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    • 52. 发明专利
    • Method for burying photoresist film
    • 曝光胶片的方法
    • JPS59171124A
    • 1984-09-27
    • JP4424683
    • 1983-03-18
    • Hitachi Ltd
    • NAKAMURA TOORUNAKAZATO KAZUOSUGASHIRO SHIYOUJIROUHONMA YOSHIOMIYAZAKI TAKAOKAMIYAMA TAKAMITSUOKABE TAKAHIRONAGATA MINORU
    • H01L21/302H01L21/3065
    • H01L21/302
    • PURPOSE:To simplify the flattening of the surface of a semiconductor substrate by a method wherein, when the semiconductor substrate having roughened surface is going to be flattened, photoresist is buried in the recessed part of the substrate. CONSTITUTION:A photoresist film 22 is provided in a large-sized recess part among the recessed parts generated on a semiconductor substrate 21 giving a little gap on the circumference while the surface is being made even, and an interlayer film 24 consisting of metal or Si is coated on the whole surface including the photoresist film 22 and the small-sized recessed part. Thus, the film 24 is adhered on the bottom face and the wall surface of the recessed part, and a photoresist film 23 is applied on the whole surface filling up the above-mentioned recessed part. Subsequently, an etching is performed until the surface 34 of the film 24 is exposed, and the surface of the substrate 21 is flattened leaving the resist film 23 in the recessed part. Through these procedures, the yield rate when an IC and the like is manufactured can be improved.
    • 目的:为了简化半导体衬底的表面的平坦化,其中当具有粗糙表面的半导体衬底将变平时,光致抗蚀剂被掩埋在衬底的凹陷部分中。 构成:在半导体基板21上产生的凹部中的大尺寸凹部中设置光致抗蚀剂膜22,在表面平坦化的同时在圆周上产生小的间隙,并且由金属或Si构成的中间膜24 涂覆在包括光致抗蚀剂膜22和小尺寸凹部的整个表面上。 因此,膜24粘附在凹部的底面和壁面上,并且在填充上述凹部的整个表面上涂布光致抗蚀剂膜23。 随后,进行蚀刻,直到膜24的表面34露出,并且使基板21的表面平坦化,使抗蚀剂膜23留在凹部中。 通过这些方法,可以提高制造IC等的成品率。
    • 53. 发明专利
    • Semiconductor device and manufacture thereof
    • 半导体器件及其制造
    • JPS59149053A
    • 1984-08-25
    • JP2274383
    • 1983-02-16
    • Hitachi Ltd
    • KANEKO KENJIOKADA YUTAKAOGURA SADAONISHIMURA TAKANORIKUDOU SATOSHINAGATA NOBORUOKABE TAKAHIRO
    • H01L21/8226H01L21/331H01L27/082H01L29/417H01L29/72H01L29/73
    • H01L29/72
    • PURPOSE:To form an emitter region and a thick oxide film region for isolating elements through a self-alignment method by one mask in order to remove a restriction on a distance between both a base electrode and an emitter electrode while preventing a short circuit between a collector and an emitter by using a metal as the base electrode and polycrystalline silicon as the emitter electrode in order to reduce base resistance. CONSTITUTION:An impurity is diffused to a P type base region 811 from a polycrystalline silicon layer 813 to form an emitter region 815. Both ends of the emitter region 815 are determined by thin oxide films 802 protruding from both ends of thick oxide films 808. Consequenly, a transistor of non-walled-emitter structure keeping a predetermined distance by interposing P type base regions 812 of shallow junctions between the emitter region 815 and the thick oxide films 808 for isolating elements can be obtained. The whole surface is oxidized to form oxide films 816 while an emitter is diffused, the oxide films 816 are removd partially while using photo-resist films 817 as masks, and base terminal extracting holes 818 are bored. Lastly, a metal 819 for a base terminal electrode is applied to form a pattern, and a bipolar transistor of structure in the figure (s) is acquired.
    • 目的:通过一个掩模通过自对准方法形成用于隔离元件的发射极区域和厚氧化膜区域,以便消除对基极和发射极之间的距离的限制,同时防止在 集电极和发射极通过使用金属作为基极和多晶硅作为发射电极,以降低基极电阻。 构成:杂质从多晶硅层813扩散到P型基极区域811以形成发射极区域815.发射极区域815的两端由从厚氧化膜808的两端突出的薄氧化膜802确定。 因此,可以获得通过在发射极区域815和用于隔离元件的厚氧化膜808之间插入浅结的P型基极区域812而保持预定距离的非壁 - 发射极结构的晶体管。 整个表面被氧化形成氧化物膜816,同时发射极扩散,氧化物膜816被部分地去除,同时使用光刻胶膜817作为掩模,并且基极端子提取孔818是无孔的。 最后,施加用于基极端子电极的金属819以形成图案,并且获得图中的结构的双极晶体管。
    • 54. 发明专利
    • Manufacture of semiconductor device
    • 半导体器件的制造
    • JPS5911644A
    • 1984-01-21
    • JP11994782
    • 1982-07-12
    • Hitachi Ltd
    • OKADA YUTAKAKANEKO KENJIYAMAZAKI KOUICHIOKABE TAKAHIRONAGATA MINORU
    • H01L21/8226H01L21/331H01L21/76H01L21/762H01L27/082H01L29/73H01L29/78
    • H01L21/76202
    • PURPOSE:To form a high density impurity region at the desired position on the circumferential part of an active area by a method wherein impurities are doped at the prescribed position on a semiconductor region by performing a self-alignment method using a mask material pattern as a mask, and a thick oxide film region is formed by performing a selective oxidation. CONSTITUTION:A P type region 13 can be formed on the circumference of the region which will be turned to the active area of a transistor when a thick oxide film 10 is formed at the part which is not covered by a nitride film 102 when an oxidation is performed. A P type base region 4 is formed by removing the nitride film 102. Besides, after an oxide film 11 has been deposited, an emitter region 5 is formed, and metal electrodes 7 and 8 for base and emitter are formed. As the region 13 is formed by performing a self-matching method, no increase is made in transistor area, thereby producing an excellent effect in a high degree. Besides, the impurities on the circumference of the base region 4 can be formed in high density by having the region 13.
    • 目的:通过使用掩模材料图案作为自对准方法进行自对准方法,通过在半导体区域上的规定位置掺杂杂质的方法,在有源区的圆周部分的期望位置处形成高密度杂质区域 掩模,并且通过进行选择性氧化形成厚的氧化膜区域。 构成:当氧化为氧化膜时,在未被氮化物膜102覆盖的部分形成厚氧化膜10时,AP型区域13可以形成在将被转向晶体管的有源区域的区域的圆周上 执行。 通过去除氮化物膜102来形成P型基区4.此外,在沉积氧化物膜11之后,形成发射区5,形成用于基极和发射极的金属电极7和8。 由于通过执行自匹配方法形成区域13,所以在晶体管区域中不会增加,从而在高度上产生优异的效果。 此外,通过具有区域13,可以高密度地形成基底区域4的圆周上的杂质。
    • 58. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS5873149A
    • 1983-05-02
    • JP17144481
    • 1981-10-28
    • HITACHI LTD
    • NAKAMURA TOORUNAKAZATO KAZUOOKADA YUTAKAOKABE TAKAHIRONAGATA MINORU
    • H01L21/8226H01L27/02H01L27/082
    • PURPOSE:To arbitrarily determine the switching speed of each transistor of the titled semiconductor device by a method wherein the current running to each transistor of an I L circuit is controlled by varying the width of the base region opposing to an injector. CONSTITUTION:Regions of n type 36, 361 and 362 are provided between a p type injector region 31 and a p type base region 32, and the current running into the region 32 is controlled. Besides, the aperture part of said regions is located in the vicinity of collector regions 33-35, and the lag time of each transistor TR is controlled by changing the length W1-W3. The I L circuit is operated, as shown in an aequivalent circuit, in the form wherein the collector region of a pnp TR is directly connected to the base of npn TR, because the base regions in the vicinity of each collector region are opposing to an injector region with the width of W1, W2 or W3. As a result, the resistance of the base is reduced, and the switching speed is increased even for the TR which is located farther than a base electrode 37. Also, if the W1 of the nearby TR is narrowed, a switching speed slower than the TR located in the distance can be obtained.