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1. 发明专利

JP2008060131A Wiring board and manufacturing method thereof 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2008060131A
公开(公告)日：2008-03-13
申请号：JP2006232017
申请日：2006-08-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA
IPC分类号： H01L23/13 , H01L23/12 , H05K1/02 , H05K3/12 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To provide a wiring board having no short circuit/disconnection in a minute wiring circuit layer, and excellent in bondability with an insulating substrate and electric characteristics.
SOLUTION: The wiring board 1 is provided with an insulating substrate 3 made of glass ceramics, and a wiring circuit 5 disposed on at least any one of the surface or inside of the insulating substrate 3. The wiring circuit 5 is configured by integrating a sintered metal 5b with metal foils 5a disposed on both side surfaces of the sintered metal 5b.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在微小布线电路层中没有短路/断开的布线板，并且与绝缘基板的电连接性和电特性优异。解决方案：布线板1设置有由玻璃陶瓷制成的绝缘基板3和设置在绝缘基板3的表面或内部的至少任一个上的布线电路5.布线电路5由将烧结金属5b与设置在烧结金属5b的两侧表面上的金属箔5a集成。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007288070A Wiring substrate, and method of manufacturing wiring board 审中-公开
标题翻译：接线基板和制造接线板的方法
公开(公告)号：JP2007288070A
公开(公告)日：2007-11-01
申请号：JP2006116182
申请日：2006-04-19
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , YONEKURA HIDETO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring substrate which is free from bulging in a wring circuit layer and excellent in visual appearance and coplanarity, and to provide a method of manufacturing the same. SOLUTION: The multilayer wiring substrate 2 comprises an insulating substrate 6 composed of a glass-ceramics having a degree of crystallinity of 70 mass% or lower and containing boron, and a wiring circuit layer 5 formed on a surface of the insulating substrate 6. The wiring circuit layer 5 has a weight per unit square meter with respect to the surface facing the insulating substrate 6 of 0.24 kg or more and 1.02 kg or less. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种布线基板，其在拧紧电路层中没有凸起，并且具有优异的外观和共面性，并且提供其制造方法。解决方案：多层布线基板2包括由结晶度为70质量％以下并含有硼的玻璃陶瓷构成的绝缘基板6和形成在绝缘基板的表面上的布线电路层5 布线电路层5相对于绝缘基板6的表面的单位面积重量为0.24kg以上且1.02kg以下。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007273602A Wiring board for light emitting element, and light emitting device 审中-公开
标题翻译：发光元件接线板及发光装置
公开(公告)号：JP2007273602A
公开(公告)日：2007-10-18
申请号：JP2006095500
申请日：2006-03-30
申请人： Kyocera Corp , 京セラ株式会社
发明人： HASEGAWA TOMOHIDE , KIMURA TETSUYA
IPC分类号： H01L33/64 , H01L33/46 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for use of a light emitting element capable of improving efficiency in extracting light, and to provide a light emitting device with a large light emission quantity.
SOLUTION: An element mounting part 6 for mounting the light emitting element 3 is provided on an insulative substrate 4. The mounting part 6 consists of an element mounting part body 19 to be placed on the substrate 4 and a protrusion 14 connecting with the body 19 and protruding in a tapered manner in the thickness direction Z from one surface 13 in the thickness direction Z of the substrate 4. The light emitting element 3 is mounted on a mounting surface 15 at the tip in the thickness direction Z of the protrusion 14 via a second joint 26. An area of the surface 15 is selected to be equal to an area of a packaging surface 20 facing the protrusion 14 of the element 3.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种能够提高提取光的效率的发光元件的配线基板，提供发光量大的发光元件。解决方案：用于安装发光元件3的元件安装部6设置在绝缘基板4上。安装部6由放置在基板4上的元件安装部件主体19和与基板4连接的突起14 主体19在基板4的厚度方向Z上从一个表面13在厚度方向Z上以锥形的方式突出。发光元件3安装在基板4的厚度方向Z上的尖端处的安装表面15上突起14经由第二接头26.表面15的区域被选择为等于面向元件3的突起14的包装表面20的面积。（C）2008，JPO和INPIT

4. 发明专利

JP2006128265A Wiring board for light emitting element and light emitting device 审中-公开
标题翻译：用于发光元件和发光装置的接线板
公开(公告)号：JP2006128265A
公开(公告)日：2006-05-18
申请号：JP2004312159
申请日：2004-10-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： TERAO SHINYA , KIMURA TETSUYA , HASEGAWA TOMOHIDE , IZUMI MINAKO
IPC分类号： H01L33/62 , H01L33/64 , H05K1/02
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for a light emitting element which is superior in heat dissipation and mounting reliability, and a light emitting device. SOLUTION: The wiring board 11 for a light emitting element is provided with a plate-like insulating substrate 1, a through hole 2 penetrating the insulating substrate 1, conductor layers 3, 5 and 7 which are formed at least on the surface or in the inside of the insulating substrate 1, and a mounting part 10 wherein a light emitting element 21 is mounted on one main surface 1a of the insulating substrate 1. A metallic body 8 which is higher in thermal conductivity than the insulating substrate 1 and has a different thermal expansion coefficient from the insulating substrate 1 is inserted into the through hole 2 formed in the insulating substrate 1, and the metallic body 8 is substantially separated from the wall surface of the through hole 2. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供散热和安装可靠性优异的发光元件用配线基板和发光装置。解决方案：用于发光元件的布线板11设置有板状绝缘基板1，穿透绝缘基板1的通孔2，至少形成在表面上的导体层3,5和7 或绝缘基板1的内部，以及安装部10，其中发光元件21安装在绝缘基板1的一个主表面1a上。与绝缘基板1相比热导率高的金属体8和具有不同的热膨胀系数，绝缘基板1被插入到形成在绝缘基板1中的通孔2中，并且金属体8与通孔2的壁面基本上分离。版权所有（C））2006，JPO＆NCIPI

5. 发明专利

JP2006066519A Wiring circuit board for light-emitting element and the light-emitting device 审中-公开
标题翻译：用于发光元件和发光装置的接线电路板
公开(公告)号：JP2006066519A
公开(公告)日：2006-03-09
申请号：JP2004245507
申请日：2004-08-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , HASEGAWA TOMOHIDE , IZUMI MINAKO
IPC分类号： H01L33/44 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board for light emitting-element that is excellent in heat radiating property and mounting reliability, and to provide a light-emitting device.
SOLUTION: The wiring circuit board for light-emitting element 11 is provided with at least a plate-shaped main body 1, a through hole 2 formed through the body 1, and conductor layers 3, 5, and 7 formed at least either one of the surface and inside of the body 1. The wiring circuit board is also provided with a mounting section 9 for mounting a light-emitting element 21 on one main surface 1a of the body 1. A metallic body 8, having heat conductivity higher than that of the body 1 and a relative density of ≥99.8% with respect to the theoretical specific gravity, is inserted into the through hole 2 formed in the body 1 and jointed to the body 1.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决方案：提供散热性和安装可靠性优异的发光元件用配线电路基板，提供发光元件。解决方案：发光元件11的布线电路板至少设置有板状主体1，穿过主体1形成的通孔2，至少形成导体层3,5和7 主体1的表面和内部之一。布线电路板还设置有用于将发光元件21安装在主体1的一个主表面1a上的安装部分9.具有导热性的金属体8 高于主体1的相对密度，相对于理论比重的相对密度为≥99.8％，被插入到形成在主体1中的通孔2中，并连接到主体1上。（C） 2006年，JPO＆NCIPI

6. 发明专利

JP2005340305A Composite body and its manufacturing method, and method of manufacturing multilayered component 审中-公开
标题翻译：复合体及其制造方法和制造多层组件的方法
公开(公告)号：JP2005340305A
公开(公告)日：2005-12-08
申请号：JP2004153919
申请日：2004-05-24
申请人： Kyocera Corp , 京セラ株式会社
发明人： YAMAMOTO KOJI , FUKAMIZU NORIMITSU , KIMURA TETSUYA , IRYO TSUTAE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite body and multilayered component by which defective lamination (delamination) can be suppressed in a multilayered body of thin layer green sheets, and hence the reliability of a wiring board can be improved.
SOLUTION: A composite layer 7 consisting of a photosensitive ceramic layer 3 containing at least inorganic powder and photosensitive resin, and a conductor 5 is formed on a support plate 1 having a light transmission rate of 12% or above when exposed at 100 mJ with a mercury lamp as a light source.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造复合体和多层部件的方法，其中薄层生片的多层体中可以抑制不良的层压（分层），因此布线板的可靠性可以是改进。解决方案：当曝光于100时，在透光率为12％以上的支撑板1上形成由至少含有无机粉末和感光性树脂的感光性陶瓷层3和导体5构成的复合层7 mJ用水银灯作为光源。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005332940A Complex, method for manufacturing complex, compound sheet, lamination and method for manufacturing lamination components 有权
标题翻译：复合材料，制造复合材料的方法，化合物薄片，层压和制造层压组件的方法
公开(公告)号：JP2005332940A
公开(公告)日：2005-12-02
申请号：JP2004149286
申请日：2004-05-19
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , FUKAMIZU NORIMITSU , YAMAMOTO KOJI , IRYO TSUTAE
IPC分类号： H05K3/20 , H05K3/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a complex, a method for manufacturing a complex, a compound sheet, a lamination and a method for manufacturing lamination components for quickly and easily forming a fine conductor, and for suppressing a lamination failure(delamination) in the lamination of a thin layer green sheet, and for improving the reliability of a wiring board. SOLUTION: A supporting plate 25 formed with a hydrophilic part 23a and hydrophobic part 23b on at least one main surface is prepared, and conductor slurry 28a containing at least metallic powder and one of hydrophilic solvent or hydrophobic solvent is applied to the main surface of the supporting plate 25 so that a conductor 29 can be formed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：提供复合物，复合物的制造方法，复合片材，层压体和用于制造用于快速且容易地形成细导体的层压部件的方法，以及用于抑制层压失效（分层），并且用于提高布线板的可靠性。解决方案：制备在至少一个主表面上形成有亲水部分23a和疏水部分23b的支撑板25，并且至少包含金属粉末和亲水溶剂或疏水性溶剂之一的导体浆料28a施加到主体支撑板25的表面，从而可以形成导体29。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005217051A Complex sheet, laminated part, and manufacturing method 审中-公开
标题翻译：复合片，层压件和制造方法
公开(公告)号：JP2005217051A
公开(公告)日：2005-08-11
申请号：JP2004020274
申请日：2004-01-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： TATENO SHUICHI , FUKAMIZU NORIMITSU , KIMURA TETSUYA , YAMAMOTO KOJI
IPC分类号： B32B27/04 , H05K1/11 , H05K3/00 , H05K3/20 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a complex sheet capable of satisfying needs for decreasing insulating layer thickness and for increasing wiring conductor layer thickness simultaneously, of simplifying and shortening the conductor layer process, and of suppressing the occurrence of dispersion of thickness due to difference in conductor layer dimensions and areas; to provide a method for manufacturing the same; and to provide a laminated part and its manufacturing method. SOLUTION: The complex sheet A comprises a photosetting ceramic layer 1a comprising a complex material containing at least a ceramic powder and a photosetting resin, and a conductor pattern layer 3a containing at least a metal powder and an organic binder and formed penetrating through a part of the photosetting ceramic layer 1a. The conductor pattern layer 3a and the photosetting ceramic layer 1a are similar in thickness to each other. The dimension of the conductor pattern layer 3a is measured on one main surface and on the other main surface, where the quotient obtained by dividing the larger dimension 3a-L by the shorter dimension 3a-S is ≤1.25. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够满足降低绝缘层厚度和同时增加布线导体层厚度的需要的复合片，简化和缩短导体层工艺，并且抑制厚度的分散发生导体层尺寸和面积的差异; 提供其制造方法; 并提供层压部件及其制造方法。解决方案：复合片材A包括包含至少含有陶瓷粉末和光固化树脂的复合材料的光固化陶瓷层1a和至少含有金属粉末和有机粘合剂并形成为穿透的导体图案层3a 光固化陶瓷层1a的一部分。导体图案层3a和光固化陶瓷层1a的厚度彼此相似。在一个主表面和另一个主表面上测量导体图案层3a的尺寸，其中通过将较大尺寸3a-L除以较短尺寸3a-S而获得的商≤1.25。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005205875A Composite sheet and laminated component, and their manufacturing method 审中-公开
标题翻译：复合板和层压组件及其制造方法
公开(公告)号：JP2005205875A
公开(公告)日：2005-08-04
申请号：JP2004156195
申请日：2004-05-26
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , FUKAMIZU NORIMITSU , YAMAMOTO KOJI , IRYO TSUTAE , TATENO SHUICHI , YAMAMOTO SENTARO , NAKAZAWA HIDEJI
IPC分类号： B28B1/00 , B28B1/30 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a composite sheet and a laminated component without causing elongation, deformation, tear or the like of a green sheet, capable of satisfying thinly layering of a layer thickness of the green sheet and thick layering of a conductor and excellent in binder removal characteristics even if a thinly layered green sheet is used, and its manufacturing method. SOLUTION: The composite sheet 30a in which the conductor 13 formed of metal foil 13 and having a thickness approximately same as the thickness of the green sheet 1 is buried in the green sheet 1 including at least an inorganic powder, a bonding resin and a primary photosensitive resin so as to expose both principal planes of the conductor 13 is characterized by containing the primary photosensitive resin so as to decrease from one principal plane 1a toward the other principal plane 1b of the composite sheet 30a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供复合片材和层压部件，不会引起生片的伸长，变形，撕裂等，能够满足生片的层厚度的薄层化和厚层的厚层化导体，即使使用薄层状的生片也具有优异的粘合剂除去特性及其制造方法。解决方案：将金属箔13形成的厚度与生片1的厚度大致相同的复合片30a埋设在至少包含无机粉末的生片1中，接合树脂以及使导电体13的两个主面露出的主感光性树脂的特征在于，含有一次感光性树脂，从复合片材30a的一个主面1a向另一个主面1b减少。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004152903A Method of manufacturing multilayer wiring substrate 审中-公开
公开(公告)号：JP2004152903A
公开(公告)日：2004-05-27
申请号：JP2002314959
申请日：2002-10-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： KIMURA TETSUYA , HAMANO SATOSHI
IPC分类号： C04B41/88 , H01L23/12 , H05K3/20 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To eliminate failure when transferring a wiring circuit layer and suppress delamination of the wiring circuit layer even after baking in the process that the wiring circuit layer is formed with the transfer from a transfer sheet to the surface of a ceramic green sheet. SOLUTION: A multilayer wiring substrate can be manufactured by preparing a transfer sheet 4 which is configured by forming the wiring circuit layer consisting of a metal foil on the surface of the transfer sheet 4, transferring and forming the wiring circuit layer 3 to the surface of a ceramic green sheet 1 from the transfer sheet 4, laminating a plurality layers of the green sheet 1, and baking the wiring circuit layer 3 at the temperature lower than the melting point of a metal used to form the wiring circuit layer 3. In this method, after the surface of the wiring circuit layer 3 on the transfer sheet 4 is irradiated with the plasma, a pattern is transferred to the surface of the green sheet 1. COPYRIGHT: (C)2004,JPO

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