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    • 47. 发明专利
    • Cutting apparatus and cutting method
    • 切割装置和切割方法
    • JP2012051077A
    • 2012-03-15
    • JP2010196056
    • 2010-09-01
    • Hirata Corp平田機工株式会社
    • TANAKA TOSHIHARUKOSEKI YASUHISA
    • B26D1/18
    • B26D1/205B26D1/1575B26D1/185B26D7/1854B26D7/2621B26D7/2635B26F1/3826Y10T83/05Y10T83/7755Y10T83/7872
    • PROBLEM TO BE SOLVED: To cut a cover sheet along the linear end edge of a substrate, and to avoid damage to the end edge of the substrate.SOLUTION: A cutting apparatus includes: a disk blade for trimming the cover sheet along the linear end edge of the substrate; a driving means for rotating the disk blade; and a moving means for moving either of the driving means and the substrate so as to relatively move the disk blade along the linear end edge. The cutting apparatus further includes: a pivoting means for pivoting the disk blade about the axis perpendicular to the surface of the substrate and keeping the pivoted angle of the disk blade in order to adjust an angle formed of a plane which includes the linear end edge and is perpendicular to the surface of the substrate, and a plane formed of the disk blade; and a control means for controlling the moving means and the pivoting means.
    • 要解决的问题:沿着基板的直线端边缘切割覆盖片,并且避免损坏基板的端边缘。 解决方案:切割装置包括:盘片,用于沿着基片的直线端边缘修剪封面片; 用于旋转盘片的驱动装置; 以及用于使所述驱动装置和所述基板之一移动以便沿着所述线性端边缘相对移动所述盘片的移动装置。 切割装置还包括:枢转装置,用于围绕垂直于基板表面的轴线旋转盘片,并保持盘片的枢转角度,以便调整由包括直线端边缘和 垂直于基板的表面,以及由盘片形成的平面; 以及用于控制移动装置和枢转装置的控制装置。 版权所有(C)2012,JPO&INPIT