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    • 52. 发明专利
    • Bulk acoustic resonator and manufacturing method thereof
    • 大容量声学谐振器及其制造方法
    • JP2007020164A
    • 2007-01-25
    • JP2006176236
    • 2006-06-27
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • JUNG KYU-DONGKWON JONG-OHKIM WOON-BAESO INSO
    • H03H9/17H01L41/09H01L41/187H01L41/22H03H3/02
    • H03H9/173H03H3/02H03H9/174H03H2003/021H03H2003/023
    • PROBLEM TO BE SOLVED: To provide a bulk acoustic resonator with a high degree of freedom of processes. SOLUTION: The bulk acoustic resonator includes: a substrate to a prescribed region of an upper surface of which a cavity part is formed; a resonator part on one side of which dimples are formed; and an anchor part for connecting the resonator part and the substrate. The resonance part includes: a lower electrode the prescribed region of the lower part surface of which is inwardly recessed; a lower electrode the upper surface corresponding to the recessed region of which is outwardly projected; a piezoelectric layer laminated on the upper surface of the lower electrode; and an upper electrode laminated on the piezoelectric layer. The dimples can be formed to the resonator part and the position and the area of each dimple can be optionally selected by a manufacturer. Since the vibrating direction of the resonance part is adjusted by a method of adjusting the number, the position and the area or the like of each dimple, the process flexibility is increased. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供具有高自由度的体积声谐振器。 解决方案:体声波谐振器包括:基板,其上表面的规定区域形成有空腔部分; 在其一侧形成凹坑的谐振器部分; 以及用于连接谐振器部分和基板的锚固部分。 共振部包括:下部电极,其下部表面的规定区域向内凹入; 下电极,其上表面对应于其凹陷区域向外突出; 层压在下电极的上表面上的压电层; 和层叠在压电体层上的上部电极。 凹坑可以形成到谐振器部分,并且每个凹坑的位置和面积可以由制造商任选地选择。 由于通过调整每个凹坑的数量,位置和面积等的方法来调节共振部件的振动方向,因此加工灵活性增加。 版权所有(C)2007,JPO&INPIT
    • 56. 发明专利
    • Method of manufacturing resonator
    • 制造谐振器的方法
    • JP2005311912A
    • 2005-11-04
    • JP2004128921
    • 2004-04-23
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KANDA ATSUHIKOUEDA DAISUKETANAKA TAKESHIUEMOTO YASUHIROHACHIMAN KAZUHIROTSURUMI NAOHIRO
    • H01L41/09H01L41/18H01L41/187H01L41/22H01L41/312H01L41/319H03H3/02H03H9/00H03H9/02H03H9/17
    • H03H3/02H03H9/02102H03H9/173H03H9/174H03H9/175H03H2003/021H03H2003/023H03H2003/025Y10T29/42Y10T156/10
    • PROBLEM TO BE SOLVED: To manufacture a resonator having a high performance by a good yield and a low cost by simplifying a manufacturing process of a complex resonator which must provide a sacrificial layer. SOLUTION: First, a YAG laser is irradiated at a resonator substrate 1 made of a silicon, and a through hole 1a is formed in the resonator substrate 1. Then, a buffer layer 3 made of a gallium nitride and a piezoelectric film 4 made of an aluminum nitride are deposited by an epitaxial growing method on a substrate 2 for formation made of a silicon carbide. Next, the piezoelectric film 4 is laminated on the main surface of the resonator substrate 1, and the structure that an air gap 1b is provided, is formed under the piezoelectric film 4. Further, the YAG laser is incident from the substrate 2 side for the formation, the buffer layer 3 is dissolved and the substrate 2 for the formation is exfoliated from the piezoelectric film 4. Finally, electrodes 4 made of molybdenum are formed on the upper and lower surfaces of the piezoelectric film 4 by using a method, such as a normal vacuum deposition, etc. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:通过简化必须提供牺牲层的复合谐振器的制造工艺,通过良好的产量和低成本制造具有高性能的谐振器。 解决方案:首先,在由硅制成的谐振器基板1上照射YAG激光器,并且在谐振器基板1中形成通孔1a。然后,将由氮化镓制成的缓冲层3和压电膜 4通过外延生长方法由氮化铝制成,用于由碳化硅制成的基板2。 接下来,在压电膜4的下方形成有在谐振器基板1的主面上形成压电膜4,设置有气隙1b的结构。此外,YAG激光从基板2侧入射, 形成时,缓冲层3被溶解,并且用于形成的基板2从压电膜4剥离。最后,通过使用这样的方法在压电膜4的上表面和下表面上形成由钼制成的电极4 作为正常的真空沉积等。版权所有(C)2006,JPO&NCIPI