开(公告)日：2001-06-12
申请号：JP34235099
申请日：1999-12-01
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R11/01 , H01B17/64 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an electric connector and its manufacturing method in which the damage to electric/electronic parts and circuit board is restrained and prevented, and the positioning is easily made so that the connecting reliability can be improved. SOLUTION: A molding frame 5 is disposed via a holder 6 between a circuit board 1 and an IC package 3 consisting of LGA, and an insulating elastomer layer 8 is built in the molding frame 5, and a plurality of conductive wires 9 are arranged and embedded in a row in the thickness direction of the elastomer layer 8, and respective conductive wires 9 are formed in nearly crank-arm shape. Then, the first contacts 10 to join to one end part of respective conductive wire 9 are plurally installed side by side respectively and the second contacts 13 to join to another end part of respective conductive wire 9 are plurally installed side by side respectively, and the material of conductive bonding agent 15 of each second contact 13 is decided as either soldering conductive resin that is prepared by adding a curing agent into a resin.

10. 发明专利

JP2000331726A ELECTRICAL CONNECTOR 失效
公开(公告)号：JP2000331726A
公开(公告)日：2000-11-30
申请号：JP13774499
申请日：1999-05-18
申请人： SHINETSU POLYMER CO
发明人： IWAMA SUSUMU
IPC分类号： H01R11/01 , G03G21/00
摘要： PROBLEM TO BE SOLVED: To provide an electric connector, capable of improving in connection reliability by simplifying positioning and providing good conductivity by preventing bending and breakage of an electrically joining object, even when pressing force is increased. SOLUTION: This electrical connector comprises an elastic insulating sheet 4 of Shore A hardness of 10-70 deg. H interposed between a circuit substrate 6 and a surface type LSI 8, a plurality of wires 2 buried in the vertical directions of the elastic insulating sheet 4 and mutually separated with a certain pitch, and a contact 5 of a thickness of 50-500 μm attached on front and rear surfaces of the elastic insulating sheet 4, by using conductive polymer material formed by dispersing conductive filler to a polymer elastic body, connected with upper and lower end parts of each of the wires 2 exposed from the front and rear surfaces of the elastic insulating sheet 4, and contacting with each of a plurality of electrode terminals 7, 9 of the circuit substrate 6 and the surface mounting type LSI 8. Because the of the contact 5 of the wire 2 is large, positioning is facilitated, even when the electrode terminal 9 is small like a ball electrode and the like, so that improvement in connection reliability can be expected.

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